DE69730388D1 - Metall-Keramik-Substrate von hoher Zuverlässigkeit für Halbleiter - Google Patents

Metall-Keramik-Substrate von hoher Zuverlässigkeit für Halbleiter

Info

Publication number
DE69730388D1
DE69730388D1 DE69730388T DE69730388T DE69730388D1 DE 69730388 D1 DE69730388 D1 DE 69730388D1 DE 69730388 T DE69730388 T DE 69730388T DE 69730388 T DE69730388 T DE 69730388T DE 69730388 D1 DE69730388 D1 DE 69730388D1
Authority
DE
Germany
Prior art keywords
semiconductors
metal
high reliability
ceramic substrates
substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69730388T
Other languages
English (en)
Other versions
DE69730388T2 (de
Inventor
Masami Sakuraba
Masami Kimura
Junji Nakamura
Masaya Takahara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dowa Holdings Co Ltd
Original Assignee
Dowa Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dowa Mining Co Ltd filed Critical Dowa Mining Co Ltd
Publication of DE69730388D1 publication Critical patent/DE69730388D1/de
Application granted granted Critical
Publication of DE69730388T2 publication Critical patent/DE69730388T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/026Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/12Mountings, e.g. non-detachable insulating substrates
    • H01L23/13Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/12Mountings, e.g. non-detachable insulating substrates
    • H01L23/14Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15Ceramic or glass substrates
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0271Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12Metallic interlayers
    • C04B2237/124Metallic interlayers based on copper
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12Metallic interlayers
    • C04B2237/125Metallic interlayers based on noble metals, e.g. silver
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12Metallic interlayers
    • C04B2237/126Metallic interlayers wherein the active component for bonding is not the largest fraction of the interlayer
    • C04B2237/127The active component for bonding being a refractory metal
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32Ceramic
    • C04B2237/34Oxidic
    • C04B2237/343Alumina or aluminates
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32Ceramic
    • C04B2237/36Non-oxidic
    • C04B2237/366Aluminium nitride
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40Metallic
    • C04B2237/407Copper
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/70Forming laminates or joined articles comprising layers of a specific, unusual thickness
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0306Inorganic insulating substrates, e.g. ceramic, glass
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0335Layered conductors or foils
    • H05K2201/0355Metal foils
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09145Edge details
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/098Special shape of the cross-section of conductors, e.g. very thick plated conductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845Stepped hole, via, edge, bump or conductor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Structural Engineering (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Ceramic Products (AREA)
DE69730388T 1996-08-27 1997-08-27 Metall-Keramik-Substrate von hoher Zuverlässigkeit für Halbleiter Expired - Lifetime DE69730388T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP24407696 1996-08-27
JP24407696 1996-08-27
JP08438997A JP3512977B2 (ja) 1996-08-27 1997-03-18 高信頼性半導体用基板
JP8438997 1997-03-18

Publications (2)

Publication Number Publication Date
DE69730388D1 true DE69730388D1 (de) 2004-09-30
DE69730388T2 DE69730388T2 (de) 2005-09-01

Family

ID=26425436

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69730388T Expired - Lifetime DE69730388T2 (de) 1996-08-27 1997-08-27 Metall-Keramik-Substrate von hoher Zuverlässigkeit für Halbleiter

Country Status (4)

Country Link
US (1) US6054762A (de)
EP (2) EP1453089B1 (de)
JP (1) JP3512977B2 (de)
DE (1) DE69730388T2 (de)

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EP0935286A4 (de) 1997-05-26 2008-04-09 Sumitomo Electric Industries Kupfer-schaltungsverbindungssubstrat und seine herstellung
US6222261B1 (en) * 1999-05-03 2001-04-24 The United States Of America As Represented By The Secretary Of The Army Barrier layers for thin film electronic materials
DE19927046B4 (de) * 1999-06-14 2007-01-25 Electrovac Ag Keramik-Metall-Substrat als Mehrfachsubstrat
EP1818980A3 (de) * 1999-06-22 2010-08-11 Infineon Technologies AG Substrat für Hochspannungsmodule
JP4158288B2 (ja) * 1999-08-31 2008-10-01 三菱電機株式会社 半導体モジュール
JP2001156413A (ja) * 1999-11-26 2001-06-08 Sumitomo Electric Ind Ltd 銅回路接合基板及びその製造方法
WO2002013267A1 (fr) * 2000-08-09 2002-02-14 Mitsubishi Materials Corporation Module de puissance pouvant comporter un dissipateur thermique
JP4756200B2 (ja) 2000-09-04 2011-08-24 Dowaメタルテック株式会社 金属セラミックス回路基板
DE10158185B4 (de) * 2000-12-20 2005-08-11 Semikron Elektronik Gmbh Leistungshalbleitermodul mit hoher Isolationsfestigkeit
JP4168114B2 (ja) * 2001-09-28 2008-10-22 Dowaホールディングス株式会社 金属−セラミックス接合体
JP4811756B2 (ja) * 2001-09-28 2011-11-09 Dowaメタルテック株式会社 金属−セラミックス接合回路基板の製造方法
JP3648189B2 (ja) * 2001-09-28 2005-05-18 同和鉱業株式会社 金属−セラミックス回路基板
US6936337B2 (en) 2001-09-28 2005-08-30 Dowa Mining Co., Ltd. Metal/ceramic circuit board
DE10212495B4 (de) 2002-03-21 2004-02-26 Schulz-Harder, Jürgen, Dr.-Ing. Verfahren zum Herstellen eines Metall-Keramik-Substrats, vorzugsweise eines Kupfer-Keramik-Substrats
DE50307323D1 (de) * 2002-03-13 2007-07-05 Electrovac Ag Verfahren zum herstellen eines metal-keramik-subtrats, vorzugsweise eines kupfer-keramik-substrats
JP3863067B2 (ja) * 2002-06-04 2006-12-27 Dowaホールディングス株式会社 金属−セラミックス接合体の製造方法
JP3868854B2 (ja) * 2002-06-14 2007-01-17 Dowaホールディングス株式会社 金属−セラミックス接合体およびその製造方法
JP4401096B2 (ja) * 2003-03-26 2010-01-20 Dowaホールディングス株式会社 回路基板の製造方法
JP4394477B2 (ja) * 2003-03-27 2010-01-06 Dowaホールディングス株式会社 金属−セラミックス接合基板の製造方法
JP5299160B2 (ja) * 2003-03-27 2013-09-25 Dowaメタルテック株式会社 金属−セラミックス接合基板の製造方法
JP4127131B2 (ja) * 2003-06-25 2008-07-30 松下電工株式会社 調光装置
US7532481B2 (en) * 2004-04-05 2009-05-12 Mitsubishi Materials Corporation Al/AlN joint material, base plate for power module, power module, and manufacturing method of Al/AlN joint material
US8563869B2 (en) 2005-08-29 2013-10-22 Hitachi Metals, Ltd. Circuit board and semiconductor module using this, production method for circuit board
DE102009033029A1 (de) 2009-07-02 2011-01-05 Electrovac Ag Elektronische Vorrichtung
DE102010039728A1 (de) * 2010-08-25 2012-03-01 Robert Bosch Gmbh Verfahren zur Herstellung einer elektrischen Schaltung und elektrischen Schaltung
DE102011103746A1 (de) 2011-05-31 2012-12-06 Ixys Semiconductor Gmbh Verfahren zum Fügen von Metall-Keramik-Substraten an Metallkörpern
CN104011852B (zh) * 2011-12-20 2016-12-21 株式会社东芝 陶瓷铜电路基板和使用了陶瓷铜电路基板的半导体装置
DE102013102637B4 (de) * 2013-03-14 2017-08-31 Rogers Germany Gmbh Metall-Keramik-Substrat sowie Verfahren zum Herstellen eines derartigen Metall-Keramik-Substrates und Anordnung von derartigen Metall-Keramik-Substraten
DE102013104739B4 (de) * 2013-03-14 2022-10-27 Rogers Germany Gmbh Metall-Keramik-Substrate sowie Verfahren zum Herstellen eines Metall-Keramik-Substrates
US10104783B2 (en) * 2013-08-29 2018-10-16 Hitachi Metals, Ltd. Method for producing ceramic circuit board
JP6218856B2 (ja) * 2013-12-24 2017-10-25 三菱電機株式会社 電力変換装置
WO2015104954A1 (ja) * 2014-01-10 2015-07-16 古河電気工業株式会社 電子回路装置
EP3121157B1 (de) * 2014-03-20 2019-03-20 Mitsubishi Materials Corporation Verbundener körper, substrat für leistungsmodule, leistungsmodul und verfahren zur herstellung eines verbundenen körpers
CN105880532A (zh) * 2014-10-28 2016-08-24 廖树汉 重量比铝轻价格降低过半代替钢板的钢瓷复合板
TWI553154B (zh) * 2015-11-03 2016-10-11 Nat Inst Chung Shan Science & Technology A structure for improving the interfacial stress of aluminum nitride substrate and copper coating
CN109156080B (zh) 2016-05-16 2021-10-08 株式会社村田制作所 陶瓷电子部件
WO2018089745A1 (en) * 2016-11-11 2018-05-17 The Regents Of The University Of Colorado, A Body Corporate Improved stability of refractory materials in high temperature steam
JP6799479B2 (ja) * 2017-03-03 2020-12-16 Dowaメタルテック株式会社 金属−セラミックス回路基板の製造方法
DE102017215048A1 (de) * 2017-08-29 2019-02-28 Conti Temic Microelectronic Gmbh Schaltungsträger für Leistungselektronik und Leistungselektronikmodul mit einem Schaltungsträger
JP7221401B2 (ja) * 2019-08-29 2023-02-13 京セラ株式会社 電気回路基板及びパワーモジュール
JP2022024309A (ja) 2020-07-15 2022-02-09 Dowaメタルテック株式会社 絶縁基板およびその製造方法
CN112638046B (zh) * 2020-12-25 2023-12-15 合肥圣达电子科技实业有限公司 一种蚀刻制备高可靠陶瓷覆铜的方法
JP2023147241A (ja) * 2022-03-29 2023-10-12 株式会社プロテリアル セラミックス基板

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JPH0685154A (ja) * 1992-09-07 1994-03-25 Hitachi Ltd 半導体集積回路装置
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Also Published As

Publication number Publication date
EP1453089A2 (de) 2004-09-01
EP1453089B1 (de) 2013-02-20
DE69730388T2 (de) 2005-09-01
EP1453089A3 (de) 2004-09-08
US6054762A (en) 2000-04-25
EP0827198A2 (de) 1998-03-04
EP0827198A3 (de) 1998-07-15
JP3512977B2 (ja) 2004-03-31
EP0827198B1 (de) 2004-08-25
JPH10125821A (ja) 1998-05-15

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