DE69635124D1 - Plasmabearbeitungsgerät - Google Patents

Plasmabearbeitungsgerät

Info

Publication number
DE69635124D1
DE69635124D1 DE69635124T DE69635124T DE69635124D1 DE 69635124 D1 DE69635124 D1 DE 69635124D1 DE 69635124 T DE69635124 T DE 69635124T DE 69635124 T DE69635124 T DE 69635124T DE 69635124 D1 DE69635124 D1 DE 69635124D1
Authority
DE
Germany
Prior art keywords
processing apparatus
plasma processing
plasma
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69635124T
Other languages
English (en)
Other versions
DE69635124T2 (de
Inventor
Ken Etsu Yokogawa
Tetsuo Ono
Kazunori Tsujimoto
Naoshi Itabashi
Masahito Mori
Shinichi Tachi
Keizo Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP7326824A external-priority patent/JPH09102400A/ja
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of DE69635124D1 publication Critical patent/DE69635124D1/de
Publication of DE69635124T2 publication Critical patent/DE69635124T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3266—Magnetic control means
    • H01J37/32678—Electron cyclotron resonance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192—Microwave generated discharge
    • H01J37/32211—Means for coupling power to the plasma
    • H01J37/3222—Antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/334—Etching
    • H01J2237/3341—Reactive etching

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Plasma Technology (AREA)
  • Drying Of Semiconductors (AREA)
DE69635124T 1995-12-15 1996-12-12 Plasmabearbeitungsgerät Expired - Lifetime DE69635124T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP7326824A JPH09102400A (ja) 1995-07-31 1995-12-15 マイクロ波プラズマを使用するプロセス装置
JP32682495 1995-12-15
JP7585496 1996-03-29
JP7585496 1996-03-29

Publications (2)

Publication Number Publication Date
DE69635124D1 true DE69635124D1 (de) 2005-10-06
DE69635124T2 DE69635124T2 (de) 2006-07-13

Family

ID=26417017

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69635124T Expired - Lifetime DE69635124T2 (de) 1995-12-15 1996-12-12 Plasmabearbeitungsgerät

Country Status (5)

Country Link
US (2) US5891252A (de)
EP (1) EP0779644B1 (de)
KR (1) KR100472582B1 (de)
DE (1) DE69635124T2 (de)
TW (1) TW312815B (de)

Families Citing this family (60)

* Cited by examiner, † Cited by third party
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JP3257328B2 (ja) 1995-03-16 2002-02-18 株式会社日立製作所 プラズマ処理装置及びプラズマ処理方法
JPH10172792A (ja) * 1996-12-05 1998-06-26 Tokyo Electron Ltd プラズマ処理装置
US6158384A (en) * 1997-06-05 2000-12-12 Applied Materials, Inc. Plasma reactor with multiple small internal inductive antennas
US6071372A (en) * 1997-06-05 2000-06-06 Applied Materials, Inc. RF plasma etch reactor with internal inductive coil antenna and electrically conductive chamber walls
JPH11135438A (ja) * 1997-10-28 1999-05-21 Nippon Asm Kk 半導体プラズマ処理装置
JPH11317299A (ja) * 1998-02-17 1999-11-16 Toshiba Corp 高周波放電方法及びその装置並びに高周波処理装置
JP4066214B2 (ja) * 1998-07-24 2008-03-26 財団法人国際科学振興財団 プラズマプロセス装置
US6225592B1 (en) * 1998-09-15 2001-05-01 Astex-Plasmaquest, Inc. Method and apparatus for launching microwave energy into a plasma processing chamber
DE19851628B4 (de) * 1998-11-10 2004-04-15 Attila M. Dipl.-Phys. Bilgic Streifenleitungsanordnung mit integrierten Gaszuführungen für mikrowelleninduzierte Plasmaquellen zur Anwendung in der analytischen Atomspektrometrie
KR20010080572A (ko) * 1998-11-26 2001-08-22 가나이 쓰토무 드라이 에칭 장치 및 드라이 에칭 방법
JP3542514B2 (ja) * 1999-01-19 2004-07-14 株式会社日立製作所 ドライエッチング装置
KR100880767B1 (ko) * 1999-05-06 2009-02-02 도쿄엘렉트론가부시키가이샤 플라즈마 처리 장치
US20050061445A1 (en) * 1999-05-06 2005-03-24 Tokyo Electron Limited Plasma processing apparatus
EP1879213B1 (de) * 1999-05-26 2012-03-14 Tokyo Electron Limited Plasmabearbeitungsvorrichtung
US6310577B1 (en) * 1999-08-24 2001-10-30 Bethel Material Research Plasma processing system with a new inductive antenna and hybrid coupling of electronagnetic power
US6716758B1 (en) * 1999-08-25 2004-04-06 Micron Technology, Inc. Aspect ratio controlled etch selectivity using time modulated DC bias voltage
US6504159B1 (en) 1999-09-14 2003-01-07 International Business Machines Corporation SOI plasma source ion implantation
DE19955671B4 (de) * 1999-11-19 2004-07-22 Muegge Electronic Gmbh Vorrichtung zur Erzeugung von Plasma
JP4678905B2 (ja) * 1999-12-20 2011-04-27 徳芳 佐藤 プラズマ処理装置
WO2001052302A1 (en) * 2000-01-10 2001-07-19 Tokyo Electron Limited Segmented electrode assembly and method for plasma processing
JP2001267305A (ja) 2000-03-17 2001-09-28 Hitachi Ltd プラズマ処理装置
JP4454781B2 (ja) * 2000-04-18 2010-04-21 東京エレクトロン株式会社 プラズマ処理装置
TW521386B (en) * 2000-06-28 2003-02-21 Mitsubishi Heavy Ind Ltd Hexagonal boron nitride film with low dielectric constant, layer dielectric film and method of production thereof, and plasma CVD apparatus
US6875366B2 (en) * 2000-09-12 2005-04-05 Hitachi, Ltd. Plasma processing apparatus and method with controlled biasing functions
JP3764639B2 (ja) 2000-09-13 2006-04-12 株式会社日立製作所 プラズマ処理装置および半導体装置の製造方法
US6806201B2 (en) * 2000-09-29 2004-10-19 Hitachi, Ltd. Plasma processing apparatus and method using active matching
JP2002134472A (ja) * 2000-10-20 2002-05-10 Mitsubishi Electric Corp エッチング方法、エッチング装置および半導体装置の製造方法
JP3897582B2 (ja) * 2000-12-12 2007-03-28 キヤノン株式会社 真空処理方法、真空処理装置、半導体装置の製造方法および半導体装置
JP4109861B2 (ja) * 2000-12-12 2008-07-02 キヤノン株式会社 真空処理方法
WO2002056649A1 (fr) * 2000-12-27 2002-07-18 Japan Science And Technology Corporation Generateur plasma
CN1293789C (zh) * 2001-01-18 2007-01-03 东京毅力科创株式会社 等离子体装置及等离子体生成方法
JP3625197B2 (ja) * 2001-01-18 2005-03-02 東京エレクトロン株式会社 プラズマ装置およびプラズマ生成方法
JP4035298B2 (ja) * 2001-07-18 2008-01-16 キヤノン株式会社 プラズマ処理方法、半導体装置の製造方法および半導体装置
JP4209612B2 (ja) 2001-12-19 2009-01-14 東京エレクトロン株式会社 プラズマ処理装置
WO2003077299A1 (fr) * 2002-03-08 2003-09-18 Tokyo Electron Limited Dispositif a plasma
AU2003236307A1 (en) * 2002-04-08 2003-10-20 Kabushiki Kaisha Toshiba Plasma etching method and plasma etching device
JP3776856B2 (ja) * 2002-09-13 2006-05-17 株式会社日立ハイテクノロジーズ プラズマ処理装置およびプラズマ処理方法
US7511246B2 (en) 2002-12-12 2009-03-31 Perkinelmer Las Inc. Induction device for generating a plasma
US7273638B2 (en) * 2003-01-07 2007-09-25 International Business Machines Corp. High density plasma oxidation
KR101007822B1 (ko) * 2003-07-14 2011-01-13 주성엔지니어링(주) 혼합형 플라즈마 발생 장치
US7305935B1 (en) 2004-08-25 2007-12-11 The United States Of America As Represented By The Administration Of Nasa Slotted antenna waveguide plasma source
AU2006223254B2 (en) 2005-03-11 2012-04-26 Perkinelmer U.S. Llc Plasmas and methods of using them
US7742167B2 (en) 2005-06-17 2010-06-22 Perkinelmer Health Sciences, Inc. Optical emission device with boost device
US8622735B2 (en) * 2005-06-17 2014-01-07 Perkinelmer Health Sciences, Inc. Boost devices and methods of using them
DE112007001152T5 (de) * 2006-05-08 2009-04-02 Panasonic Corporation Vorrichtung und Verfahren zum Erzeugen von Atmosphärendruckplasma
CN101385129B (zh) * 2006-07-28 2011-12-28 东京毅力科创株式会社 微波等离子体源和等离子体处理装置
WO2008024392A2 (en) 2006-08-22 2008-02-28 Valery Godyak Inductive plasma source with high coupling efficiency
US8992725B2 (en) * 2006-08-28 2015-03-31 Mattson Technology, Inc. Plasma reactor with inductie excitation of plasma and efficient removal of heat from the excitation coil
US20100183827A1 (en) * 2007-06-11 2010-07-22 Tokyo Electron Limited Plasma processing apparatus and plasma processing method
JP5073545B2 (ja) * 2008-03-26 2012-11-14 東京エレクトロン株式会社 プラズマ処理装置、プラズマ処理方法
JP5213530B2 (ja) * 2008-06-11 2013-06-19 東京エレクトロン株式会社 プラズマ処理装置
JP5478058B2 (ja) * 2008-12-09 2014-04-23 国立大学法人東北大学 プラズマ処理装置
TWI393489B (zh) * 2009-06-17 2013-04-11 High density microwave and ultra high frequency mixed type plasma coating device
JP5642181B2 (ja) * 2009-08-21 2014-12-17 マットソン テクノロジー インコーポレイテッドＭａｔｔｓｏｎ Ｔｅｃｈｎｏｌｏｇｙ， Ｉｎｃ． 基体を処理する装置及び基体の処理方法
KR101147349B1 (ko) * 2010-09-17 2012-05-23 인제대학교 산학협력단 누설 전류형 변압기를 이용한 플라즈마 처리장치
US20120160841A1 (en) 2010-12-23 2012-06-28 Eastman Chemical Company Wood heater with enhanced microwave choke system
CA2879076C (en) 2012-07-13 2020-11-10 Perkinelmer Health Sciences, Inc. Torches and methods of using them
WO2014159588A1 (en) * 2013-03-13 2014-10-02 Radom Corporation Plasma generator using dielectric resonator
DE102015004414A1 (de) * 2015-04-02 2016-10-06 Centrotherm Photovoltaics Ag Plasma-Behandlungsvorrichtung für Wafer
CN111092008A (zh) * 2018-10-24 2020-05-01 江苏鲁汶仪器有限公司 一种感应耦合等离子体刻蚀设备及刻蚀方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06104898B2 (ja) * 1988-01-13 1994-12-21 忠弘 大見 減圧表面処理装置
JPH03122294A (ja) 1989-10-04 1991-05-24 Nec Corp エッチング装置
JP2972477B2 (ja) * 1993-01-27 1999-11-08 日本電気株式会社 Ｒｆ・ｅｃｒプラズマエッチング装置
TW273067B (de) * 1993-10-04 1996-03-21 Tokyo Electron Co Ltd
JP2641390B2 (ja) 1994-05-12 1997-08-13 日本電気株式会社 プラズマ処理装置
KR100290813B1 (ko) * 1995-08-17 2001-06-01 히가시 데쓰로 플라스마 처리장치

Also Published As

Publication number Publication date
EP0779644A3 (de) 1997-10-01
KR100472582B1 (ko) 2005-09-12
KR970058391A (ko) 1997-07-31
TW312815B (de) 1997-08-11
US6033481A (en) 2000-03-07
US5891252A (en) 1999-04-06
DE69635124T2 (de) 2006-07-13
EP0779644B1 (de) 2005-08-31
EP0779644A2 (de) 1997-06-18

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Legal Events

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