DE69732065D1 - Verfahren zur Herstellung eines monolithischen keramischen Kondensators - Google Patents

Verfahren zur Herstellung eines monolithischen keramischen Kondensators

Info

Publication number
DE69732065D1
DE69732065D1 DE69732065T DE69732065T DE69732065D1 DE 69732065 D1 DE69732065 D1 DE 69732065D1 DE 69732065 T DE69732065 T DE 69732065T DE 69732065 T DE69732065 T DE 69732065T DE 69732065 D1 DE69732065 D1 DE 69732065D1
Authority
DE
Germany
Prior art keywords
preparation
ceramic capacitor
monolithic ceramic
monolithic
capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69732065T
Other languages
English (en)
Other versions
DE69732065T2 (de
Inventor
Norihiko Sakamoto
Harunobu Sano
Takaharu Miyazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Application granted granted Critical
Publication of DE69732065D1 publication Critical patent/DE69732065D1/de
Publication of DE69732065T2 publication Critical patent/DE69732065T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Inorganic Insulating Materials (AREA)
DE69732065T 1996-07-25 1997-07-23 Verfahren zur Herstellung eines monolithischen keramischen Kondensators Expired - Lifetime DE69732065T2 (de)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP19624296 1996-07-25
JP19624296 1996-07-25
JP9561597 1997-04-14
JP9561597 1997-04-14
JP18290397 1997-07-09
JP9182903A JPH113834A (ja) 1996-07-25 1997-07-09 積層セラミックコンデンサおよびその製造方法

Publications (2)

Publication Number Publication Date
DE69732065D1 true DE69732065D1 (de) 2005-02-03
DE69732065T2 DE69732065T2 (de) 2005-06-02

Family

ID=27307868

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69732065T Expired - Lifetime DE69732065T2 (de) 1996-07-25 1997-07-23 Verfahren zur Herstellung eines monolithischen keramischen Kondensators

Country Status (8)

Country Link
US (1) US5835339A (de)
EP (1) EP0821377B1 (de)
JP (1) JPH113834A (de)
KR (1) KR100272424B1 (de)
CN (1) CN1097834C (de)
CA (1) CA2211259C (de)
DE (1) DE69732065T2 (de)
MY (1) MY116937A (de)

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DE19630883A1 (de) * 1996-07-31 1998-02-05 Philips Patentverwaltung Bauteil mit einem Kondensator
US6485672B1 (en) 1999-02-26 2002-11-26 Tdk Corporation Method of manufacturing dielectric ceramic composition and electronic device containing dielectric layer
JP2000269066A (ja) * 1999-03-19 2000-09-29 Taiyo Yuden Co Ltd 積層セラミックコンデンサ
DE19918091A1 (de) * 1999-04-21 2000-10-26 Epcos Ag Reduktionsstabile X7R-Keramikkondensatoren mit Ni-Innenelektroden
JP3596743B2 (ja) * 1999-08-19 2004-12-02 株式会社村田製作所 積層セラミック電子部品の製造方法及び積層セラミック電子部品
DE19945014C1 (de) * 1999-09-20 2001-03-01 Epcos Ag Reduktionsstabile X7R-Keramikmasse und ihre Verwendung
US6262877B1 (en) * 1999-11-23 2001-07-17 Intel Corporation Low inductance high capacitance capacitor and method of making same
JP3498211B2 (ja) * 1999-12-10 2004-02-16 株式会社村田製作所 積層型半導体セラミック電子部品
TW508600B (en) * 2000-03-30 2002-11-01 Taiyo Yuden Kk Laminated ceramic capacitor and its manufacturing method
JP3417911B2 (ja) 2000-08-21 2003-06-16 ティーディーケイ株式会社 誘電体磁器組成物の製造方法と誘電体層含有電子部品の製造方法
JP4691807B2 (ja) * 2001-03-08 2011-06-01 株式会社村田製作所 積層セラミックコンデンサ
TWI223291B (en) * 2001-10-25 2004-11-01 Matsushita Electric Ind Co Ltd Laminated ceramic electronic component and method of manufacturing the same
US7054136B2 (en) * 2002-06-06 2006-05-30 Avx Corporation Controlled ESR low inductance multilayer ceramic capacitor
US6954350B2 (en) * 2002-10-15 2005-10-11 Matsushita Electric Industrial Co., Ltd. Ceramic layered product and method for manufacturing the same
WO2004040604A1 (ja) * 2002-10-30 2004-05-13 Mitsui Mining & Smelting Co.,Ltd. キャパシタ層形成用の誘電体層付銅箔並びにその誘電体層付銅箔を用いたキャパシタ層形成用の銅張積層板及びそのキャパシタ層形成用の誘電体層付銅箔の製造方法
JP4776913B2 (ja) * 2004-01-08 2011-09-21 Ｔｄｋ株式会社 積層型セラミックコンデンサ及びその製造方法
WO2006022060A1 (ja) * 2004-08-27 2006-03-02 Murata Manufacturing Co., Ltd. 積層セラミックコンデンサおよびその等価直列抵抗調整方法
JP4295179B2 (ja) * 2004-08-31 2009-07-15 Ｔｄｋ株式会社 電子部品およびその製造方法
US7277269B2 (en) * 2004-11-29 2007-10-02 Kemet Electronics Corporation Refractory metal nickel electrodes for capacitors
JP4747604B2 (ja) * 2005-02-18 2011-08-17 Ｔｄｋ株式会社 セラミック電子部品
JP3918851B2 (ja) * 2005-06-03 2007-05-23 株式会社村田製作所 積層型電子部品および積層型電子部品の製造方法
JP4074299B2 (ja) * 2005-04-14 2008-04-09 Ｔｄｋ株式会社 積層型チップバリスタ
TWI245323B (en) * 2005-04-15 2005-12-11 Inpaq Technology Co Ltd Glaze cladding structure of chip device and its formation method
JP4788960B2 (ja) * 2006-03-10 2011-10-05 Ｔｄｋ株式会社 セラミック粉末及びこれを用いた誘電体ペースト、積層セラミック電子部品、その製造方法
JP4827011B2 (ja) * 2006-03-10 2011-11-30 Ｔｄｋ株式会社 セラミック粉末及びこれを用いた誘電体ペースト、積層セラミック電子部品、その製造方法
JP5217609B2 (ja) * 2008-05-12 2013-06-19 株式会社村田製作所 積層セラミック電子部品およびその製造方法
KR101079478B1 (ko) 2009-12-30 2011-11-03 삼성전기주식회사 적층 세라믹 커패시터 및 그 제조방법
JP5534942B2 (ja) * 2010-05-26 2014-07-02 京セラ株式会社 積層セラミックコンデンサ
JP5534976B2 (ja) * 2010-06-28 2014-07-02 京セラ株式会社 積層セラミックコンデンサ
JP5224074B2 (ja) 2010-08-04 2013-07-03 株式会社村田製作所 誘電体セラミック、及び積層セラミックコンデンサ
EP2661763A1 (de) * 2011-01-04 2013-11-13 OC Oerlikon Balzers AG Verfahren zur herstellung von leistungsstarken mehrschichtigen keramikkondensatoren
KR101525643B1 (ko) * 2011-05-20 2015-06-03 삼성전기주식회사 적층형 세라믹 전자부품
JP5641139B2 (ja) * 2011-06-17 2014-12-17 株式会社村田製作所 積層セラミック電子部品、および積層セラミック電子部品の製造方法
JP6242337B2 (ja) * 2011-11-16 2017-12-06 スチュアート，マーティン，エー． 高エネルギー密度蓄電装置
KR101288151B1 (ko) * 2011-11-25 2013-07-19 삼성전기주식회사 적층 세라믹 전자부품 및 그 제조방법
JP6168721B2 (ja) * 2012-01-20 2017-07-26 株式会社村田製作所 積層セラミック電子部品およびその製造方法
KR101531083B1 (ko) * 2012-12-26 2015-06-24 삼성전기주식회사 적층형 세라믹 콘덴서
KR101462761B1 (ko) * 2013-02-13 2014-11-20 삼성전기주식회사 다층 세라믹 소자 및 그 제조 방법
KR102105384B1 (ko) * 2018-07-19 2020-04-28 삼성전기주식회사 적층형 커패시터
JP7176494B2 (ja) * 2019-08-28 2022-11-22 株式会社村田製作所 積層型電子部品
KR20220066522A (ko) * 2020-11-16 2022-05-24 삼성전기주식회사 전자 부품 및 그 제조 방법
KR20230117793A (ko) * 2022-02-03 2023-08-10 삼성전기주식회사 적층형 전자 부품
CN116741534A (zh) * 2023-07-26 2023-09-12 广东微容电子科技有限公司 一种片式多层陶瓷电容器及其制备方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2646573B2 (ja) * 1987-09-07 1997-08-27 株式会社村田製作所 半導体積層コンデンサの製造方法
JPH0817139B2 (ja) * 1988-11-30 1996-02-21 太陽誘電株式会社 積層磁器コンデンサ
JPH0666219B2 (ja) * 1989-02-22 1994-08-24 株式会社村田製作所 積層セラミックスコンデンサ
JP2800017B2 (ja) * 1989-04-05 1998-09-21 株式会社村田製作所 積層セラミックスコンデンサ
US5088003A (en) * 1989-08-24 1992-02-11 Tosoh Corporation Laminated silicon oxide film capacitors and method for their production
DE69027394T2 (de) * 1989-10-18 1997-02-06 Tdk Corp Keramischer Mehrschicht-Chipkondensator und Verfahren zu seiner Herstellung
JP3207846B2 (ja) * 1989-10-18 2001-09-10 ティーディーケイ株式会社 積層型セラミックチップコンデンサおよびその製造方法
JPH07118431B2 (ja) * 1991-03-16 1995-12-18 太陽誘電株式会社 磁器コンデンサ及びその製造方法
JP2787746B2 (ja) * 1992-03-27 1998-08-20 ティーディーケイ株式会社 積層型セラミックチップコンデンサ
KR100192563B1 (ko) * 1995-01-12 1999-06-15 무라따 야스따까 모놀리식 세라믹 커패시터
JPH097877A (ja) * 1995-04-18 1997-01-10 Rohm Co Ltd 多層セラミックチップ型コンデンサ及びその製造方法

Also Published As

Publication number Publication date
CN1175069A (zh) 1998-03-04
KR100272424B1 (ko) 2000-11-15
EP0821377A2 (de) 1998-01-28
EP0821377B1 (de) 2004-12-29
JPH113834A (ja) 1999-01-06
EP0821377A3 (de) 1999-04-28
CN1097834C (zh) 2003-01-01
CA2211259C (en) 2000-10-03
DE69732065T2 (de) 2005-06-02
KR980012418A (ko) 1998-04-30
US5835339A (en) 1998-11-10
CA2211259A1 (en) 1998-01-25
MY116937A (en) 2004-04-30

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Legal Events

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8364 No opposition during term of opposition