WO2009069601A1 - はんだ付け用フラックス、はんだペースト組成物およびはんだ付け方法 - Google Patents

はんだ付け用フラックス、はんだペースト組成物およびはんだ付け方法 Download PDF

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Publication number
WO2009069601A1
WO2009069601A1 PCT/JP2008/071357 JP2008071357W WO2009069601A1 WO 2009069601 A1 WO2009069601 A1 WO 2009069601A1 JP 2008071357 W JP2008071357 W JP 2008071357W WO 2009069601 A1 WO2009069601 A1 WO 2009069601A1
Authority
WO
WIPO (PCT)
Prior art keywords
soldering
flux
koh
paste composition
temperatures
Prior art date
Application number
PCT/JP2008/071357
Other languages
English (en)
French (fr)
Inventor
Shunsuke Ishikawa
Akira Shinozuka
Masami Aihara
Original Assignee
Harima Chemicals, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harima Chemicals, Inc. filed Critical Harima Chemicals, Inc.
Priority to US12/744,206 priority Critical patent/US20100243717A1/en
Priority to JP2009543799A priority patent/JP5150912B2/ja
Priority to EP08854783.1A priority patent/EP2221140B1/en
Priority to CN2008801031315A priority patent/CN101784365B/zh
Priority to KR1020107001211A priority patent/KR101142811B1/ko
Publication of WO2009069601A1 publication Critical patent/WO2009069601A1/ja

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3618—Carboxylic acids or salts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

　フラックス残渣の粘着性を抑え、高い信頼性を確保しつつ、リフロー時の揮発量を低減して環境負荷の少ないはんだ付けを可能にするはんだ付け用フラックスを提供する。かかる課題を解決する手段として、本発明のはんだ付け用フラックスは、ベース樹脂、活性剤および溶剤を含有するはんだ付け用フラックスであって、前記溶剤として、２０°C以上で液状である有機酸無水物および２０°C以上で液状である多価アルコールを含有し、かつ、前記有機酸無水物の酸価をＡＶ（ｍｇＫＯＨ／ｇ）、その含有量をＷA（ｇ）とし、前記多価アルコールの水酸基価ＯＨＶ（ｍｇＫＯＨ／ｇ）、その含有量をＷOH（ｇ）としたときに、ＡＶ× ＷA：ＯＨＶ×ＷOH＝１：０．４～０．６である。
PCT/JP2008/071357 2007-11-27 2008-11-25 はんだ付け用フラックス、はんだペースト組成物およびはんだ付け方法 WO2009069601A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US12/744,206 US20100243717A1 (en) 2007-11-27 2008-11-25 Soldering flux, solder paste composition and soldering method
JP2009543799A JP5150912B2 (ja) 2007-11-27 2008-11-25 はんだ付け用フラックス、はんだペースト組成物およびはんだ付け方法
EP08854783.1A EP2221140B1 (en) 2007-11-27 2008-11-25 Flux for soldering, soldering paste composition, and method of soldering
CN2008801031315A CN101784365B (zh) 2007-11-27 2008-11-25 钎焊用焊剂、钎焊膏组合物及钎焊方法
KR1020107001211A KR101142811B1 (ko) 2007-11-27 2008-11-25 납땜용 플럭스, 땜납 페이스트 조성물 및 납땜 방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007305637 2007-11-27
JP2007-305637 2007-11-27

Publications (1)

Publication Number Publication Date
WO2009069601A1 true WO2009069601A1 (ja) 2009-06-04

Family

ID=40678496

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/071357 WO2009069601A1 (ja) 2007-11-27 2008-11-25 はんだ付け用フラックス、はんだペースト組成物およびはんだ付け方法

Country Status (7)

Country Link
US (1) US20100243717A1 (ja)
EP (1) EP2221140B1 (ja)
JP (1) JP5150912B2 (ja)
KR (1) KR101142811B1 (ja)
CN (1) CN101784365B (ja)
TW (1) TW200932413A (ja)
WO (1) WO2009069601A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011124190A2 (en) 2010-04-06 2011-10-13 Zentiva, K.S. Method of producing 4-(2-(substituted)-1-(1-hydroxycyclohexyl)ethyl)phenols by o- demethylation of their methylethers by means of inodorous aromatic thiols
JP2016179496A (ja) * 2015-03-25 2016-10-13 ハリマ化成株式会社 はんだ付け用フラックスおよびはんだペースト組成物
JP6337349B1 (ja) * 2017-08-28 2018-06-06 株式会社弘輝 フラックス、ソルダペースト及び電子回路基板の製造方法
WO2020031693A1 (ja) * 2018-08-10 2020-02-13 株式会社弘輝 フラックス及びソルダペースト

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103212918A (zh) * 2013-03-22 2013-07-24 宁波市鄞州品达电器焊料有限公司 一种无铅焊料助焊混合物
JP6079375B2 (ja) * 2013-03-29 2017-02-15 三菱マテリアル株式会社 ハンダ粉末及びその製造方法並びにこの粉末を用いたハンダ用ペースト
JP5974166B2 (ja) * 2013-04-09 2016-08-23 ハリマ化成株式会社 水系アルミニウムろう付組成物
CN103862198B (zh) * 2014-03-24 2016-08-17 吉安谊盛电子材料有限公司 一种太阳能自动焊接专用助焊剂
EP3225351B1 (en) * 2016-03-30 2020-05-06 General Electric Company Brazing compositions for ductile braze structures, and related processes and devices

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63289991A (ja) * 1987-05-22 1988-11-28 Uchihashi Estec Co Ltd チップ型電子部品の固着方法
JPS6485985A (en) 1987-07-06 1989-03-30 Norwich Eaton Pharma Synthesis of aminomethylenephosphonoalkylphosphinates
JPH08132282A (ja) * 1994-11-01 1996-05-28 Sanei Kagaku Kk 半田付け用フラックス
JPH09192883A (ja) * 1996-01-17 1997-07-29 Asahi Chem Res Lab Ltd フラックス組成物
JPH1034383A (ja) * 1996-03-29 1998-02-10 Sophia Syst:Kk はんだを本来の位置でカプセル状に包むための重合性フラックス組成物
JP2001114747A (ja) * 1999-10-18 2001-04-24 Fujifilm Olin Co Ltd 水溶性半田フラックス組成物
JP2002514973A (ja) * 1995-05-24 2002-05-21 フライズ・メタルズ・インコーポレーテッド エポキシ系ｖｏｃ非含有はんだ付け用フラックス
JP2007144446A (ja) 2005-11-25 2007-06-14 Arakawa Chem Ind Co Ltd ハンダ付けフラックス用樹脂エマルジョン、その製造法およびハンダ付けフラックス

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US3448512A (en) * 1968-08-26 1969-06-10 Electronic Eng Co California Method of soldering
DE2846809A1 (de) * 1978-10-27 1980-05-08 Bayer Ag Verfahren zur herstellung von polyurethankunststoffen
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TWI228132B (en) * 2001-09-26 2005-02-21 Nof Corp Soldering flux composition and solder paste
WO2004108345A1 (ja) * 2003-06-09 2004-12-16 Senju Metal Industry Co., Ltd. ソルダペースト
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Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63289991A (ja) * 1987-05-22 1988-11-28 Uchihashi Estec Co Ltd チップ型電子部品の固着方法
JPS6485985A (en) 1987-07-06 1989-03-30 Norwich Eaton Pharma Synthesis of aminomethylenephosphonoalkylphosphinates
JPH08132282A (ja) * 1994-11-01 1996-05-28 Sanei Kagaku Kk 半田付け用フラックス
JP2002514973A (ja) * 1995-05-24 2002-05-21 フライズ・メタルズ・インコーポレーテッド エポキシ系ｖｏｃ非含有はんだ付け用フラックス
JPH09192883A (ja) * 1996-01-17 1997-07-29 Asahi Chem Res Lab Ltd フラックス組成物
JPH1034383A (ja) * 1996-03-29 1998-02-10 Sophia Syst:Kk はんだを本来の位置でカプセル状に包むための重合性フラックス組成物
JP2001114747A (ja) * 1999-10-18 2001-04-24 Fujifilm Olin Co Ltd 水溶性半田フラックス組成物
JP2007144446A (ja) 2005-11-25 2007-06-14 Arakawa Chem Ind Co Ltd ハンダ付けフラックス用樹脂エマルジョン、その製造法およびハンダ付けフラックス

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011124190A2 (en) 2010-04-06 2011-10-13 Zentiva, K.S. Method of producing 4-(2-(substituted)-1-(1-hydroxycyclohexyl)ethyl)phenols by o- demethylation of their methylethers by means of inodorous aromatic thiols
JP2016179496A (ja) * 2015-03-25 2016-10-13 ハリマ化成株式会社 はんだ付け用フラックスおよびはんだペースト組成物
JP6337349B1 (ja) * 2017-08-28 2018-06-06 株式会社弘輝 フラックス、ソルダペースト及び電子回路基板の製造方法
JP2019038026A (ja) * 2017-08-28 2019-03-14 株式会社弘輝 フラックス、ソルダペースト及び電子回路基板の製造方法
KR20190112848A (ko) * 2017-08-28 2019-10-07 가부시키가이샤 코키 플럭스, 솔더 페이스트 및 전자 회로 기판의 제조 방법
KR102103966B1 (ko) 2017-08-28 2020-04-23 가부시키가이샤 코키 플럭스, 솔더 페이스트 및 전자 회로 기판의 제조 방법
US11825612B2 (en) 2017-08-28 2023-11-21 Koki Company Limited Flux, solder paste, and method for producing electric circuit board
WO2020031693A1 (ja) * 2018-08-10 2020-02-13 株式会社弘輝 フラックス及びソルダペースト
US11833622B2 (en) 2018-08-10 2023-12-05 Koki Company Limited Flux and solder paste

Also Published As

Publication number Publication date
EP2221140A1 (en) 2010-08-25
TW200932413A (en) 2009-08-01
TWI370037B (ja) 2012-08-11
CN101784365B (zh) 2012-09-05
JP5150912B2 (ja) 2013-02-27
KR101142811B1 (ko) 2012-05-08
US20100243717A1 (en) 2010-09-30
JPWO2009069601A1 (ja) 2011-04-14
KR20100034751A (ko) 2010-04-01
EP2221140A4 (en) 2011-08-03
EP2221140B1 (en) 2013-09-25
CN101784365A (zh) 2010-07-21

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