DE6932087U - Halbleitervorrichtung. - Google Patents

Halbleitervorrichtung.

Info

Publication number
DE6932087U
DE6932087U DE6932087U DE6932087U DE6932087U DE 6932087 U DE6932087 U DE 6932087U DE 6932087 U DE6932087 U DE 6932087U DE 6932087 U DE6932087 U DE 6932087U DE 6932087 U DE6932087 U DE 6932087U
Authority
DE
Germany
Prior art keywords
heat sink
conductors
plastic
lead frame
cooling plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE6932087U
Other languages
German (de)
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of DE6932087U publication Critical patent/DE6932087U/de
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H10W40/778—
    • H10W70/481—
    • H10W74/016—
    • H10W74/111—
    • H10W72/01515—
    • H10W72/0198—
    • H10W72/075—
    • H10W74/00—
    • H10W90/756—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
DE6932087U 1968-08-15 1969-08-14 Halbleitervorrichtung. Expired DE6932087U (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US75282268A 1968-08-15 1968-08-15

Publications (1)

Publication Number Publication Date
DE6932087U true DE6932087U (de) 1974-05-30

Family

ID=25028007

Family Applications (2)

Application Number Title Priority Date Filing Date
DE6932087U Expired DE6932087U (de) 1968-08-15 1969-08-14 Halbleitervorrichtung.
DE19691941305 Pending DE1941305A1 (de) 1968-08-15 1969-08-14 Verfahren zur Herstellung von in Kunststoff gekapselten Halbleiterbauelementen

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE19691941305 Pending DE1941305A1 (de) 1968-08-15 1969-08-14 Verfahren zur Herstellung von in Kunststoff gekapselten Halbleiterbauelementen

Country Status (6)

Country Link
US (1) US3606673A (esLanguage)
JP (1) JPS4828955B1 (esLanguage)
DE (2) DE6932087U (esLanguage)
FR (1) FR2015702A1 (esLanguage)
GB (1) GB1273589A (esLanguage)
NL (1) NL6912309A (esLanguage)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3753634A (en) * 1970-10-09 1973-08-21 T Bliven Molding means for strip frame semiconductive device
US3762039A (en) * 1971-09-10 1973-10-02 Mos Technology Inc Plastic encapsulation of microcircuits
IT960675B (it) * 1972-06-03 1973-11-30 Ates Componenti Elettron Assemblaggio per produzione di circuiti integrati con conteni tore di resina
US4003544A (en) * 1973-06-11 1977-01-18 Motorola, Inc. Gateless injection mold for encapsulating semiconductor devices
IT993429B (it) * 1973-09-26 1975-09-30 Sgs Ates Componenti Perfezionamento di una cassa per dispositivo a semiconduttori
US4059810A (en) * 1973-09-26 1977-11-22 Sgs-Ates Componenti Elettronici Spa Resin-encased microelectronic module
US4125740A (en) * 1973-09-26 1978-11-14 Sgs-Ates Componenti Elettronici S.P.A. Resin-encased microelectronic module
US3902189A (en) * 1974-04-10 1975-08-26 Hunt Electronics Prefabricated article and methods of maintaining the orientation of parts being bonded thereto
US4017495A (en) * 1975-10-23 1977-04-12 Bell Telephone Laboratories, Incorporated Encapsulation of integrated circuits
JPS5266376A (en) * 1975-11-29 1977-06-01 Hitachi Ltd Device and manufacture of resin body type semiconductor
US4084312A (en) * 1976-01-07 1978-04-18 Motorola, Inc. Electrically isolated heat sink lead frame for plastic encapsulated semiconductor assemblies
DE2712543C2 (de) * 1976-03-24 1982-11-11 Hitachi, Ltd., Tokyo Anordnung eines Halbleiterbauelements auf einer Montageplatte
DE2714145C2 (de) * 1976-03-31 1985-01-10 Mitsubishi Denki K.K., Tokio/Tokyo Gestanzte Metallträgerplatte für die Herstellung von kunststoffummantelten Halbleiterbauelementen
US4102039A (en) * 1977-02-14 1978-07-25 Motorola, Inc. Method of packaging electronic components
GB1592441A (en) * 1978-01-19 1981-07-08 Tempra Therm 1972 Pty Ltd Thermocouples
US4439918A (en) * 1979-03-12 1984-04-03 Western Electric Co., Inc. Methods of packaging an electronic device
US4346396A (en) * 1979-03-12 1982-08-24 Western Electric Co., Inc. Electronic device assembly and methods of making same
US4339768A (en) * 1980-01-18 1982-07-13 Amp Incorporated Transistors and manufacture thereof
US4458413A (en) * 1981-01-26 1984-07-10 Olin Corporation Process for forming multi-gauge strip
JPS57147260A (en) * 1981-03-05 1982-09-11 Matsushita Electronics Corp Manufacture of resin-sealed semiconductor device and lead frame used therefor
JPS58209147A (ja) * 1982-05-31 1983-12-06 Toshiba Corp 樹脂封止型半導体装置
US4862246A (en) * 1984-09-26 1989-08-29 Hitachi, Ltd. Semiconductor device lead frame with etched through holes
EP0257681A3 (en) * 1986-08-27 1990-02-07 STMicroelectronics S.r.l. Method for manufacturing plastic encapsulated semiconductor devices and devices obtained thereby
US4979017A (en) * 1989-02-23 1990-12-18 Adam Mii Semiconductor element string structure
US4991002A (en) * 1990-02-14 1991-02-05 Motorola Inc. Modular power device assembly
US5083368A (en) * 1990-02-14 1992-01-28 Motorola Inc. Method of forming modular power device assembly
IT1246743B (it) * 1990-12-28 1994-11-26 Sgs Thomson Microelectronics Stampo per la fabbricazione di contenitori in plastica, per circuiti integrati,con dissipatore termico incorporato.
JPH05218276A (ja) * 1991-11-12 1993-08-27 Motorola Inc 割れにくい半導体装置およびその作製方法
JP3096824B2 (ja) * 1992-04-17 2000-10-10 ローム株式会社 Ｌｅｄ製造用フレームおよびこれを用いたｌｅｄの製造方法
GB2277295B (en) * 1993-04-23 1995-05-03 Neu Dynamics Corp Encapsulation molding equipment and method
US6465743B1 (en) * 1994-12-05 2002-10-15 Motorola, Inc. Multi-strand substrate for ball-grid array assemblies and method
GB2299047A (en) * 1995-03-21 1996-09-25 Uponor Ltd Manufacture of electrofusion fittings
US5776798A (en) * 1996-09-04 1998-07-07 Motorola, Inc. Semiconductor package and method thereof
US8334583B2 (en) * 2005-07-20 2012-12-18 Infineon Technologies Ag Leadframe strip and mold apparatus for an electronic component and method of encapsulating an electronic component
CN102034785B (zh) * 2010-11-23 2012-02-01 吴江恒源金属制品有限公司 一种改进型三极管引线框架
KR101581610B1 (ko) * 2012-03-22 2016-01-11 미쓰비시덴키 가부시키가이샤 반도체 장치 및 그 제조 방법
DE102012222679A1 (de) * 2012-12-10 2014-06-12 Robert Bosch Gmbh Verfahren zur Herstellung eines Schaltmoduls und eines zugehörigen Gittermoduls sowie ein zugehöriges Gittermodul und korrespondierende elektronische Baugruppe
CN103617983A (zh) * 2013-11-08 2014-03-05 张轩 一种小功率的塑封引线框架
CN114347341B (zh) * 2021-12-31 2024-04-09 佛山市国星光电股份有限公司 一种分立器件塑封装置及塑封方法

Also Published As

Publication number Publication date
JPS4828955B1 (esLanguage) 1973-09-06
US3606673A (en) 1971-09-21
DE1941305A1 (de) 1970-09-24
NL6912309A (esLanguage) 1970-02-17
GB1273589A (en) 1972-05-10
FR2015702A1 (esLanguage) 1970-04-30

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