DE69636971D1 - Weichlotflussmittel auf epoxybasis ohne flüchtige organische verbindungen - Google Patents

Weichlotflussmittel auf epoxybasis ohne flüchtige organische verbindungen

Info

Publication number
DE69636971D1
DE69636971D1 DE69636971T DE69636971T DE69636971D1 DE 69636971 D1 DE69636971 D1 DE 69636971D1 DE 69636971 T DE69636971 T DE 69636971T DE 69636971 T DE69636971 T DE 69636971T DE 69636971 D1 DE69636971 D1 DE 69636971D1
Authority
DE
Germany
Prior art keywords
flux
lot
soft
organic compounds
volatile organic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69636971T
Other languages
English (en)
Other versions
DE69636971T2 (de
Inventor
Hiep Diep-Quang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alpha Assembly Solutions Inc
Original Assignee
Frys Metals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Frys Metals Inc filed Critical Frys Metals Inc
Application granted granted Critical
Publication of DE69636971D1 publication Critical patent/DE69636971D1/de
Publication of DE69636971T2 publication Critical patent/DE69636971T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3618—Carboxylic acids or salts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0227—Rods, wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE69636971T 1995-05-24 1996-05-24 Weichlotflussmittel auf epoxybasis ohne flüchtige organische verbindungen Expired - Fee Related DE69636971T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US44868395A 1995-05-24 1995-05-24
US448683 1995-05-24
PCT/US1996/007705 WO1996037336A1 (en) 1995-05-24 1996-05-24 Epoxy-based, voc-free soldering flux

Publications (2)

Publication Number Publication Date
DE69636971D1 true DE69636971D1 (de) 2007-04-26
DE69636971T2 DE69636971T2 (de) 2007-12-13

Family

ID=23781259

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69636971T Expired - Fee Related DE69636971T2 (de) 1995-05-24 1996-05-24 Weichlotflussmittel auf epoxybasis ohne flüchtige organische verbindungen

Country Status (7)

Country Link
US (1) US5904782A (de)
EP (1) EP0831981B1 (de)
JP (1) JP3953514B2 (de)
CA (1) CA2221961C (de)
DE (1) DE69636971T2 (de)
TW (1) TW317519B (de)
WO (1) WO1996037336A1 (de)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7041771B1 (en) * 1995-08-11 2006-05-09 Kac Holdings, Inc. Encapsulant with fluxing properties and method of use in flip-chip surface mount reflow soldering
JP3220635B2 (ja) * 1996-02-09 2001-10-22 松下電器産業株式会社 はんだ合金及びクリームはんだ
EP0869704A1 (de) * 1997-03-31 1998-10-07 Ford Motor Company Verfahren zum Montieren von Bauelementen auf einer Leiterplatte
US20020046627A1 (en) * 1998-06-10 2002-04-25 Hitoshi Amita Solder powder, flux, solder paste, soldering method, soldered circuit board, and soldered joint product
JP3785435B2 (ja) * 1998-08-27 2006-06-14 株式会社デンソー はんだペーストおよび表面実装型電子装置
TW527253B (en) 1999-10-05 2003-04-11 Tdk Corp Soldering flux, soldering paste and soldering process
US6440228B1 (en) * 2000-02-04 2002-08-27 Senju Metal Industry Co., Ltd. Lead-free zinc-containing solder paste
JP3791403B2 (ja) * 2000-12-04 2006-06-28 富士電機ホールディングス株式会社 鉛フリーハンダ対応無洗浄用フラックスおよびこれを含有するハンダ組成物
JP3888573B2 (ja) 2001-06-29 2007-03-07 富士電機ホールディングス株式会社 ハンダ組成物
DE10141883A1 (de) 2001-08-28 2003-03-20 Behr Gmbh & Co Flussmittelzusammensetzungen zum Hartlöten von Teilen, insbesondere auf der Basis von Aluminium als Grundmaterial, sowie deren Verwendung
WO2003064102A1 (en) * 2002-01-30 2003-08-07 Showa Denko K.K. Solder metal, soldering flux and solder paste
US6854633B1 (en) 2002-02-05 2005-02-15 Micron Technology, Inc. System with polymer masking flux for fabricating external contacts on semiconductor components
JP3702418B2 (ja) * 2002-03-07 2005-10-05 株式会社 東京第一商興 ソルダペースト用フラックス及びソルダペースト
US20030221748A1 (en) * 2002-05-30 2003-12-04 Fry's Metals, Inc. Solder paste flux system
JP2008510621A (ja) * 2004-08-25 2008-04-10 松下電器産業株式会社 半田組成物及び半田接合方法並びに半田接合構造
CN100594089C (zh) * 2004-08-25 2010-03-17 松下电器产业株式会社 焊料组合物、利用焊接的连接方法和衬底的生产方法
TW200730288A (en) * 2005-08-11 2007-08-16 Senju Metal Industry Co Lead free solder paste and application thereof
CA2665551A1 (en) * 2006-10-06 2008-04-17 Henkel Ag & Co. Kgaa Pumpable epoxy paste adhesives resistant to wash-off
WO2009001448A1 (ja) * 2007-06-27 2008-12-31 Panasonic Electric Works Co., Ltd. 熱硬化性樹脂組成物及びその製造方法
US20100243717A1 (en) * 2007-11-27 2010-09-30 Harima Chemicals, Inc Soldering flux, solder paste composition and soldering method
WO2009069600A1 (ja) * 2007-11-27 2009-06-04 Harima Chemicals, Inc. はんだ付け用フラックスおよびはんだペースト組成物
JP5342453B2 (ja) * 2007-11-28 2013-11-13 パナソニック株式会社 導電性ペーストおよびこれを用いた電気電子機器
CN101347875B (zh) * 2008-08-19 2011-04-06 深圳悍豹科技有限公司 调谐器专用中温节能无铅锡膏
KR20110086856A (ko) * 2008-11-25 2011-08-01 스미토모 베이클리트 컴퍼니 리미티드 전자 부품 패키지 및 전자 부품 패키지의 제조 방법
TWI552825B (zh) * 2010-12-15 2016-10-11 亨克爾股份有限及兩合公司 焊膏組合物、焊膏及助焊劑
JP5853146B2 (ja) * 2011-08-24 2016-02-09 パナソニックＩｐマネジメント株式会社 熱硬化性樹脂組成物及び回路基板
KR20130066929A (ko) * 2011-12-13 2013-06-21 한국전자통신연구원 패턴 형성 조성물 및 이를 이용한 패턴 형성 방법
JP2015033714A (ja) 2013-08-09 2015-02-19 富士電機株式会社 やに入りはんだ用フラックス及びやに入りはんだ
JP6192444B2 (ja) * 2013-08-30 2017-09-06 株式会社タムラ製作所 微細パターン塗布用はんだ組成物
US9802275B2 (en) 2013-12-31 2017-10-31 Alpha Assembly Solutions Inc. Rosin-free thermosetting flux formulations
JP2016043408A (ja) * 2014-08-27 2016-04-04 富士通株式会社 はんだペースト、電子部品、及び電子機器
EP4037103A1 (de) * 2015-02-11 2022-08-03 Alpha Assembly Solutions Inc. Elektrisches verbindungsband
US10643863B2 (en) * 2017-08-24 2020-05-05 Advanced Semiconductor Engineering, Inc. Semiconductor package and method of manufacturing the same
JP6967726B2 (ja) * 2018-01-31 2021-11-17 パナソニックＩｐマネジメント株式会社 はんだペーストおよび実装構造体
US11618109B2 (en) 2020-06-30 2023-04-04 Electronics And Telecommunications Research Institute Wire for electric bonding
KR102606877B1 (ko) * 2020-06-30 2023-11-29 한국전자통신연구원 도전 접착용 와이어

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1218257B (de) * 1958-06-25 1966-06-02 Dr Guenther Laubmeyer Verfahren zum Weichloeten mittels Roehrenloetzinn
US3923571A (en) * 1970-12-27 1975-12-02 Nissan Motor Method of using an epoxy-resin-imidazole solder mixture
US3791027A (en) * 1971-06-30 1974-02-12 Ibm Soldering method
US3977916A (en) * 1974-12-20 1976-08-31 Chevron Research Company Wax-flux composition containing alkylaryl sulfonic acid for soldering
US4360144A (en) * 1981-01-21 1982-11-23 Basf Wyandotte Corporation Printed circuit board soldering
JPS5841973A (ja) * 1981-09-07 1983-03-11 東邦レーヨン株式会社 炭素繊維用エマルジヨン型サイジング剤
US4487638A (en) * 1982-11-24 1984-12-11 Burroughs Corporation Semiconductor die-attach technique and composition therefor
JPS6079081A (ja) * 1983-10-07 1985-05-04 Sunstar Giken Kk 二液型接着剤
US4619715A (en) * 1984-09-11 1986-10-28 Scm Corporation Fusible powdered metal paste
US4701481A (en) * 1985-08-26 1987-10-20 The Dow Chemical Company Durable epoxy resin
US4794149A (en) * 1985-12-16 1988-12-27 E. I. Du Pont De Nemours And Company Coating composition containing a hydroxy functional epoxy ester resin
JP2564152B2 (ja) * 1987-10-27 1996-12-18 タムラ化研株式会社 はんだペースト
US4985107A (en) * 1988-03-01 1991-01-15 Sci Systems, Inc. Component location device and method for surface-mount printed circuit boards
JPH02104494A (ja) * 1988-10-07 1990-04-17 Hitachi Chem Co Ltd プリント配線板の半田フラックス前駆体
US4988395A (en) * 1989-01-31 1991-01-29 Senju Metal Industry Co., Ltd. Water-soluble soldering flux and paste solder using the flux
US5145722A (en) * 1989-04-11 1992-09-08 Hughes Aircraft Company Method and composition for protecting and enhancing the solderability of metallic surfaces
JPH0358085A (ja) * 1989-07-27 1991-03-13 Ricoh Co Ltd 簡易掲示装置及び掲示用シートの製造方法
JP2503099B2 (ja) * 1989-08-08 1996-06-05 日本電装株式会社 はんだ付け用フラックス
JPH0692035B2 (ja) * 1989-12-12 1994-11-16 ユーホーケミカル株式会社 フラックス及びはんだペースト用添加剤
US5127968A (en) * 1989-08-16 1992-07-07 Yuho Chemicals Inc. Additive for fluxes and soldering pastes
US4982892A (en) * 1989-11-09 1991-01-08 International Business Machines Corporation Solder interconnects for selective line coupling
US5088189A (en) * 1990-08-31 1992-02-18 Federated Fry Metals Electronic manufacturing process
US5128746A (en) * 1990-09-27 1992-07-07 Motorola, Inc. Adhesive and encapsulant material with fluxing properties
JPH058085A (ja) * 1990-11-30 1993-01-19 Nippondenso Co Ltd はんだ付け用フラツクス
JPH04220192A (ja) * 1990-12-14 1992-08-11 Senju Metal Ind Co Ltd 低残渣はんだペースト
JPH084953B2 (ja) * 1991-04-17 1996-01-24 ユーホーケミカル株式会社 フラックス又ははんだペースト用腐食防止剤
DE4235575C2 (de) * 1992-10-22 1994-11-10 Degussa Weichlotpaste zum Löten von elektronischen Schaltungen
US5297721A (en) * 1992-11-19 1994-03-29 Fry's Metals, Inc. No-clean soldering flux and method using the same
JPH06269980A (ja) * 1993-03-23 1994-09-27 Tdk Corp 接合用導電ペースト
US5417771A (en) * 1994-02-16 1995-05-23 Takeda Chemical Industries, Ltd. Soldering flux
US5571340A (en) * 1994-09-09 1996-11-05 Fry's Metals, Inc. Rosin-free, low VOC, no-clean soldering flux and method using the same

Also Published As

Publication number Publication date
JP3953514B2 (ja) 2007-08-08
DE69636971T2 (de) 2007-12-13
CA2221961A1 (en) 1996-11-28
CA2221961C (en) 2008-02-05
EP0831981B1 (de) 2007-03-14
WO1996037336A1 (en) 1996-11-28
JP2002514973A (ja) 2002-05-21
US5904782A (en) 1999-05-18
TW317519B (de) 1997-10-11
EP0831981A1 (de) 1998-04-01

Similar Documents

Publication Publication Date Title
DE69636971D1 (de) Weichlotflussmittel auf epoxybasis ohne flüchtige organische verbindungen
DE69507196D1 (de) Organische elektrolumineszente Dünnschichtvorrichtung
DE69207053D1 (de) Organische elektroluminescente Vorrichtung
DE69204359D1 (de) Organische elektroluminescente Vorrichtungen.
DE69533659D1 (de) Rot-emittierende organische elektrolumineszente Vorrichtung
DE69310982D1 (de) Organische elektrolumineszente Vorrichtung
DE69420656D1 (de) Organische elektroluminineszente elementen
DE69205766D1 (de) Organischer Feldeffekttransistor.
DE69605968D1 (de) Organische elektrolumineszente Vorrichtung
DE69626808D1 (de) Organische elektrolumineszente vorrichtung
DE69630415D1 (de) Organische elektrolumineszente Vorrichtung
DE69729394D1 (de) Organische elektrolumineszente Vorrichtung
DE69739752D1 (de) Organische elektrolumineszente Vorrichtung
DE69716906D1 (de) Organische elektrolumineszente vorrichtung
DE69707233D1 (de) Organische elektrolumineszente vorrichtung
DE69318462D1 (de) Organische elektrolumineszente Vorrichtung
DE69719136D1 (de) Organische elektrolumineszente vorrichtung
ATE220246T1 (de) Mehrfarbige lichtemittierende organische vorrichtungen
DE69823276D1 (de) Organische elektrolumineszente anzeigevorrichtung
DE69217471D1 (de) Organische elektrolumineszierende Mehrfarbbildanzeigevorrichtung
DE69713410D1 (de) Weiss-ausstrahlende organische Elektrolumineszenzvorrichtungen
DE69402914D1 (de) Luftdestillationseinrichtung
DE69530654D1 (de) Organische elektroluminizente elemente
DE69626454D1 (de) Organisches elektrolumineszentes Element
DE69705345D1 (de) Organische elektrolumineszente Vorrichtung

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee