DE69306690D1 - Niederschlag von Material mittels Plasma unterstützte Magnetronzerstäubung - Google Patents
Niederschlag von Material mittels Plasma unterstützte MagnetronzerstäubungInfo
- Publication number
- DE69306690D1 DE69306690D1 DE69306690T DE69306690T DE69306690D1 DE 69306690 D1 DE69306690 D1 DE 69306690D1 DE 69306690 T DE69306690 T DE 69306690T DE 69306690 T DE69306690 T DE 69306690T DE 69306690 D1 DE69306690 D1 DE 69306690D1
- Authority
- DE
- Germany
- Prior art keywords
- precipitation
- plasma
- magnetron sputtering
- assisted magnetron
- assisted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32697—Electrostatic control
- H01J37/32706—Polarising the substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
- C23C14/0036—Reactive sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0635—Carbides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0641—Nitrides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- C23C14/354—Introduction of auxiliary energy into the plasma
- C23C14/355—Introduction of auxiliary energy into the plasma using electrons, e.g. triode sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/929,986 US5346600A (en) | 1992-08-14 | 1992-08-14 | Plasma-enhanced magnetron-sputtered deposition of materials |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69306690D1 true DE69306690D1 (de) | 1997-01-30 |
DE69306690T2 DE69306690T2 (de) | 1997-07-24 |
Family
ID=25458794
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69306690T Expired - Fee Related DE69306690T2 (de) | 1992-08-14 | 1993-08-12 | Niederschlag von Material mittels Plasma unterstützte Magnetronzerstäubung |
Country Status (6)
Country | Link |
---|---|
US (1) | US5346600A (de) |
EP (1) | EP0583736B1 (de) |
JP (1) | JPH0751752B2 (de) |
KR (1) | KR960002632B1 (de) |
CA (1) | CA2103770C (de) |
DE (1) | DE69306690T2 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114656033A (zh) * | 2022-02-17 | 2022-06-24 | 西安建筑科技大学 | 一种玉米芯为核基的缓释碳源制备方法 |
Families Citing this family (102)
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CN114774869A (zh) * | 2022-04-08 | 2022-07-22 | 西安热工研究院有限公司 | 一种成分可调的TixCr1-xNy纳米涂层、制备方法及其应用 |
CN115110048B (zh) * | 2022-06-20 | 2023-05-02 | 肇庆市科润真空设备有限公司 | 基于磁控溅射的pecvd镀膜装置及方法 |
CN114941129A (zh) * | 2022-06-23 | 2022-08-26 | 中国科学院宁波材料技术与工程研究所 | 一种折射率可调的红外选择性吸收复合膜及其制备方法 |
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CH631743A5 (de) * | 1977-06-01 | 1982-08-31 | Balzers Hochvakuum | Verfahren zum aufdampfen von material in einer vakuumaufdampfanlage. |
JPS5983767A (ja) * | 1982-11-04 | 1984-05-15 | Kawasaki Heavy Ind Ltd | 鉄鋼の表面処理方法 |
JPS59123768A (ja) * | 1982-12-28 | 1984-07-17 | Toyota Central Res & Dev Lab Inc | 多元同時スパッタリング装置 |
FR2557149B1 (fr) * | 1983-12-27 | 1989-11-17 | France Etat | Procede et dispositif pour le depot, sur un support, d'une couche mince d'un materiau a partir d'un plasma reactif |
DE3503397A1 (de) * | 1985-02-01 | 1986-08-07 | W.C. Heraeus Gmbh, 6450 Hanau | Sputteranlage zum reaktiven beschichten eines substrates mit hartstoffen |
US4992153A (en) * | 1989-04-26 | 1991-02-12 | Balzers Aktiengesellschaft | Sputter-CVD process for at least partially coating a workpiece |
US4990229A (en) * | 1989-06-13 | 1991-02-05 | Plasma & Materials Technologies, Inc. | High density plasma deposition and etching apparatus |
DE3920835C2 (de) * | 1989-06-24 | 1997-12-18 | Leybold Ag | Einrichtung zum Beschichten von Substraten |
US5234560A (en) * | 1989-08-14 | 1993-08-10 | Hauzer Holdings Bv | Method and device for sputtering of films |
DE4038497C1 (de) * | 1990-12-03 | 1992-02-20 | Leybold Ag, 6450 Hanau, De |
-
1992
- 1992-08-14 US US07/929,986 patent/US5346600A/en not_active Expired - Lifetime
-
1993
- 1993-08-10 CA CA002103770A patent/CA2103770C/en not_active Expired - Fee Related
- 1993-08-12 EP EP93112909A patent/EP0583736B1/de not_active Expired - Lifetime
- 1993-08-12 DE DE69306690T patent/DE69306690T2/de not_active Expired - Fee Related
- 1993-08-13 KR KR1019930015680A patent/KR960002632B1/ko not_active IP Right Cessation
- 1993-08-16 JP JP5202265A patent/JPH0751752B2/ja not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114656033A (zh) * | 2022-02-17 | 2022-06-24 | 西安建筑科技大学 | 一种玉米芯为核基的缓释碳源制备方法 |
Also Published As
Publication number | Publication date |
---|---|
KR940004075A (ko) | 1994-03-14 |
JPH0751752B2 (ja) | 1995-06-05 |
DE69306690T2 (de) | 1997-07-24 |
CA2103770A1 (en) | 1994-02-15 |
JPH06192834A (ja) | 1994-07-12 |
US5346600A (en) | 1994-09-13 |
EP0583736B1 (de) | 1996-12-18 |
KR960002632B1 (ko) | 1996-02-24 |
EP0583736A1 (de) | 1994-02-23 |
CA2103770C (en) | 1997-12-16 |
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