DE69408558D1 - Verwendung einer anisotropischen leitfähigen Schicht für die Verbindung von Anschlussleitern einer Leiterplatte mit den elektrischen Anschlusskontakten einer photoelektrischen Umwandlungsvorrichtung und Verfahren zur Montage dieser Vorrichtung - Google Patents
Verwendung einer anisotropischen leitfähigen Schicht für die Verbindung von Anschlussleitern einer Leiterplatte mit den elektrischen Anschlusskontakten einer photoelektrischen Umwandlungsvorrichtung und Verfahren zur Montage dieser VorrichtungInfo
- Publication number
- DE69408558D1 DE69408558D1 DE69408558T DE69408558T DE69408558D1 DE 69408558 D1 DE69408558 D1 DE 69408558D1 DE 69408558 T DE69408558 T DE 69408558T DE 69408558 T DE69408558 T DE 69408558T DE 69408558 D1 DE69408558 D1 DE 69408558D1
- Authority
- DE
- Germany
- Prior art keywords
- assembling
- circuit board
- conductive layer
- printed circuit
- photoelectric conversion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000006243 chemical reaction Methods 0.000 title 1
- 239000004020 conductor Substances 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/02002—Arrangements for conducting electric current to or from the device in operations
- H01L31/02005—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02327—Optical elements or arrangements associated with the device the optical elements being integrated or being directly associated to the device, e.g. back reflectors
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/555—Constructional details for picking-up images in sites, inaccessible due to their dimensions or hazardous conditions, e.g. endoscopes or borescopes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Solid State Image Pick-Up Elements (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12676393 | 1993-05-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69408558D1 true DE69408558D1 (de) | 1998-03-26 |
DE69408558T2 DE69408558T2 (de) | 1998-07-23 |
Family
ID=14943327
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69408558T Expired - Fee Related DE69408558T2 (de) | 1993-05-28 | 1994-05-25 | Verwendung einer anisotropischen leitfähigen Schicht für die Verbindung von Anschlussleitern einer Leiterplatte mit den elektrischen Anschlusskontakten einer photoelektrischen Umwandlungsvorrichtung und Verfahren zur Montage dieser Vorrichtung |
Country Status (4)
Country | Link |
---|---|
US (2) | US5506401A (de) |
EP (1) | EP0630056B1 (de) |
KR (1) | KR0172142B1 (de) |
DE (1) | DE69408558T2 (de) |
Families Citing this family (78)
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JPH04242939A (ja) * | 1990-12-13 | 1992-08-31 | Citizen Watch Co Ltd | 半導体装置の実装構造およびその製造方法 |
JPH0513497A (ja) * | 1991-06-28 | 1993-01-22 | Toshiba Corp | 半導体取付装置 |
JPH05196952A (ja) * | 1991-10-02 | 1993-08-06 | Canon Inc | 電気的接続構造及び電気的接続方法 |
JP2692461B2 (ja) * | 1991-10-26 | 1997-12-17 | 日本電気株式会社 | 半導体装置 |
JP2669742B2 (ja) * | 1991-12-25 | 1997-10-29 | 株式会社東芝 | 内視鏡装置 |
DE69408558T2 (de) * | 1993-05-28 | 1998-07-23 | Toshiba Kawasaki Kk | Verwendung einer anisotropischen leitfähigen Schicht für die Verbindung von Anschlussleitern einer Leiterplatte mit den elektrischen Anschlusskontakten einer photoelektrischen Umwandlungsvorrichtung und Verfahren zur Montage dieser Vorrichtung |
US5432358A (en) * | 1994-03-24 | 1995-07-11 | Motorola, Inc. | Integrated electro-optical package |
-
1994
- 1994-05-25 DE DE69408558T patent/DE69408558T2/de not_active Expired - Fee Related
- 1994-05-25 EP EP94303736A patent/EP0630056B1/de not_active Expired - Lifetime
- 1994-05-28 KR KR1019940011784A patent/KR0172142B1/ko not_active IP Right Cessation
- 1994-07-25 US US08/277,320 patent/US5506401A/en not_active Expired - Lifetime
-
1997
- 1997-02-20 US US08/802,918 patent/US5786589A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US5506401A (en) | 1996-04-09 |
US5786589A (en) | 1998-07-28 |
KR0172142B1 (ko) | 1999-03-30 |
EP0630056B1 (de) | 1998-02-18 |
EP0630056A1 (de) | 1994-12-21 |
DE69408558T2 (de) | 1998-07-23 |
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