KR950033696A - 스테이지장치 및 이를 사용한 노광장치 - Google Patents

스테이지장치 및 이를 사용한 노광장치 Download PDF

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KR950033696A
KR950033696A KR1019950012553A KR19950012553A KR950033696A KR 950033696 A KR950033696 A KR 950033696A KR 1019950012553 A KR1019950012553 A KR 1019950012553A KR 19950012553 A KR19950012553 A KR 19950012553A KR 950033696 A KR950033696 A KR 950033696A
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South Korea
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thrust generating
traveling
supporting
generating means
passage
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KR1019950012553A
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KR0167850B1 (ko
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노부시게 코레나가
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미타라이 하지메
캐논 가부시기가이샤
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Non-Mechanical Conveyors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

본 발명은, 일정속도 주행영역과 가속영역을 지닌 통로를 따라 주행하는 주행대와, 상기 통로의 가속영역에서 주행대를 가속 및 주행하는 제1추력발생계와, 상기 통로의 일정속도주행영역에서 일정속도로 주행대를 주행하는, 제1추력발생기와는 개별인 제2추력발생계를 포함하는 스테이지장치 및 이를 이용한 노광장치에 관한 것이다.

Description

스테이지장치 및 이를 사용한 노광장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제5도는 본 발명의 하나에 의한 스테이지장치를 지닌 주사형노광장치의 일실시예의 개략도.

Claims (11)

  1. 일정속도주행영역과 가속영역을 지닌 통로를 따라 주행가능한 주행대과, 상기 통로의 가속영역에서 상기 주행대를 가속 및 주행하는 제1추력발생수단과, 상기 통로의 상기 일정속도주행영역에서 일정속도로 상기 주행대를 주행하는, 상기 제1추력발생수단과 개별인 제2추력발생수단으로 이루어진 스테이지장치.
  2. 제1항에 있어서, 상기 가속은 정가속과 부가속 중 하나인 것을 특징으로 하는 스테이지장치.
  3. 제1항에 있어서, 상기 제1추력발생수단은 상기 통로의 양측에 배치된 소자를 지닌 선형모터수단을 포함하는 것을 특징으로 하는 스테이지장치.
  4. 제1항에 있어서, 상기 제1추력발생수단은 상기 통로의 양측에 배치된 스프링을 지닌 추력발생 메카니즘을 포함하는 것을 특징으로 하는 스테이지장치.
  5. 제1항에 있어서, 상기 제2추력발생수단은 선형모터로 이루어진 것을 특징으로 하는 스테이지장치.
  6. 제1항에 있어서, 상기 주행대를 지지하는 제1지지수단과, 상기 제1추력발생수단을 지지하는 제2지지수단과, 상기 제2추력발생수단을 지지하는 제3지지수단을 추가로 구성하는 스테이지장치에 있어서, 상기 제1지지수단은 상기 제2지지수단과 제3지지수단 중 적어도 하나와 독립된 것을 특징으로 하는 스테이지장치.
  7. 제1항에 있어서, 상기 제1추력발생수단에 의해 상기 주행대에서 발생하는 모덴트를 상쇄하도록 작용가능한 제3추력발생수단을 추가로 구성한 것을 특징으로 하는 스테이지장치.
  8. 제1항 내지 7항 중 한 항에서 인용된, 객체를 지지하는 스테이지장치와, 상기 스테이지장치에 의해 지지된 객체를 노광하는 노광수단으로 이루어진 객체노광용 노광장치.
  9. 제8항에 있어서, 상기 노광수단은 상기 스테이지장치에 의해 객체를 주행하는 동안에 객체를 노광하는 것을 특징으로 하는 노광장치.
  10. 제8항에 있어서, 상기 객체는 레티클과 웨이퍼 중 하나인 것을 특징으로 하는 노광장치.
  11. 제8항 내지 제10항 중 하나에서 인용된 노광장치를 이용하여 마이크로소자를 제조하는 소자제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950012553A 1994-05-19 1995-05-19 스테이지장치 및 이를 사용한 노광장치 KR0167850B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP12978594 1994-05-19
JP94-129785 1994-05-19
JP95-134744 1995-05-08
JP13474495A JP3363662B2 (ja) 1994-05-19 1995-05-08 走査ステージ装置およびこれを用いた露光装置

Publications (2)

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KR950033696A true KR950033696A (ko) 1995-12-26
KR0167850B1 KR0167850B1 (ko) 1999-01-15

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US (2) US6177978B1 (ko)
EP (1) EP0684523B1 (ko)
JP (1) JP3363662B2 (ko)
KR (1) KR0167850B1 (ko)
DE (1) DE69512132T2 (ko)

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Also Published As

Publication number Publication date
US6177978B1 (en) 2001-01-23
KR0167850B1 (ko) 1999-01-15
DE69512132T2 (de) 2000-03-30
EP0684523B1 (en) 1999-09-15
JPH0837151A (ja) 1996-02-06
JP3363662B2 (ja) 2003-01-08
US6426788B1 (en) 2002-07-30
EP0684523A1 (en) 1995-11-29
DE69512132D1 (de) 1999-10-21

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