DE69730388D1 - Metall-Keramik-Substrate von hoher Zuverlässigkeit für Halbleiter - Google Patents
Metall-Keramik-Substrate von hoher Zuverlässigkeit für HalbleiterInfo
- Publication number
- DE69730388D1 DE69730388D1 DE69730388T DE69730388T DE69730388D1 DE 69730388 D1 DE69730388 D1 DE 69730388D1 DE 69730388 T DE69730388 T DE 69730388T DE 69730388 T DE69730388 T DE 69730388T DE 69730388 D1 DE69730388 D1 DE 69730388D1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductors
- metal
- high reliability
- ceramic substrates
- substrates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000919 ceramic Substances 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
- C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
- C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/15—Ceramic or glass substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/12—Metallic interlayers
- C04B2237/124—Metallic interlayers based on copper
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/12—Metallic interlayers
- C04B2237/125—Metallic interlayers based on noble metals, e.g. silver
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/12—Metallic interlayers
- C04B2237/126—Metallic interlayers wherein the active component for bonding is not the largest fraction of the interlayer
- C04B2237/127—The active component for bonding being a refractory metal
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/34—Oxidic
- C04B2237/343—Alumina or aluminates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/36—Non-oxidic
- C04B2237/366—Aluminium nitride
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/40—Metallic
- C04B2237/407—Copper
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/098—Special shape of the cross-section of conductors, e.g. very thick plated conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09845—Stepped hole, via, edge, bump or conductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Structural Engineering (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Ceramic Products (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24407696 | 1996-08-27 | ||
JP24407696 | 1996-08-27 | ||
JP08438997A JP3512977B2 (ja) | 1996-08-27 | 1997-03-18 | 高信頼性半導体用基板 |
JP8438997 | 1997-03-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69730388D1 true DE69730388D1 (de) | 2004-09-30 |
DE69730388T2 DE69730388T2 (de) | 2005-09-01 |
Family
ID=26425436
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69730388T Expired - Lifetime DE69730388T2 (de) | 1996-08-27 | 1997-08-27 | Metall-Keramik-Substrate von hoher Zuverlässigkeit für Halbleiter |
Country Status (4)
Country | Link |
---|---|
US (1) | US6054762A (de) |
EP (2) | EP1453089B1 (de) |
JP (1) | JP3512977B2 (de) |
DE (1) | DE69730388T2 (de) |
Families Citing this family (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0935286A4 (de) | 1997-05-26 | 2008-04-09 | Sumitomo Electric Industries | Kupfer-schaltungsverbindungssubstrat und seine herstellung |
US6222261B1 (en) * | 1999-05-03 | 2001-04-24 | The United States Of America As Represented By The Secretary Of The Army | Barrier layers for thin film electronic materials |
DE19927046B4 (de) * | 1999-06-14 | 2007-01-25 | Electrovac Ag | Keramik-Metall-Substrat als Mehrfachsubstrat |
EP1818980A3 (de) * | 1999-06-22 | 2010-08-11 | Infineon Technologies AG | Substrat für Hochspannungsmodule |
JP4158288B2 (ja) * | 1999-08-31 | 2008-10-01 | 三菱電機株式会社 | 半導体モジュール |
JP2001156413A (ja) * | 1999-11-26 | 2001-06-08 | Sumitomo Electric Ind Ltd | 銅回路接合基板及びその製造方法 |
WO2002013267A1 (fr) * | 2000-08-09 | 2002-02-14 | Mitsubishi Materials Corporation | Module de puissance pouvant comporter un dissipateur thermique |
JP4756200B2 (ja) | 2000-09-04 | 2011-08-24 | Dowaメタルテック株式会社 | 金属セラミックス回路基板 |
DE10158185B4 (de) * | 2000-12-20 | 2005-08-11 | Semikron Elektronik Gmbh | Leistungshalbleitermodul mit hoher Isolationsfestigkeit |
JP4168114B2 (ja) * | 2001-09-28 | 2008-10-22 | Dowaホールディングス株式会社 | 金属−セラミックス接合体 |
JP4811756B2 (ja) * | 2001-09-28 | 2011-11-09 | Dowaメタルテック株式会社 | 金属−セラミックス接合回路基板の製造方法 |
JP3648189B2 (ja) * | 2001-09-28 | 2005-05-18 | 同和鉱業株式会社 | 金属−セラミックス回路基板 |
US6936337B2 (en) | 2001-09-28 | 2005-08-30 | Dowa Mining Co., Ltd. | Metal/ceramic circuit board |
DE10212495B4 (de) | 2002-03-21 | 2004-02-26 | Schulz-Harder, Jürgen, Dr.-Ing. | Verfahren zum Herstellen eines Metall-Keramik-Substrats, vorzugsweise eines Kupfer-Keramik-Substrats |
DE50307323D1 (de) * | 2002-03-13 | 2007-07-05 | Electrovac Ag | Verfahren zum herstellen eines metal-keramik-subtrats, vorzugsweise eines kupfer-keramik-substrats |
JP3863067B2 (ja) * | 2002-06-04 | 2006-12-27 | Dowaホールディングス株式会社 | 金属−セラミックス接合体の製造方法 |
JP3868854B2 (ja) * | 2002-06-14 | 2007-01-17 | Dowaホールディングス株式会社 | 金属−セラミックス接合体およびその製造方法 |
JP4401096B2 (ja) * | 2003-03-26 | 2010-01-20 | Dowaホールディングス株式会社 | 回路基板の製造方法 |
JP4394477B2 (ja) * | 2003-03-27 | 2010-01-06 | Dowaホールディングス株式会社 | 金属−セラミックス接合基板の製造方法 |
JP5299160B2 (ja) * | 2003-03-27 | 2013-09-25 | Dowaメタルテック株式会社 | 金属−セラミックス接合基板の製造方法 |
JP4127131B2 (ja) * | 2003-06-25 | 2008-07-30 | 松下電工株式会社 | 調光装置 |
US7532481B2 (en) * | 2004-04-05 | 2009-05-12 | Mitsubishi Materials Corporation | Al/AlN joint material, base plate for power module, power module, and manufacturing method of Al/AlN joint material |
US8563869B2 (en) | 2005-08-29 | 2013-10-22 | Hitachi Metals, Ltd. | Circuit board and semiconductor module using this, production method for circuit board |
DE102009033029A1 (de) | 2009-07-02 | 2011-01-05 | Electrovac Ag | Elektronische Vorrichtung |
DE102010039728A1 (de) * | 2010-08-25 | 2012-03-01 | Robert Bosch Gmbh | Verfahren zur Herstellung einer elektrischen Schaltung und elektrischen Schaltung |
DE102011103746A1 (de) | 2011-05-31 | 2012-12-06 | Ixys Semiconductor Gmbh | Verfahren zum Fügen von Metall-Keramik-Substraten an Metallkörpern |
CN104011852B (zh) * | 2011-12-20 | 2016-12-21 | 株式会社东芝 | 陶瓷铜电路基板和使用了陶瓷铜电路基板的半导体装置 |
DE102013102637B4 (de) * | 2013-03-14 | 2017-08-31 | Rogers Germany Gmbh | Metall-Keramik-Substrat sowie Verfahren zum Herstellen eines derartigen Metall-Keramik-Substrates und Anordnung von derartigen Metall-Keramik-Substraten |
DE102013104739B4 (de) * | 2013-03-14 | 2022-10-27 | Rogers Germany Gmbh | Metall-Keramik-Substrate sowie Verfahren zum Herstellen eines Metall-Keramik-Substrates |
US10104783B2 (en) * | 2013-08-29 | 2018-10-16 | Hitachi Metals, Ltd. | Method for producing ceramic circuit board |
JP6218856B2 (ja) * | 2013-12-24 | 2017-10-25 | 三菱電機株式会社 | 電力変換装置 |
WO2015104954A1 (ja) * | 2014-01-10 | 2015-07-16 | 古河電気工業株式会社 | 電子回路装置 |
EP3121157B1 (de) * | 2014-03-20 | 2019-03-20 | Mitsubishi Materials Corporation | Verbundener körper, substrat für leistungsmodule, leistungsmodul und verfahren zur herstellung eines verbundenen körpers |
CN105880532A (zh) * | 2014-10-28 | 2016-08-24 | 廖树汉 | 重量比铝轻价格降低过半代替钢板的钢瓷复合板 |
TWI553154B (zh) * | 2015-11-03 | 2016-10-11 | Nat Inst Chung Shan Science & Technology | A structure for improving the interfacial stress of aluminum nitride substrate and copper coating |
CN109156080B (zh) | 2016-05-16 | 2021-10-08 | 株式会社村田制作所 | 陶瓷电子部件 |
WO2018089745A1 (en) * | 2016-11-11 | 2018-05-17 | The Regents Of The University Of Colorado, A Body Corporate | Improved stability of refractory materials in high temperature steam |
JP6799479B2 (ja) * | 2017-03-03 | 2020-12-16 | Dowaメタルテック株式会社 | 金属−セラミックス回路基板の製造方法 |
DE102017215048A1 (de) * | 2017-08-29 | 2019-02-28 | Conti Temic Microelectronic Gmbh | Schaltungsträger für Leistungselektronik und Leistungselektronikmodul mit einem Schaltungsträger |
JP7221401B2 (ja) * | 2019-08-29 | 2023-02-13 | 京セラ株式会社 | 電気回路基板及びパワーモジュール |
JP2022024309A (ja) | 2020-07-15 | 2022-02-09 | Dowaメタルテック株式会社 | 絶縁基板およびその製造方法 |
CN112638046B (zh) * | 2020-12-25 | 2023-12-15 | 合肥圣达电子科技实业有限公司 | 一种蚀刻制备高可靠陶瓷覆铜的方法 |
JP2023147241A (ja) * | 2022-03-29 | 2023-10-12 | 株式会社プロテリアル | セラミックス基板 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4837408A (en) * | 1987-05-21 | 1989-06-06 | Ngk Spark Plug Co., Ltd. | High density multilayer wiring board and the manufacturing thereof |
EP0322434B1 (de) * | 1987-07-03 | 1993-10-20 | DODUCO GMBH + Co Dr. Eugen DÀ¼rrwächter | Flacher körper, insbesondere zur verwendung als wärmesenke für elektronische leistungsbauelemente |
JPS6459986A (en) * | 1987-08-31 | 1989-03-07 | Toshiba Corp | Ceramic circuit board |
DE3922485C1 (de) * | 1989-07-08 | 1990-06-13 | Doduco Gmbh + Co Dr. Eugen Duerrwaechter, 7530 Pforzheim, De | |
JP2712778B2 (ja) * | 1990-07-16 | 1998-02-16 | 昭和電工株式会社 | 金属・セラミックス複合基板の製造方法 |
US5328751A (en) * | 1991-07-12 | 1994-07-12 | Kabushiki Kaisha Toshiba | Ceramic circuit board with a curved lead terminal |
JPH05347469A (ja) * | 1992-06-12 | 1993-12-27 | Toshiba Corp | セラミックス回路基板 |
US5751059A (en) * | 1992-06-19 | 1998-05-12 | Thomson-Csf Semiconducteurs Specifiques | Pyroelectric sensor |
JPH0685154A (ja) * | 1992-09-07 | 1994-03-25 | Hitachi Ltd | 半導体集積回路装置 |
DE4318241C2 (de) * | 1993-06-02 | 1995-06-29 | Schulz Harder Juergen | Metallbeschichtetes Substrat mit verbesserter Widerstandsfähigkeit gegen Temperaturwechselbeanspruchung |
JPH0777989A (ja) * | 1993-06-18 | 1995-03-20 | Kubota Corp | エンジン騒音の低減装置 |
JPH0793326A (ja) * | 1993-09-21 | 1995-04-07 | Toshiba Corp | マルチメディア処理装置及びマルチメディア処理方法 |
JP3316714B2 (ja) * | 1994-05-31 | 2002-08-19 | 三菱電機株式会社 | 半導体装置 |
US5542175A (en) * | 1994-12-20 | 1996-08-06 | International Business Machines Corporation | Method of laminating and circuitizing substrates having openings therein |
EP0789397B1 (de) * | 1996-02-07 | 2004-05-06 | Hitachi, Ltd. | Schaltungsplatine und Halbleiterbauteil mit dieser |
-
1997
- 1997-03-18 JP JP08438997A patent/JP3512977B2/ja not_active Expired - Lifetime
- 1997-08-25 US US08/917,327 patent/US6054762A/en not_active Expired - Lifetime
- 1997-08-27 EP EP04012282A patent/EP1453089B1/de not_active Expired - Lifetime
- 1997-08-27 DE DE69730388T patent/DE69730388T2/de not_active Expired - Lifetime
- 1997-08-27 EP EP97810603A patent/EP0827198B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1453089A2 (de) | 2004-09-01 |
EP1453089B1 (de) | 2013-02-20 |
DE69730388T2 (de) | 2005-09-01 |
EP1453089A3 (de) | 2004-09-08 |
US6054762A (en) | 2000-04-25 |
EP0827198A2 (de) | 1998-03-04 |
EP0827198A3 (de) | 1998-07-15 |
JP3512977B2 (ja) | 2004-03-31 |
EP0827198B1 (de) | 2004-08-25 |
JPH10125821A (ja) | 1998-05-15 |
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