DE69930349D1 - Verfahren zum Mahlen von Silizium - Google Patents

Verfahren zum Mahlen von Silizium

Info

Publication number
DE69930349D1
DE69930349D1 DE69930349T DE69930349T DE69930349D1 DE 69930349 D1 DE69930349 D1 DE 69930349D1 DE 69930349 T DE69930349 T DE 69930349T DE 69930349 T DE69930349 T DE 69930349T DE 69930349 D1 DE69930349 D1 DE 69930349D1
Authority
DE
Germany
Prior art keywords
grinding silicon
grinding
silicon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69930349T
Other languages
English (en)
Other versions
DE69930349T2 (de
Inventor
Thomas Alva Bush
John Eric Herman
Ollie William Marko
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Silicones Corp
Original Assignee
Dow Corning Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Corp filed Critical Dow Corning Corp
Publication of DE69930349D1 publication Critical patent/DE69930349D1/de
Application granted granted Critical
Publication of DE69930349T2 publication Critical patent/DE69930349T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B02—CRUSHING, PULVERISING, OR DISINTEGRATING; PREPARATORY TREATMENT OF GRAIN FOR MILLING
    • B02C—CRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL; MILLING GRAIN
    • B02C23/00—Auxiliary methods or auxiliary devices or accessories specially adapted for crushing or disintegrating not provided for in preceding groups or not specially adapted to apparatus covered by a single preceding group
    • B02C23/06—Selection or use of additives to aid disintegrating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/02—Silicon

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Food Science & Technology (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Disintegrating Or Milling (AREA)
  • Silicon Compounds (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
DE69930349T 1998-05-26 1999-05-20 Verfahren zum Mahlen von Silizium Expired - Lifetime DE69930349T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US84275 1998-05-26
US09/084,275 US6019667A (en) 1998-05-26 1998-05-26 Method for grinding silicon metalloid

Publications (2)

Publication Number Publication Date
DE69930349D1 true DE69930349D1 (de) 2006-05-11
DE69930349T2 DE69930349T2 (de) 2006-11-30

Family

ID=22183914

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69930349T Expired - Lifetime DE69930349T2 (de) 1998-05-26 1999-05-20 Verfahren zum Mahlen von Silizium

Country Status (4)

Country Link
US (1) US6019667A (de)
EP (1) EP0960655B1 (de)
JP (1) JP4268725B2 (de)
DE (1) DE69930349T2 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BR9805844A (pt) * 1998-12-29 2001-03-20 Dow Corning Do Brasil Ltda Composição de clìnquer, método para melhorar a eficiência de moagem de clìnquer e cimento
BR9805843A (pt) * 1998-12-29 2002-01-29 Dow Corning Do Brasil Ltda Composição de escória, método para melhorar a eficiência de moagem de escória e cimento
JP3941284B2 (ja) * 1999-04-13 2007-07-04 株式会社日立製作所 研磨方法
FR2809719B1 (fr) * 2000-05-30 2002-07-12 Invensil Poudre de silicium pour la preparation des alkyl - ou aryl-halogenosilanes
US6635109B1 (en) 2002-08-20 2003-10-21 Dow Corning Corporation Process for making cements with silicon containing grinding aids
FR2863914B1 (fr) * 2003-12-22 2006-05-26 Rhodia Chimie Sa Utilisation d'acide adipique a titre d'agent de mouturage dans le broyage a sec de materiaux mineraux
CN101108897B (zh) * 2007-08-31 2010-10-06 田欣利 硅系陶瓷高效磨削液
US8894731B2 (en) * 2007-10-01 2014-11-25 Saint-Gobain Abrasives, Inc. Abrasive processing of hard and /or brittle materials
WO2009125370A1 (en) * 2008-04-09 2009-10-15 University Of Cape Town Method of producing stable oxygen terminated semiconducting nanoparticles
KR101269498B1 (ko) * 2008-07-02 2013-06-07 생-고벵 아브라시프 전자 산업용 연마 슬라이싱 공구
US8813585B2 (en) * 2011-10-03 2014-08-26 Saudi Arabian Oil Company Automated method for quality control and quality assurance of sized bridging material
JP6599745B2 (ja) * 2015-12-02 2019-10-30 光 小林 シリコン微細粒子の製造方法並びにその製造装置、並びにシリコン微細粒子
CN106587669B (zh) * 2016-12-12 2018-12-21 廊坊天盛环保建材科技有限公司 一种低密度粉磨体在矿渣粉磨中的应用
JP7396009B2 (ja) 2019-12-10 2023-12-12 三菱マテリアル株式会社 シリコン微粒子及びその製造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3604634A (en) * 1969-10-28 1971-09-14 English Clays Lovering Pochin Comminution of solid materials
US4162045A (en) * 1976-05-19 1979-07-24 The Dow Chemical Company Ore grinding process
US4162044A (en) * 1976-05-19 1979-07-24 The Dow Chemical Company Process for grinding coal or ores in a liquid medium
US4274599A (en) * 1977-11-21 1981-06-23 The Dow Chemical Company Ore grinding process including a grinding aid of an anionic polyelectrolyte
US4486567A (en) * 1983-03-14 1984-12-04 Dow Corning Corporation Method of polymerizing hydroxyl endblocked polydiorganosiloxane using quaternary ammonium carboxylate-carboxylic acid catalyst
SU1257164A1 (ru) * 1984-10-25 1986-09-15 Всесоюзный научно-исследовательский институт по креплению скважин и буровым растворам Способ приготовлени в жущего
EP0336453B1 (de) * 1985-08-01 1993-12-22 Ecc International Limited Verfahren zum Zerkleinern von Material
US5131600A (en) * 1989-02-13 1992-07-21 The Dow Chemical Company Alkanol amine grinding aids
FR2671546B1 (fr) * 1991-01-11 1993-03-12 Pechiney Electrometallurgie Poudre de silicium metallurgique a faible oxydation superficielle.
DE69228487T2 (de) * 1991-12-20 1999-09-02 Minnesota Mining And Mfg. Co. Ueberzogenes schleifband mit endlosem, verbandfreiem traeger und herstellungsverfahren
JP3179570B2 (ja) * 1992-05-22 2001-06-25 東レ・ダウコーニング・シリコーン株式会社 熱可塑性樹脂改質用粉末
US5312948A (en) * 1993-10-08 1994-05-17 Dow Corning Corporation Particle size distribution for fluidized-bed process for making alkylhalosilanes
DE69523971T2 (de) * 1994-04-18 2002-08-29 Eastman Kodak Co., Rochester Stabile wässrige Festteilchen-Dispersionen
US5620632A (en) * 1995-04-25 1997-04-15 Eastman Kodak Company Dispersions of epoxy scavengers exhibiting improved raw stock keeping
US5624079A (en) * 1995-03-10 1997-04-29 Xerox Corporation Injection blending of toner during grinding
KR100417748B1 (ko) * 1995-06-06 2004-05-31 고토부키 기켄 고교 가부시키가이샤 습식 교반 볼 밀 및 분쇄 방법

Also Published As

Publication number Publication date
EP0960655B1 (de) 2006-03-15
JP4268725B2 (ja) 2009-05-27
US6019667A (en) 2000-02-01
EP0960655A2 (de) 1999-12-01
DE69930349T2 (de) 2006-11-30
EP0960655A3 (de) 2001-04-11
JP2000024541A (ja) 2000-01-25

Similar Documents

Publication Publication Date Title
DE59814043D1 (de) Verfahren zum anisotropen ätzen von silizium
DE60003835D1 (de) Verfahren zum schleifen von kurbelzapfen
DE69927111D1 (de) Verfahren und Vorrichtung zum Polieren von Substraten
DE60044330D1 (de) Verfahren und system zum polieren von halbleiterscheiben
DE69718142D1 (de) Verfahren zum ätzen von halbleiterscheiben
DE69736646D1 (de) Verfahren zum Zertrennen von Wafern in Einzelchips
DE19580932T1 (de) Verfahren und Vorrichtung zum Polieren von Wafern
DE59813317D1 (de) Verfahren zum Abfräsen von Verkehrsflächen
DE69827657D1 (de) Verfahren zum trennen von aromaten
DE59704120D1 (de) Verfahren und Vorrichtung zum Polieren von Halbleiterscheiben
DE60005168D1 (de) Verfahren zum schleifen von glas
DE59802824D1 (de) Verfahren und Vorrichtung zum Polieren von Halbleiterscheiben
DE60014994D1 (de) Verfahren und Vorrichtung zum Polieren von Halbleiterscheiben
DE69825143D1 (de) Vorrichtung zum polieren
DE69926436D1 (de) Verfahren zum Entfernen von Leukozyten
DE69904074D1 (de) Verfahren und vorrichtung zum polieren von halbleiterscheiben
ATA165897A (de) Verfahren zum planarisieren von halbleitersubstraten
DE50014779D1 (de) Verfahren zum anisotropen plasmaätzen von halbleitern
DE69910464D1 (de) Verfahren zum Verbinden von unterschiedlichen Elementen
DE60021149D1 (de) Verfahren und Vorrichtung zum Polieren
DE50015423D1 (de) Verfahren zum plasmaätzen von silizium
DE69930349D1 (de) Verfahren zum Mahlen von Silizium
DE60136355D1 (de) Verfahren zum entwickeln von werkzeugen
DE19882439T1 (de) Verfahren und Vorrichtungen zum Aufbereiten von Schleifsteinen
DE69730979D1 (de) Verfahren zum entwerfen von luftreifen

Legal Events

Date Code Title Description
8364 No opposition during term of opposition