DE69637166T2 - Verfahren zur Härtung eines Wasserstoff-Silsesquioxanharzes mittels Elektronenstrahlen zur Umwandlung in eine Silika enthaltende Keramikbeschichtung - Google Patents
Verfahren zur Härtung eines Wasserstoff-Silsesquioxanharzes mittels Elektronenstrahlen zur Umwandlung in eine Silika enthaltende Keramikbeschichtung Download PDFInfo
- Publication number
- DE69637166T2 DE69637166T2 DE69637166T DE69637166T DE69637166T2 DE 69637166 T2 DE69637166 T2 DE 69637166T2 DE 69637166 T DE69637166 T DE 69637166T DE 69637166 T DE69637166 T DE 69637166T DE 69637166 T2 DE69637166 T2 DE 69637166T2
- Authority
- DE
- Germany
- Prior art keywords
- coating
- substrate
- silica
- electron beam
- hydrogen silsesquioxane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/69—Inorganic materials
- H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
- H10P14/6921—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon
- H10P14/6922—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material containing Si, O and at least one of H, N, C, F or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
- H10P14/6925—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material containing Si, O and at least one of H, N, C, F or other non-metal elements, e.g. SiOC, SiOC:H or SiONC the material comprising hydrogen silsesquioxane, e.g. HSQ
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
- B05D3/068—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation using ionising radiations (gamma, X, electrons)
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/0045—Irradiation; Radiation, e.g. with UV or IR
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
- C04B41/5025—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials with ceramic materials
- C04B41/5035—Silica
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/65—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials
- H10P14/6516—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials
- H10P14/6536—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials by exposure to radiation, e.g. visible light
- H10P14/6539—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials by exposure to radiation, e.g. visible light by exposure to corpuscular radiation, e.g. exposure to electrons, alpha-particles, protons or ions
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
- C04B2111/00474—Uses not provided for elsewhere in C04B2111/00
- C04B2111/00844—Uses not provided for elsewhere in C04B2111/00 for electronic applications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
- H10P14/6326—Deposition processes
- H10P14/6342—Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/66—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials
- H10P14/668—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials
- H10P14/6681—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si
- H10P14/6684—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si the compound comprising silicon and oxygen
- H10P14/6686—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si the compound comprising silicon and oxygen the compound being a molecule comprising at least one silicon-oxygen bond and the compound having hydrogen or an organic group attached to the silicon or oxygen, e.g. a siloxane
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/69—Inorganic materials
- H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
- H10P14/6921—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon
- H10P14/6922—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material containing Si, O and at least one of H, N, C, F or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Structural Engineering (AREA)
- Inorganic Chemistry (AREA)
- General Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Formation Of Insulating Films (AREA)
- Silicon Compounds (AREA)
- Paints Or Removers (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/566,820 US5609925A (en) | 1995-12-04 | 1995-12-04 | Curing hydrogen silsesquioxane resin with an electron beam |
| US566820 | 1995-12-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69637166D1 DE69637166D1 (de) | 2007-08-30 |
| DE69637166T2 true DE69637166T2 (de) | 2008-04-03 |
Family
ID=24264508
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69637166T Expired - Lifetime DE69637166T2 (de) | 1995-12-04 | 1996-12-03 | Verfahren zur Härtung eines Wasserstoff-Silsesquioxanharzes mittels Elektronenstrahlen zur Umwandlung in eine Silika enthaltende Keramikbeschichtung |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US5609925A (https=) |
| EP (1) | EP0778612B1 (https=) |
| JP (1) | JP4015214B2 (https=) |
| KR (1) | KR100454618B1 (https=) |
| DE (1) | DE69637166T2 (https=) |
Families Citing this family (42)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6607991B1 (en) * | 1995-05-08 | 2003-08-19 | Electron Vision Corporation | Method for curing spin-on dielectric films utilizing electron beam radiation |
| KR100238252B1 (ko) * | 1996-09-13 | 2000-01-15 | 윤종용 | Sog층 큐어링방법 및 이를 이용한 반도체장치의 절연막제조방법 |
| EP0860462A3 (en) * | 1997-02-24 | 1999-04-21 | Dow Corning Toray Silicone Company Limited | Composition and method for the formation of silica thin films |
| US6080526A (en) * | 1997-03-24 | 2000-06-27 | Alliedsignal Inc. | Integration of low-k polymers into interlevel dielectrics using controlled electron-beam radiation |
| US6218497B1 (en) | 1997-04-21 | 2001-04-17 | Alliedsignal Inc. | Organohydridosiloxane resins with low organic content |
| US6143855A (en) * | 1997-04-21 | 2000-11-07 | Alliedsignal Inc. | Organohydridosiloxane resins with high organic content |
| US6743856B1 (en) | 1997-04-21 | 2004-06-01 | Honeywell International Inc. | Synthesis of siloxane resins |
| US6015457A (en) * | 1997-04-21 | 2000-01-18 | Alliedsignal Inc. | Stable inorganic polymers |
| EP0881668A3 (en) | 1997-05-28 | 2000-11-15 | Dow Corning Toray Silicone Company, Ltd. | Deposition of an electrically insulating thin film with a low dielectric constant |
| SG71147A1 (en) | 1997-08-29 | 2000-03-21 | Dow Corning Toray Silicone | Method for forming insulating thin films |
| US6042994A (en) * | 1998-01-20 | 2000-03-28 | Alliedsignal Inc. | Nanoporous silica dielectric films modified by electron beam exposure and having low dielectric constant and low water content |
| US6177199B1 (en) | 1999-01-07 | 2001-01-23 | Alliedsignal Inc. | Dielectric films from organohydridosiloxane resins with low organic content |
| US6218020B1 (en) | 1999-01-07 | 2001-04-17 | Alliedsignal Inc. | Dielectric films from organohydridosiloxane resins with high organic content |
| US6177143B1 (en) * | 1999-01-06 | 2001-01-23 | Allied Signal Inc | Electron beam treatment of siloxane resins |
| US6361837B2 (en) | 1999-01-15 | 2002-03-26 | Advanced Micro Devices, Inc. | Method and system for modifying and densifying a porous film |
| US6472076B1 (en) | 1999-10-18 | 2002-10-29 | Honeywell International Inc. | Deposition of organosilsesquioxane films |
| US6440550B1 (en) * | 1999-10-18 | 2002-08-27 | Honeywell International Inc. | Deposition of fluorosilsesquioxane films |
| US6582777B1 (en) * | 2000-02-17 | 2003-06-24 | Applied Materials Inc. | Electron beam modification of CVD deposited low dielectric constant materials |
| JP2001291427A (ja) * | 2000-04-06 | 2001-10-19 | Dow Corning Toray Silicone Co Ltd | 電気絶縁性薄膜形成性樹脂組成物、および電気絶縁性薄膜の形成方法 |
| US6444136B1 (en) * | 2000-04-25 | 2002-09-03 | Newport Fab, Llc | Fabrication of improved low-k dielectric structures |
| US7063919B2 (en) * | 2002-07-31 | 2006-06-20 | Mancini David P | Lithographic template having a repaired gap defect method of repair and use |
| US7098149B2 (en) * | 2003-03-04 | 2006-08-29 | Air Products And Chemicals, Inc. | Mechanical enhancement of dense and porous organosilicate materials by UV exposure |
| US20060158101A1 (en) * | 2003-03-04 | 2006-07-20 | Dow Corning Corporation | Organic light-emitting diode |
| TWI240959B (en) | 2003-03-04 | 2005-10-01 | Air Prod & Chem | Mechanical enhancement of dense and porous organosilicate materials by UV exposure |
| US7112617B2 (en) * | 2003-04-22 | 2006-09-26 | International Business Machines Corporation | Patterned substrate with hydrophilic/hydrophobic contrast, and method of use |
| US7282241B2 (en) * | 2003-04-22 | 2007-10-16 | International Business Machines Corporation | Patterned, high surface area substrate with hydrophilic/hydrophobic contrast, and method of use |
| EP1475668A1 (en) * | 2003-05-09 | 2004-11-10 | ASML Netherlands B.V. | Method of preparing components for a lithographic apparatus |
| FR2872503B1 (fr) * | 2004-07-05 | 2006-09-22 | Commissariat Energie Atomique | Procede de fabrication d'une ebauche de biopuce, ebauche et biopuce |
| US7803668B2 (en) | 2006-02-24 | 2010-09-28 | Stmicroelectronics (Crolles 2) Sas | Transistor and fabrication process |
| FR2897981B1 (fr) * | 2006-02-24 | 2008-05-30 | St Microelectronics Crolles 2 | Procede de fabrication de transistor et transistor |
| JP5149512B2 (ja) * | 2007-02-02 | 2013-02-20 | 東レ・ダウコーニング株式会社 | 液状硬化性組成物、コーテイング方法、無機質基板および半導体装置 |
| US20080206602A1 (en) * | 2007-02-28 | 2008-08-28 | Katine Jordan A | Nanoimprinting of topography for patterned magnetic media |
| WO2008144923A1 (en) * | 2007-05-31 | 2008-12-04 | The Governors Of The University Of Alberta | Nc-si/sio2 coatings and direct lithographic patterning thereof |
| US20140178698A1 (en) | 2012-12-21 | 2014-06-26 | 3M Innovative Properties Company | Curable silsesquioxane polymers, compositions, articles, and methods |
| CN104870584B (zh) | 2012-12-21 | 2017-07-07 | 3M创新有限公司 | 可固化倍半硅氧烷聚合物、组合物、制品和方法 |
| US9741918B2 (en) | 2013-10-07 | 2017-08-22 | Hypres, Inc. | Method for increasing the integration level of superconducting electronics circuits, and a resulting circuit |
| WO2015088932A1 (en) | 2013-12-09 | 2015-06-18 | 3M Innovative Properties Company | Curable silsesquioxane polymers, compositions, articles, and methods |
| US10370564B2 (en) | 2014-06-20 | 2019-08-06 | 3M Innovative Properties Company | Adhesive compositions comprising a silsesquioxane polymer crosslinker, articles and methods |
| US10392538B2 (en) | 2014-06-20 | 2019-08-27 | 3M Innovative Properties Company | Adhesive compositions comprising a silsesquioxane polymer crosslinker, articles and methods |
| JP2017528577A (ja) | 2014-09-22 | 2017-09-28 | スリーエム イノベイティブ プロパティズ カンパニー | シルセスキオキサンポリマーコア、シルセスキオキサンポリマー外層、及び反応性基を含む硬化性ポリマー |
| US9957416B2 (en) | 2014-09-22 | 2018-05-01 | 3M Innovative Properties Company | Curable end-capped silsesquioxane polymer comprising reactive groups |
| EP3671812B1 (en) * | 2018-12-19 | 2022-02-09 | IMEC vzw | A method for bonding and interconnecting semiconductor chips |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH492948A (fr) | 1968-09-13 | 1970-06-30 | Rador S A | Bande pour l'obtention d'un élément barbelé |
| US3615272A (en) | 1968-11-04 | 1971-10-26 | Dow Corning | Condensed soluble hydrogensilsesquioxane resin |
| US4041190A (en) * | 1971-06-29 | 1977-08-09 | Thomson-Csf | Method for producing a silica mask on a semiconductor substrate |
| DE2302148C2 (de) * | 1972-01-18 | 1983-02-10 | N.V. Philips' Gloeilampenfabrieken, 5621 Eindhoven | Verfahren zur Herstellung eines Phosphorsilicatglasschichtmusters |
| JPS59178749A (ja) | 1983-03-30 | 1984-10-11 | Fujitsu Ltd | 配線構造体 |
| JPS6086017A (ja) | 1983-10-17 | 1985-05-15 | Fujitsu Ltd | ポリハイドロジエンシルセスキオキサンの製法 |
| DE3402317A1 (de) * | 1984-01-24 | 1985-07-25 | Wacker-Chemie GmbH, 8000 München | Organopolysiloxane, verfahren zu ihrer herstellung und verwendung dieser organopolysiloxane |
| JPS63107122A (ja) | 1986-10-24 | 1988-05-12 | Fujitsu Ltd | 凹凸基板の平坦化方法 |
| US4756977A (en) * | 1986-12-03 | 1988-07-12 | Dow Corning Corporation | Multilayer ceramics from hydrogen silsesquioxane |
| US4808653A (en) * | 1986-12-04 | 1989-02-28 | Dow Corning Corporation | Coating composition containing hydrogen silsesquioxane resin and other metal oxide precursors |
| US4847162A (en) * | 1987-12-28 | 1989-07-11 | Dow Corning Corporation | Multilayer ceramics coatings from the ceramification of hydrogen silsequioxane resin in the presence of ammonia |
| US5336532A (en) * | 1989-02-21 | 1994-08-09 | Dow Corning Corporation | Low temperature process for the formation of ceramic coatings |
| US4999397A (en) | 1989-07-28 | 1991-03-12 | Dow Corning Corporation | Metastable silane hydrolyzates and process for their preparation |
| US5010159A (en) | 1989-09-01 | 1991-04-23 | Dow Corning Corporation | Process for the synthesis of soluble, condensed hydridosilicon resins containing low levels of silanol |
| US5262201A (en) * | 1990-06-04 | 1993-11-16 | Dow Corning Corporation | Low temperature process for converting silica precursor coatings to ceramic silica coatings by exposure to ammonium hydroxide or an environment to which water vapor and ammonia vapor have been added |
| US5116637A (en) * | 1990-06-04 | 1992-05-26 | Dow Corning Corporation | Amine catalysts for the low temperature conversion of silica precursors to silica |
| US5059448A (en) * | 1990-06-18 | 1991-10-22 | Dow Corning Corporation | Rapid thermal process for obtaining silica coatings |
| US5063267A (en) | 1990-11-28 | 1991-11-05 | Dow Corning Corporation | Hydrogen silsesquioxane resin fractions and their use as coating materials |
| US5238787A (en) * | 1991-04-22 | 1993-08-24 | Dow Corning Corporation | Photodelineable coatings from hydrogen silsesquioxane resin |
| US5145723A (en) * | 1991-06-05 | 1992-09-08 | Dow Corning Corporation | Process for coating a substrate with silica |
| US5436029A (en) * | 1992-07-13 | 1995-07-25 | Dow Corning Corporation | Curing silicon hydride containing materials by exposure to nitrous oxide |
| CA2104340A1 (en) * | 1992-08-31 | 1994-03-01 | Grish Chandra | Hermetic protection for integrated circuits |
| US5441765A (en) * | 1993-09-22 | 1995-08-15 | Dow Corning Corporation | Method of forming Si-O containing coatings |
| US5530293A (en) * | 1994-11-28 | 1996-06-25 | International Business Machines Corporation | Carbon-free hydrogen silsesquioxane with dielectric constant less than 3.2 annealed in hydrogen for integrated circuits |
| JP3584186B2 (ja) * | 1999-09-24 | 2004-11-04 | エア・ウォーター株式会社 | 深冷ガス分離装置 |
| KR100510872B1 (ko) * | 2003-01-23 | 2005-08-26 | 한국타이어 주식회사 | 공기입 래디얼 타이어 |
-
1995
- 1995-12-04 US US08/566,820 patent/US5609925A/en not_active Expired - Lifetime
-
1996
- 1996-12-03 DE DE69637166T patent/DE69637166T2/de not_active Expired - Lifetime
- 1996-12-03 EP EP96119378A patent/EP0778612B1/en not_active Expired - Lifetime
- 1996-12-03 KR KR1019960061172A patent/KR100454618B1/ko not_active Expired - Lifetime
- 1996-12-04 JP JP32431096A patent/JP4015214B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR970052882A (ko) | 1997-07-29 |
| KR100454618B1 (ko) | 2004-12-31 |
| EP0778612B1 (en) | 2007-07-18 |
| EP0778612A3 (en) | 2000-02-02 |
| DE69637166D1 (de) | 2007-08-30 |
| EP0778612A2 (en) | 1997-06-11 |
| JP4015214B2 (ja) | 2007-11-28 |
| US5609925A (en) | 1997-03-11 |
| JPH09175810A (ja) | 1997-07-08 |
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