DE69128208D1 - Gedruckte Leiterplatten und Karten mit eingefügten Dünnfilmkondensatoren und Herstellungsverfahren für diese Leiterplatten und Karten - Google Patents
Gedruckte Leiterplatten und Karten mit eingefügten Dünnfilmkondensatoren und Herstellungsverfahren für diese Leiterplatten und KartenInfo
- Publication number
- DE69128208D1 DE69128208D1 DE69128208T DE69128208T DE69128208D1 DE 69128208 D1 DE69128208 D1 DE 69128208D1 DE 69128208 T DE69128208 T DE 69128208T DE 69128208 T DE69128208 T DE 69128208T DE 69128208 D1 DE69128208 D1 DE 69128208D1
- Authority
- DE
- Germany
- Prior art keywords
- cards
- circuit boards
- thin film
- manufacturing processes
- film capacitors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0179—Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0317—Thin film conductor layer; Thin film passive component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
- Y10S257/916—Narrow band gap semiconductor material, <<1ev
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/43—Electric condenser making
- Y10T29/435—Solid dielectric type
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/506,640 US5027253A (en) | 1990-04-09 | 1990-04-09 | Printed circuit boards and cards having buried thin film capacitors and processing techniques for fabricating said boards and cards |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69128208D1 true DE69128208D1 (de) | 1998-01-02 |
DE69128208T2 DE69128208T2 (de) | 1998-05-28 |
Family
ID=24015411
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69128208T Expired - Lifetime DE69128208T2 (de) | 1990-04-09 | 1991-03-05 | Gedruckte Leiterplatten und Karten mit eingefügten Dünnfilmkondensatoren und Herstellungsverfahren für diese Leiterplatten und Karten |
Country Status (4)
Country | Link |
---|---|
US (1) | US5027253A (de) |
EP (1) | EP0451500B1 (de) |
JP (1) | JPH0716099B2 (de) |
DE (1) | DE69128208T2 (de) |
Families Citing this family (105)
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JPS595654A (ja) * | 1982-06-30 | 1984-01-12 | Mitsubishi Electric Corp | 半導体装置 |
US4682414A (en) * | 1982-08-30 | 1987-07-28 | Olin Corporation | Multi-layer circuitry |
JPS5954254A (ja) * | 1982-09-21 | 1984-03-29 | Nec Corp | 半導体集積回路装置 |
JPS5982753A (ja) * | 1982-11-02 | 1984-05-12 | Matsushita Electronics Corp | 半導体装置用パツケ−ジ |
US4453199A (en) * | 1983-06-17 | 1984-06-05 | Avx Corporation | Low cost thin film capacitor |
JPS60137092A (ja) * | 1983-12-19 | 1985-07-20 | 株式会社東芝 | 回路基板の製造方法 |
US4567542A (en) * | 1984-04-23 | 1986-01-28 | Nec Corporation | Multilayer ceramic substrate with interlayered capacitor |
JPS616846A (ja) * | 1984-06-21 | 1986-01-13 | Nec Corp | コンデンサ付プラグインパツケ−ジ |
JPS61112369A (ja) * | 1984-11-07 | 1986-05-30 | Hitachi Ltd | 半導体装置 |
US4729061A (en) * | 1985-04-29 | 1988-03-01 | Advanced Micro Devices, Inc. | Chip on board package for integrated circuit devices using printed circuit boards and means for conveying the heat to the opposite side of the package from the chip mounting side to permit the heat to dissipate therefrom |
US4705917A (en) * | 1985-08-27 | 1987-11-10 | Hughes Aircraft Company | Microelectronic package |
JPS6286793A (ja) * | 1985-10-11 | 1987-04-21 | 日本電気株式会社 | 電子部品の実装方法 |
US4638400A (en) * | 1985-10-24 | 1987-01-20 | General Electric Company | Refractory metal capacitor structures, particularly for analog integrated circuit devices |
JPS62171197A (ja) * | 1986-01-23 | 1987-07-28 | ニチコン株式会社 | 高密度混成集積回路の製造方法 |
US4744008A (en) * | 1986-11-18 | 1988-05-10 | International Business Machines Corporation | Flexible film chip carrier with decoupling capacitors |
US4835656A (en) * | 1987-04-04 | 1989-05-30 | Mitsubishi Mining And Cement Co., Ltd. | Multi-layered ceramic capacitor |
US4890192A (en) * | 1987-04-09 | 1989-12-26 | Microelectronics And Computer Technology Corporation | Thin film capacitor |
JPH01236698A (ja) * | 1987-11-25 | 1989-09-21 | Hitachi Ltd | コンデンサ内蔵セラミック多層回路基板 |
FR2625042B1 (fr) * | 1987-12-22 | 1990-04-20 | Thomson Csf | Structure microelectronique hybride modulaire a haute densite d'integration |
NL8800559A (nl) * | 1988-03-07 | 1989-10-02 | Philips Nv | Keramische meerlaagscondensator. |
JPH0280397A (ja) * | 1988-09-12 | 1990-03-20 | Matsushita Electric Ind Co Ltd | 強誘電体薄膜 |
JPH0298996A (ja) * | 1988-10-05 | 1990-04-11 | Mitsubishi Electric Corp | 多層基板 |
-
1990
- 1990-04-09 US US07/506,640 patent/US5027253A/en not_active Expired - Lifetime
-
1991
- 1991-02-28 JP JP3055536A patent/JPH0716099B2/ja not_active Expired - Lifetime
- 1991-03-05 DE DE69128208T patent/DE69128208T2/de not_active Expired - Lifetime
- 1991-03-05 EP EP91103285A patent/EP0451500B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0716099B2 (ja) | 1995-02-22 |
EP0451500B1 (de) | 1997-11-19 |
DE69128208T2 (de) | 1998-05-28 |
EP0451500A2 (de) | 1991-10-16 |
EP0451500A3 (de) | 1995-02-08 |
US5027253A (en) | 1991-06-25 |
JPH04225594A (ja) | 1992-08-14 |
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