DE69222461T2 - Photostrukturierbare Beschichtungen auf Basis eines Wasserstoff-Silsesquioxanharzes - Google Patents
Photostrukturierbare Beschichtungen auf Basis eines Wasserstoff-SilsesquioxanharzesInfo
- Publication number
- DE69222461T2 DE69222461T2 DE69222461T DE69222461T DE69222461T2 DE 69222461 T2 DE69222461 T2 DE 69222461T2 DE 69222461 T DE69222461 T DE 69222461T DE 69222461 T DE69222461 T DE 69222461T DE 69222461 T2 DE69222461 T2 DE 69222461T2
- Authority
- DE
- Germany
- Prior art keywords
- photostructurable
- coatings based
- hydrogen silsesquioxane
- silsesquioxane resin
- coatings
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Paints Or Removers (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Formation Of Insulating Films (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/688,418 US5238787A (en) | 1991-04-22 | 1991-04-22 | Photodelineable coatings from hydrogen silsesquioxane resin |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69222461D1 DE69222461D1 (de) | 1997-11-06 |
DE69222461T2 true DE69222461T2 (de) | 1998-04-09 |
Family
ID=24764345
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69222461T Expired - Fee Related DE69222461T2 (de) | 1991-04-22 | 1992-04-15 | Photostrukturierbare Beschichtungen auf Basis eines Wasserstoff-Silsesquioxanharzes |
Country Status (7)
Country | Link |
---|---|
US (2) | US5238787A (de) |
EP (1) | EP0510872B1 (de) |
JP (1) | JP2997124B2 (de) |
KR (1) | KR100214111B1 (de) |
CA (1) | CA2064971A1 (de) |
DE (1) | DE69222461T2 (de) |
TW (1) | TW223153B (de) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5631120A (en) * | 1994-09-02 | 1997-05-20 | Motorola, Inc. | Method of forming a pattern with step features in a photopolymer |
US5693455A (en) * | 1994-09-02 | 1997-12-02 | Motorola, Inc. | Method for creating a pattern having step features in a photopolymer using a thermal mask |
JP3499032B2 (ja) * | 1995-02-02 | 2004-02-23 | ダウ コーニング アジア株式会社 | 放射線硬化性組成物、その硬化方法及びパターン形成方法 |
US5609925A (en) * | 1995-12-04 | 1997-03-11 | Dow Corning Corporation | Curing hydrogen silsesquioxane resin with an electron beam |
US5733698A (en) * | 1996-09-30 | 1998-03-31 | Minnesota Mining And Manufacturing Company | Release layer for photoreceptors |
EP0857705B1 (de) * | 1997-02-07 | 2002-07-31 | Dow Corning Corporation | Verfahren zur Herstellung von Überzügen auf Elektronikteilen |
JP3415741B2 (ja) * | 1997-03-31 | 2003-06-09 | 東レ・ダウコーニング・シリコーン株式会社 | 電気絶縁性薄膜形成用組成物および電気絶縁性薄膜の形成方法 |
US6743856B1 (en) | 1997-04-21 | 2004-06-01 | Honeywell International Inc. | Synthesis of siloxane resins |
US6015457A (en) * | 1997-04-21 | 2000-01-18 | Alliedsignal Inc. | Stable inorganic polymers |
US6143855A (en) * | 1997-04-21 | 2000-11-07 | Alliedsignal Inc. | Organohydridosiloxane resins with high organic content |
US6218497B1 (en) | 1997-04-21 | 2001-04-17 | Alliedsignal Inc. | Organohydridosiloxane resins with low organic content |
EP0881668A3 (de) | 1997-05-28 | 2000-11-15 | Dow Corning Toray Silicone Company, Ltd. | Abscheidung eines elektrisch isolierenden Dünnfilms mit einer niedrigen Dielektrizitätskonstante |
US5958630A (en) * | 1997-12-30 | 1999-09-28 | Kabushiki Kaisha Toshiba | Phase shifting mask and method of manufacturing the same |
US6218020B1 (en) | 1999-01-07 | 2001-04-17 | Alliedsignal Inc. | Dielectric films from organohydridosiloxane resins with high organic content |
US6177199B1 (en) | 1999-01-07 | 2001-01-23 | Alliedsignal Inc. | Dielectric films from organohydridosiloxane resins with low organic content |
DE19815978B4 (de) * | 1998-04-09 | 2004-01-08 | Forschungszentrum Karlsruhe Gmbh | Verfahren zur Herstellung von Klein- und Mikroteilen aus Keramik |
GB9812425D0 (en) | 1998-06-10 | 1998-08-05 | Dow Corning | Electroless metal disposition on silyl hyride functional resin |
US6177143B1 (en) * | 1999-01-06 | 2001-01-23 | Allied Signal Inc | Electron beam treatment of siloxane resins |
US6472076B1 (en) | 1999-10-18 | 2002-10-29 | Honeywell International Inc. | Deposition of organosilsesquioxane films |
US6440550B1 (en) | 1999-10-18 | 2002-08-27 | Honeywell International Inc. | Deposition of fluorosilsesquioxane films |
US6335152B1 (en) * | 2000-05-01 | 2002-01-01 | Advanced Micro Devices, Inc. | Use of RTA furnace for photoresist baking |
KR20040050916A (ko) * | 2001-10-19 | 2004-06-17 | 코닌클리즈케 필립스 일렉트로닉스 엔.브이. | 피처들의 패턴 및 이의 형성 방법 |
FR2872503B1 (fr) * | 2004-07-05 | 2006-09-22 | Commissariat Energie Atomique | Procede de fabrication d'une ebauche de biopuce, ebauche et biopuce |
US8088547B2 (en) * | 2004-11-02 | 2012-01-03 | Dow Corning Corporation | Resist composition |
WO2006073115A1 (ja) * | 2005-01-05 | 2006-07-13 | Sekisui Chemical Co., Ltd. | シリコン含有感光性組成物、これを用いた薄膜パターンの製造方法、電子機器用保護膜、ゲート絶縁膜及び薄膜トランジスタ |
JP4925084B2 (ja) * | 2005-09-14 | 2012-04-25 | 独立行政法人日本原子力研究開発機構 | ケイ素系混合高分子材料による炭化ケイ素(SiC)薄膜の合成法 |
CN101622579B (zh) * | 2007-03-01 | 2012-09-05 | 旭硝子株式会社 | 具有斥水性区域的图案的处理基材及其制造方法、以及形成有功能性材料的膜构成的图案的构件的制造方法 |
US8158338B2 (en) * | 2008-07-08 | 2012-04-17 | Massachusetts Institute Of Technology | Resist sensitizer |
US8323866B2 (en) * | 2008-07-08 | 2012-12-04 | Massachusetts Institute Of Technology | Inorganic resist sensitizer |
FI129480B (en) * | 2018-08-10 | 2022-03-15 | Pibond Oy | Silanol-containing organic-inorganic hybrid coatings for high-resolution patterning |
KR102155966B1 (ko) | 2019-09-04 | 2020-09-14 | 성인식 | 농작물 지지대 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3615272A (en) * | 1968-11-04 | 1971-10-26 | Dow Corning | Condensed soluble hydrogensilsesquioxane resin |
FR2507608A1 (fr) * | 1981-06-15 | 1982-12-17 | Rhone Poulenc Spec Chim | Compositions organopolysiloxaniques liquides photopolymerisables pour enduction de materiaux |
US4693960A (en) * | 1985-03-29 | 1987-09-15 | International Business Machines Corporation | Photolithographic etching process using organosilicon polymer composition |
FR2597110A1 (fr) * | 1986-04-14 | 1987-10-16 | Rhone Poulenc Multi Tech | Composition organopolysiloxane, potentiellement reticulable et utilisable notamment en microlithographie, et son procede d'application |
EP0255303B1 (de) * | 1986-07-25 | 1989-10-11 | Oki Electric Industry Company, Limited | Negatives Resistmaterial, Methode zu seiner Herstellung und Methode zu seiner Verwendung |
US4756977A (en) * | 1986-12-03 | 1988-07-12 | Dow Corning Corporation | Multilayer ceramics from hydrogen silsesquioxane |
US4847162A (en) * | 1987-12-28 | 1989-07-11 | Dow Corning Corporation | Multilayer ceramics coatings from the ceramification of hydrogen silsequioxane resin in the presence of ammonia |
US4889901A (en) * | 1988-11-16 | 1989-12-26 | Desoto, Inc. | Ultraviolet-curable blends of acrylated polyurethanes and silsesquioxane oligomers having improved adhesion to glass |
US5063297A (en) * | 1989-06-08 | 1991-11-05 | Minnesota Mining And Manufacturing Company | Apparatus for detecting fluorescence of a luminescent material |
US4999397A (en) * | 1989-07-28 | 1991-03-12 | Dow Corning Corporation | Metastable silane hydrolyzates and process for their preparation |
US5110711A (en) * | 1989-10-10 | 1992-05-05 | International Business Machines Corporation | Method for forming a pattern |
US5098816A (en) * | 1989-10-10 | 1992-03-24 | International Business Machines Corporation | Method for forming a pattern of a photoresist |
US5021398A (en) * | 1989-10-26 | 1991-06-04 | Amp Incorporated | Method of forming patterned oxide superconducting films |
-
1991
- 1991-04-22 US US07/688,418 patent/US5238787A/en not_active Expired - Fee Related
-
1992
- 1992-03-20 TW TW081102102A patent/TW223153B/zh active
- 1992-04-02 CA CA002064971A patent/CA2064971A1/en not_active Abandoned
- 1992-04-15 DE DE69222461T patent/DE69222461T2/de not_active Expired - Fee Related
- 1992-04-15 EP EP92303413A patent/EP0510872B1/de not_active Expired - Lifetime
- 1992-04-20 JP JP4099041A patent/JP2997124B2/ja not_active Expired - Fee Related
- 1992-04-22 KR KR1019920006718A patent/KR100214111B1/ko not_active IP Right Cessation
-
1993
- 1993-03-22 US US08/034,958 patent/US5348839A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
TW223153B (de) | 1994-05-01 |
JPH05204161A (ja) | 1993-08-13 |
CA2064971A1 (en) | 1992-10-23 |
DE69222461D1 (de) | 1997-11-06 |
US5238787A (en) | 1993-08-24 |
KR920020259A (ko) | 1992-11-20 |
JP2997124B2 (ja) | 2000-01-11 |
EP0510872B1 (de) | 1997-10-01 |
US5348839A (en) | 1994-09-20 |
EP0510872A1 (de) | 1992-10-28 |
KR100214111B1 (ko) | 1999-08-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |