DE69512132T2 - Trägerplattevorrichtung und Belichtungsapparat unter Verwendung derselben - Google Patents

Trägerplattevorrichtung und Belichtungsapparat unter Verwendung derselben

Info

Publication number
DE69512132T2
DE69512132T2 DE69512132T DE69512132T DE69512132T2 DE 69512132 T2 DE69512132 T2 DE 69512132T2 DE 69512132 T DE69512132 T DE 69512132T DE 69512132 T DE69512132 T DE 69512132T DE 69512132 T2 DE69512132 T2 DE 69512132T2
Authority
DE
Germany
Prior art keywords
same
exposure apparatus
carrier plate
plate device
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69512132T
Other languages
English (en)
Other versions
DE69512132D1 (de
Inventor
Nobushige Korenaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of DE69512132D1 publication Critical patent/DE69512132D1/de
Application granted granted Critical
Publication of DE69512132T2 publication Critical patent/DE69512132T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Non-Mechanical Conveyors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE69512132T 1994-05-19 1995-05-17 Trägerplattevorrichtung und Belichtungsapparat unter Verwendung derselben Expired - Lifetime DE69512132T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP12978594 1994-05-19
JP13474495A JP3363662B2 (ja) 1994-05-19 1995-05-08 走査ステージ装置およびこれを用いた露光装置

Publications (2)

Publication Number Publication Date
DE69512132D1 DE69512132D1 (de) 1999-10-21
DE69512132T2 true DE69512132T2 (de) 2000-03-30

Family

ID=26465072

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69512132T Expired - Lifetime DE69512132T2 (de) 1994-05-19 1995-05-17 Trägerplattevorrichtung und Belichtungsapparat unter Verwendung derselben

Country Status (5)

Country Link
US (2) US6177978B1 (de)
EP (1) EP0684523B1 (de)
JP (1) JP3363662B2 (de)
KR (1) KR0167850B1 (de)
DE (1) DE69512132T2 (de)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3363662B2 (ja) * 1994-05-19 2003-01-08 キヤノン株式会社 走査ステージ装置およびこれを用いた露光装置
JP3815750B2 (ja) * 1995-10-09 2006-08-30 キヤノン株式会社 ステージ装置、ならびに前記ステージ装置を用いた露光装置およびデバイス製造方法
US6128069A (en) * 1997-03-13 2000-10-03 Canon Kabushiki Kaisha Stage mechanism for exposure apparatus
JP3526202B2 (ja) * 1998-02-03 2004-05-10 キヤノン株式会社 ステージ装置、およびこれを用いた露光装置、ならびにデバイス製造方法
WO2000014779A1 (fr) * 1998-09-03 2000-03-16 Nikon Corporation Appareil et procede d'exposition, dispositif et procede de production dudit appareil
JP2001230305A (ja) 2000-02-18 2001-08-24 Canon Inc 支持装置
US6710850B2 (en) * 2000-12-22 2004-03-23 Nikon Corporation Exposure apparatus and exposure method
WO2002059337A1 (en) * 2001-01-26 2002-08-01 Georgetown University School Of Medicine Anti-apoptopic gene scc-s2 and diagnostic and therapeutic uses thereof
US6989887B2 (en) 2001-06-06 2006-01-24 Nikon Corporation Dual force mode fine stage apparatus
JP2003022960A (ja) * 2001-07-09 2003-01-24 Canon Inc ステージ装置及びその駆動方法
EP1300932B1 (de) * 2001-10-05 2013-12-18 Canon Kabushiki Kaisha Linearmotor, Trägersystem und Belichtungssystem mit einem solchen Linearmotor
JP3977086B2 (ja) * 2002-01-18 2007-09-19 キヤノン株式会社 ステージシステム
DE60332681D1 (de) * 2002-01-22 2010-07-08 Ebara Corp Trägerplattevorrichtung
JP4323759B2 (ja) * 2002-05-27 2009-09-02 キヤノン株式会社 露光装置およびデバイス製造方法
JP3849932B2 (ja) * 2002-08-12 2006-11-22 キヤノン株式会社 移動ステージ装置
JP3826087B2 (ja) * 2002-08-30 2006-09-27 キヤノン株式会社 位置決め装置、荷電粒子線露光装置
JP2004172557A (ja) 2002-11-22 2004-06-17 Canon Inc ステージ装置及びその制御方法
JP4227452B2 (ja) * 2002-12-27 2009-02-18 キヤノン株式会社 位置決め装置、及びその位置決め装置を利用した露光装置
JP4194383B2 (ja) * 2003-02-13 2008-12-10 キヤノン株式会社 リニアモータ
JP4143438B2 (ja) * 2003-02-24 2008-09-03 キヤノン株式会社 支持装置、露光装置、デバイス製造方法
JP2004364392A (ja) * 2003-06-03 2004-12-24 Canon Inc リニアモータ、及びこれを備えるステージ装置、露光装置並びにデバイス製造方法
JP2005142501A (ja) * 2003-11-10 2005-06-02 Canon Inc ステージ装置および露光装置ならびにデバイス製造方法
US20050169784A1 (en) * 2004-02-02 2005-08-04 Poon Alex K.T. Force provider for a mover assembly of a stage assembly
US20070131879A1 (en) * 2004-02-02 2007-06-14 Nikon Corporation Force provider with adjustable force characteristics for a stage assembly
JP4418699B2 (ja) * 2004-03-24 2010-02-17 キヤノン株式会社 露光装置
JP2005317916A (ja) * 2004-03-30 2005-11-10 Canon Inc 露光装置及びデバイス製造方法
US7497018B2 (en) 2006-05-26 2009-03-03 William Hersey Laser-based alignment tool
JP4130837B2 (ja) * 2006-06-16 2008-08-06 住友重機械工業株式会社 ステージ用反力処理装置
JP5020597B2 (ja) * 2006-10-27 2012-09-05 キヤノン株式会社 位置決め装置、露光装置、及びデバイス製造方法
JP2009016385A (ja) * 2007-06-29 2009-01-22 Canon Inc ステージ装置、露光装置及びデバイス製造方法
US9298106B1 (en) * 2011-09-07 2016-03-29 Kla-Tencor Corporation Wafer stage with reciprocating wafer stage actuation control
JP5910992B2 (ja) * 2012-04-04 2016-04-27 株式会社ニコン 移動体装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
CN103869629B (zh) * 2012-12-13 2016-03-16 中芯国际集成电路制造(上海)有限公司 光刻系统以及光刻方法
CN103454864B (zh) * 2013-08-30 2016-02-03 清华大学 一种粗精动一体的磁浮掩膜台系统
CN104122759A (zh) 2014-04-28 2014-10-29 清华大学 一种平面电动机驱动的磁悬浮粗微动一体掩模台

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DE3620969A1 (de) 1985-06-24 1987-01-02 Canon Kk Praezisionszufuehrmechanismus
US4764815A (en) 1985-06-24 1988-08-16 Powers Chemco Array scanning system with movable platen
US4675582A (en) * 1985-12-24 1987-06-23 E. I. Du Pont De Nemours And Company System useful for controlling multiple synchronous secondaries of a linear motor along an elongated path
US4993696A (en) 1986-12-01 1991-02-19 Canon Kabushiki Kaisha Movable stage mechanism
NL9100407A (nl) * 1991-03-07 1992-10-01 Philips Nv Optisch lithografische inrichting met een krachtgecompenseerd machinegestel.
DE4123323C2 (de) * 1991-07-13 1994-02-10 Andreas Ehlerding Werkzeugträger
JP2714502B2 (ja) * 1991-09-18 1998-02-16 キヤノン株式会社 移動ステージ装置
US5298939A (en) * 1991-11-04 1994-03-29 Swanson Paul A Method and apparatus for transfer of a reticle pattern onto a substrate by scanning
US5477304A (en) * 1992-10-22 1995-12-19 Nikon Corporation Projection exposure apparatus
JP3277581B2 (ja) * 1993-02-01 2002-04-22 株式会社ニコン ステージ装置および露光装置
KR0139039B1 (ko) 1993-06-30 1998-06-01 미타라이 하지메 노광장치와 이것을 이용한 디바이스 제조방법
JP3226704B2 (ja) 1994-03-15 2001-11-05 キヤノン株式会社 露光装置
US5874820A (en) * 1995-04-04 1999-02-23 Nikon Corporation Window frame-guided stage mechanism
US5465827A (en) * 1994-04-26 1995-11-14 Daifuku Co., Ltd. Transport arrangement for movable members
JP3363662B2 (ja) * 1994-05-19 2003-01-08 キヤノン株式会社 走査ステージ装置およびこれを用いた露光装置
TW318255B (de) 1995-05-30 1997-10-21 Philips Electronics Nv

Also Published As

Publication number Publication date
EP0684523B1 (de) 1999-09-15
KR0167850B1 (ko) 1999-01-15
JP3363662B2 (ja) 2003-01-08
DE69512132D1 (de) 1999-10-21
US6426788B1 (en) 2002-07-30
KR950033696A (ko) 1995-12-26
US6177978B1 (en) 2001-01-23
EP0684523A1 (de) 1995-11-29
JPH0837151A (ja) 1996-02-06

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