WO2009069600A1 - はんだ付け用フラックスおよびはんだペースト組成物 - Google Patents

はんだ付け用フラックスおよびはんだペースト組成物 Download PDF

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Publication number
WO2009069600A1
WO2009069600A1 PCT/JP2008/071356 JP2008071356W WO2009069600A1 WO 2009069600 A1 WO2009069600 A1 WO 2009069600A1 JP 2008071356 W JP2008071356 W JP 2008071356W WO 2009069600 A1 WO2009069600 A1 WO 2009069600A1
Authority
WO
WIPO (PCT)
Prior art keywords
soldering
flux
oil
paste composition
ingredient
Prior art date
Application number
PCT/JP2008/071356
Other languages
English (en)
French (fr)
Inventor
Shunsuke Ishikawa
Akira Shinozuka
Masami Aihara
Original Assignee
Harima Chemicals, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harima Chemicals, Inc. filed Critical Harima Chemicals, Inc.
Priority to JP2009543798A priority Critical patent/JP5150911B2/ja
Priority to CN200880103210A priority patent/CN101784366A/zh
Priority to US12/744,597 priority patent/US20100252144A1/en
Priority to KR1020107001047A priority patent/KR101133960B1/ko
Priority to EP08855551A priority patent/EP2223771A4/en
Publication of WO2009069600A1 publication Critical patent/WO2009069600A1/ja

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

　フラックス残渣の粘着性を抑え、高い信頼性を確保しつつ、リフロー時の揮発量を低減して環境負荷の少ないはんだ付けを可能にするはんだ付け用フラックスと、これを用いたはんだペースト組成物とを提供することを課題とする。かかる課題を解決する手段として、本発明のはんだ付け用フラックスは、ベース樹脂、活性剤および溶剤を含有するはんだ付け用フラックスであって、前記溶剤として、沃素価が１２０～１７０である油成分を含有する。好ましくは、前記油成分の含有量はフラックス総量に対して２２～８０重量％である。また、好ましくは、前記油成分は、乾性油および半乾性油の少なくとも一方を含み、より好ましくは、桐油、けし油、くるみ油、紅花油、ひまわり油および大豆油からなる群より選ばれる１種以上を含む。本発明のはんだペースト組成物は、前記はんだ付け用フラックスとはんだ合金粉末とを含有する。
PCT/JP2008/071356 2007-11-27 2008-11-25 はんだ付け用フラックスおよびはんだペースト組成物 WO2009069600A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2009543798A JP5150911B2 (ja) 2007-11-27 2008-11-25 はんだ付け用フラックスおよびはんだペースト組成物
CN200880103210A CN101784366A (zh) 2007-11-27 2008-11-25 钎焊用焊剂及钎焊膏组合物
US12/744,597 US20100252144A1 (en) 2007-11-27 2008-11-25 Soldering flux and solder paste composition
KR1020107001047A KR101133960B1 (ko) 2007-11-27 2008-11-25 납땜용 플럭스 및 땜납 페이스트 조성물
EP08855551A EP2223771A4 (en) 2007-11-27 2008-11-25 FLUX FOR SOLDERING AND SOLDER PASTE COMPOSITION

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007305636 2007-11-27
JP2007-305636 2007-11-27

Publications (1)

Publication Number Publication Date
WO2009069600A1 true WO2009069600A1 (ja) 2009-06-04

Family

ID=40678495

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/071356 WO2009069600A1 (ja) 2007-11-27 2008-11-25 はんだ付け用フラックスおよびはんだペースト組成物

Country Status (7)

Country Link
US (1) US20100252144A1 (ja)
EP (1) EP2223771A4 (ja)
JP (1) JP5150911B2 (ja)
KR (1) KR101133960B1 (ja)
CN (1) CN101784366A (ja)
TW (1) TWI386273B (ja)
WO (1) WO2009069600A1 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8637740B2 (en) 2008-11-04 2014-01-28 Dow Agrosciences, Llc. Omega-9 quality Brassica juncea
WO2014043053A1 (en) 2012-09-11 2014-03-20 Dow Agrosciences Llc Omega-9 canola oil blended with dha
WO2015037107A1 (ja) * 2013-09-12 2015-03-19 千住金属工業株式会社 洗浄用フラックス、洗浄用ソルダペースト及びはんだ継手
JP2017064759A (ja) * 2015-09-30 2017-04-06 株式会社タムラ製作所 フラックス組成物、はんだ組成物および電子基板
JP2018199763A (ja) * 2017-05-26 2018-12-20 協同油脂株式会社 プレスフィット用潤滑剤組成物

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5698444B2 (ja) * 2009-07-27 2015-04-08 東レ・ダウコーニング株式会社 複合硬化シリコーン粉末およびその製造方法
CN102896440B (zh) * 2011-07-26 2016-05-18 刘丽 助焊剂组合物和包含该助焊剂组合物的无铅焊膏
CN102581523B (zh) * 2012-03-21 2015-06-17 北京鹏瑞中联科技有限公司 无卤助焊膏
US20150059928A1 (en) * 2012-04-05 2015-03-05 Senju Metal Industry Co., Ltd. Flux and Solder Paste
JP6079375B2 (ja) * 2013-03-29 2017-02-15 三菱マテリアル株式会社 ハンダ粉末及びその製造方法並びにこの粉末を用いたハンダ用ペースト
JP5974166B2 (ja) * 2013-04-09 2016-08-23 ハリマ化成株式会社 水系アルミニウムろう付組成物
CN104526185A (zh) * 2014-12-02 2015-04-22 苏州优诺电子材料科技有限公司 高稳定性smt低温锡膏助焊剂及其制备方法
JP5790862B1 (ja) * 2014-12-25 2015-10-07 千住金属工業株式会社 やに入りはんだ用フラックス、フラックスコートはんだ用フラックス、やに入りはんだ及びフラックスコートはんだ
CN108225867B (zh) * 2018-02-06 2021-06-29 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） 应用于焊剂残留物的腐蚀性试验的板块制片组件及装置

Citations (8)

* Cited by examiner, † Cited by third party
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JPS63289991A (ja) * 1987-05-22 1988-11-28 Uchihashi Estec Co Ltd チップ型電子部品の固着方法
JPS6485985A (en) 1987-07-06 1989-03-30 Norwich Eaton Pharma Synthesis of aminomethylenephosphonoalkylphosphinates
JPH08132282A (ja) * 1994-11-01 1996-05-28 Sanei Kagaku Kk 半田付け用フラックス
JPH09192883A (ja) * 1996-01-17 1997-07-29 Asahi Chem Res Lab Ltd フラックス組成物
JPH1034383A (ja) * 1996-03-29 1998-02-10 Sophia Syst:Kk はんだを本来の位置でカプセル状に包むための重合性フラックス組成物
JP2001114747A (ja) * 1999-10-18 2001-04-24 Fujifilm Olin Co Ltd 水溶性半田フラックス組成物
JP2002514973A (ja) * 1995-05-24 2002-05-21 フライズ・メタルズ・インコーポレーテッド エポキシ系ｖｏｃ非含有はんだ付け用フラックス
JP2007144446A (ja) 2005-11-25 2007-06-14 Arakawa Chem Ind Co Ltd ハンダ付けフラックス用樹脂エマルジョン、その製造法およびハンダ付けフラックス

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US3266949A (en) * 1964-12-14 1966-08-16 American Can Co Solder flux for a can body
JPS6031502A (ja) * 1983-07-29 1985-02-18 Dainippon Ink & Chem Inc 樹脂組成物
JPS63120779A (ja) * 1986-11-11 1988-05-25 Toray Ind Inc 水なし平版用インキ組成物
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EP0619162A3 (en) * 1993-04-05 1995-12-27 Takeda Chemical Industries Ltd Soft soldering fluid.
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TWI228132B (en) * 2001-09-26 2005-02-21 Nof Corp Soldering flux composition and solder paste
TWI289491B (en) * 2002-04-16 2007-11-11 Tadatomo Suga Reflow soldering method
JP3797990B2 (ja) * 2003-08-08 2006-07-19 株式会社東芝 熱硬化性フラックス及びはんだペースト
JP4276141B2 (ja) * 2004-06-30 2009-06-10 本田技研工業株式会社 防錆組成物
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Publication number Priority date Publication date Assignee Title
JPS63289991A (ja) * 1987-05-22 1988-11-28 Uchihashi Estec Co Ltd チップ型電子部品の固着方法
JPS6485985A (en) 1987-07-06 1989-03-30 Norwich Eaton Pharma Synthesis of aminomethylenephosphonoalkylphosphinates
JPH08132282A (ja) * 1994-11-01 1996-05-28 Sanei Kagaku Kk 半田付け用フラックス
JP2002514973A (ja) * 1995-05-24 2002-05-21 フライズ・メタルズ・インコーポレーテッド エポキシ系ｖｏｃ非含有はんだ付け用フラックス
JPH09192883A (ja) * 1996-01-17 1997-07-29 Asahi Chem Res Lab Ltd フラックス組成物
JPH1034383A (ja) * 1996-03-29 1998-02-10 Sophia Syst:Kk はんだを本来の位置でカプセル状に包むための重合性フラックス組成物
JP2001114747A (ja) * 1999-10-18 2001-04-24 Fujifilm Olin Co Ltd 水溶性半田フラックス組成物
JP2007144446A (ja) 2005-11-25 2007-06-14 Arakawa Chem Ind Co Ltd ハンダ付けフラックス用樹脂エマルジョン、その製造法およびハンダ付けフラックス

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* Cited by examiner, † Cited by third party
Title
See also references of EP2223771A4 *

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8637740B2 (en) 2008-11-04 2014-01-28 Dow Agrosciences, Llc. Omega-9 quality Brassica juncea
WO2014043053A1 (en) 2012-09-11 2014-03-20 Dow Agrosciences Llc Omega-9 canola oil blended with dha
WO2015037107A1 (ja) * 2013-09-12 2015-03-19 千住金属工業株式会社 洗浄用フラックス、洗浄用ソルダペースト及びはんだ継手
JP5850206B2 (ja) * 2013-09-12 2016-02-03 千住金属工業株式会社 洗浄用フラックス及び洗浄用ソルダペースト
KR20160054553A (ko) * 2013-09-12 2016-05-16 센주긴조쿠고교 가부시키가이샤 세정용 플럭스, 세정용 솔더 페이스트 및 납땜 조인트
KR101706521B1 (ko) 2013-09-12 2017-02-13 센주긴조쿠고교 가부시키가이샤 세정용 플럭스 및 세정용 솔더 페이스트
EP3040154A4 (en) * 2013-09-12 2017-04-12 Senju Metal Industry Co., Ltd Cleaning flux, cleaning solder paste, and solder joint
US10259083B2 (en) 2013-09-12 2019-04-16 Senju Metal Industry Co., Ltd. Cleaning flux, cleaning solder paste, and solder joint
JP2017064759A (ja) * 2015-09-30 2017-04-06 株式会社タムラ製作所 フラックス組成物、はんだ組成物および電子基板
JP2018199763A (ja) * 2017-05-26 2018-12-20 協同油脂株式会社 プレスフィット用潤滑剤組成物

Also Published As

Publication number Publication date
TWI386273B (zh) 2013-02-21
CN101784366A (zh) 2010-07-21
US20100252144A1 (en) 2010-10-07
EP2223771A1 (en) 2010-09-01
JPWO2009069600A1 (ja) 2011-04-14
EP2223771A4 (en) 2012-09-26
KR101133960B1 (ko) 2012-04-05
JP5150911B2 (ja) 2013-02-27
KR20100034750A (ko) 2010-04-01
TW200934606A (en) 2009-08-16

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