IT960675B - Assemblaggio per produzione di circuiti integrati con conteni tore di resina - Google Patents

Assemblaggio per produzione di circuiti integrati con conteni tore di resina

Info

Publication number
IT960675B
IT960675B IT2521672A IT2521672A IT960675B IT 960675 B IT960675 B IT 960675B IT 2521672 A IT2521672 A IT 2521672A IT 2521672 A IT2521672 A IT 2521672A IT 960675 B IT960675 B IT 960675B
Authority
IT
Italy
Prior art keywords
assembly
production
integrated circuits
resin containers
containers
Prior art date
Application number
IT2521672A
Other languages
English (en)
Inventor
R Paletro
G Cosutra
M Cellai
Original Assignee
Ates Componenti Elettron
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ates Componenti Elettron filed Critical Ates Componenti Elettron
Priority to IT2521672A priority Critical patent/IT960675B/it
Priority to FR7320046A priority patent/FR2188305B1/fr
Priority to DE19732328107 priority patent/DE2328107A1/de
Application granted granted Critical
Publication of IT960675B publication Critical patent/IT960675B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
IT2521672A 1972-06-03 1972-06-03 Assemblaggio per produzione di circuiti integrati con conteni tore di resina IT960675B (it)

Priority Applications (3)

Application Number Priority Date Filing Date Title
IT2521672A IT960675B (it) 1972-06-03 1972-06-03 Assemblaggio per produzione di circuiti integrati con conteni tore di resina
FR7320046A FR2188305B1 (it) 1972-06-03 1973-06-01
DE19732328107 DE2328107A1 (de) 1972-06-03 1973-06-01 Montageverfahren fuer die herstellung integrierter schaltungen mit kunstharzgehaeuse

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT2521672A IT960675B (it) 1972-06-03 1972-06-03 Assemblaggio per produzione di circuiti integrati con conteni tore di resina

Publications (1)

Publication Number Publication Date
IT960675B true IT960675B (it) 1973-11-30

Family

ID=11216032

Family Applications (1)

Application Number Title Priority Date Filing Date
IT2521672A IT960675B (it) 1972-06-03 1972-06-03 Assemblaggio per produzione di circuiti integrati con conteni tore di resina

Country Status (3)

Country Link
DE (1) DE2328107A1 (it)
FR (1) FR2188305B1 (it)
IT (1) IT960675B (it)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2503932A1 (fr) * 1981-04-08 1982-10-15 Thomson Csf Boitiers a cosses plates pour composants semi-conducteurs de moyenne puissance et procede de fabrication
NL8202154A (nl) * 1982-05-26 1983-12-16 Asm Fico Tooling Geleiderframe.

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL157456B (nl) * 1968-07-30 1978-07-17 Philips Nv Halfgeleiderinrichting in een isolerende kunststofomhulling.
US3606673A (en) * 1968-08-15 1971-09-21 Texas Instruments Inc Plastic encapsulated semiconductor devices
US3651448A (en) * 1970-03-20 1972-03-21 Amp Inc Power frame for integrated circuit

Also Published As

Publication number Publication date
FR2188305A1 (it) 1974-01-18
DE2328107A1 (de) 1974-01-17
FR2188305B1 (it) 1976-06-11

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