DE69325536D1 - Zwischenverbindung mit Erhebungen für Flachkabel und Leiterplatten - Google Patents

Zwischenverbindung mit Erhebungen für Flachkabel und Leiterplatten

Info

Publication number
DE69325536D1
DE69325536D1 DE69325536T DE69325536T DE69325536D1 DE 69325536 D1 DE69325536 D1 DE 69325536D1 DE 69325536 T DE69325536 T DE 69325536T DE 69325536 T DE69325536 T DE 69325536T DE 69325536 D1 DE69325536 D1 DE 69325536D1
Authority
DE
Germany
Prior art keywords
elevations
interconnection
printed circuit
circuit boards
flat cables
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69325536T
Other languages
English (en)
Other versions
DE69325536T2 (de
Inventor
Mohi Sobhani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Co filed Critical Raytheon Co
Publication of DE69325536D1 publication Critical patent/DE69325536D1/de
Application granted granted Critical
Publication of DE69325536T2 publication Critical patent/DE69325536T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/61—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to flexible printed circuits, flat or ribbon cables or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/62—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/365—Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
DE69325536T 1992-03-27 1993-03-08 Zwischenverbindung mit Erhebungen für Flachkabel und Leiterplatten Expired - Lifetime DE69325536T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/858,473 US5213511A (en) 1992-03-27 1992-03-27 Dimple interconnect for flat cables and printed wiring boards

Publications (2)

Publication Number Publication Date
DE69325536D1 true DE69325536D1 (de) 1999-08-12
DE69325536T2 DE69325536T2 (de) 1999-11-18

Family

ID=25328394

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69325536T Expired - Lifetime DE69325536T2 (de) 1992-03-27 1993-03-08 Zwischenverbindung mit Erhebungen für Flachkabel und Leiterplatten

Country Status (5)

Country Link
US (1) US5213511A (de)
EP (1) EP0562340B1 (de)
JP (1) JP2818530B2 (de)
CA (1) CA2090215C (de)
DE (1) DE69325536T2 (de)

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US5372512A (en) * 1993-04-30 1994-12-13 Hewlett-Packard Company Electrical interconnect system for a flexible circuit
US5461482A (en) * 1993-04-30 1995-10-24 Hewlett-Packard Company Electrical interconnect system for a printer
CA2135241C (en) * 1993-12-17 1998-08-04 Mohi Sobhani Cavity and bump interconnection structure for electronic packages
GB2292840A (en) * 1994-08-26 1996-03-06 Nfi Electronics Ltd Ensuring contact
GB2306805A (en) * 1995-10-30 1997-05-07 Whitaker Corp Conductive rivet electrical termination
US5743747A (en) * 1997-01-13 1998-04-28 Hughes Electronics Dimpled connector
US5786238A (en) * 1997-02-13 1998-07-28 Generyal Dynamics Information Systems, Inc. Laminated multilayer substrates
US6303988B1 (en) 1998-04-22 2001-10-16 Packard Hughes Interconnect Company Wafer scale burn-in socket
US6247951B1 (en) 1998-05-29 2001-06-19 Delphi Technologies, Inc. Flexible circuit connector
DE19832011B4 (de) * 1998-07-16 2005-12-22 Leopold Kostal Gmbh & Co. Kg Flachbandleitung mit einem zum lösbaren Verbinden vorgesehenen Anschlußbereich
US6109930A (en) * 1998-09-08 2000-08-29 International Business Machines Corporation Enhanced hardware arrangement for mounting a plurality of circuit boards together
DE19910572A1 (de) * 1999-03-10 2000-09-14 Delphi Tech Inc Verbindungselement
US7059868B1 (en) * 2000-03-07 2006-06-13 Western Digital (Fremont), Inc. Connection of trace circuitry in a computer disk drive system
DE10028184A1 (de) * 2000-06-09 2002-03-07 Hirschmann Austria Gmbh Rankwe Vorrichtung zum Verbindung von elektrischen Leitern
US6537083B1 (en) 2000-11-03 2003-03-25 Cray Inc. Electrical connector assembly for printed circuit boards
DE10250924A1 (de) * 2002-10-31 2004-05-19 Fci Inline-Klemmverbinder für Flex-Flachbandkabel
TWM243762U (en) * 2003-01-27 2004-09-11 C One Technology Corp Compact storage memory device capable of being configured in a portable decoration
TWI238513B (en) 2003-03-04 2005-08-21 Rohm & Haas Elect Mat Coaxial waveguide microstructures and methods of formation thereof
US6966784B2 (en) * 2003-12-19 2005-11-22 Palo Alto Research Center Incorporated Flexible cable interconnect assembly
DE102004023189B4 (de) * 2004-05-11 2017-06-22 Friedrich-Alexander-Universität Erlangen-Nürnberg Lösbare elektrische Kontaktierung dreidimensionaler spritzgegossener Schaltungsträger
JP2006007669A (ja) * 2004-06-28 2006-01-12 Brother Ind Ltd プリント基板の製造方法、プリント基板、インクジェットヘッド及びインクジェットヘッドの製造方法
DE102005035102A1 (de) * 2005-07-27 2007-02-01 Robert Bosch Gmbh Elektrisch leitende Verbindung und Verfahren zum Herstellen einer solchen
US7755174B2 (en) 2007-03-20 2010-07-13 Nuvotonics, LLC Integrated electronic components and methods of formation thereof
KR101472134B1 (ko) 2007-03-20 2014-12-15 누보트로닉스, 엘.엘.씨 동축 전송선 마이크로구조물 및 그의 형성방법
US20110123783A1 (en) 2009-11-23 2011-05-26 David Sherrer Multilayer build processses and devices thereof
US8866300B1 (en) 2011-06-05 2014-10-21 Nuvotronics, Llc Devices and methods for solder flow control in three-dimensional microstructures
US8814601B1 (en) * 2011-06-06 2014-08-26 Nuvotronics, Llc Batch fabricated microconnectors
KR101982887B1 (ko) 2011-07-13 2019-05-27 누보트로닉스, 인크. 전자 및 기계 구조체들을 제조하는 방법들
US9048597B2 (en) * 2012-10-19 2015-06-02 Apple Inc. Structures for securing printed circuit connectors
US9306254B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration
US9306255B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each other
KR20160133422A (ko) 2014-01-17 2016-11-22 누보트로닉스, 인크. 웨이퍼 규모 테스트 인터페이스 유닛 및 컨택터
US10847469B2 (en) 2016-04-26 2020-11-24 Cubic Corporation CTE compensation for wafer-level and chip-scale packages and assemblies
EP3224899A4 (de) 2014-12-03 2018-08-22 Nuvotronics, Inc. Systeme und verfahren zur herstellung von gestapelten schaltungen und übertragungsleitungen
CN104810638B (zh) * 2015-05-19 2017-02-22 合肥京东方光电科技有限公司 印刷电路板及其与柔性电路板连接的检测方法、显示面板
CN206864652U (zh) * 2017-04-24 2018-01-09 番禺得意精密电子工业有限公司 电连接装置
US10319654B1 (en) 2017-12-01 2019-06-11 Cubic Corporation Integrated chip scale packages
DE102018219917A1 (de) * 2018-11-21 2020-05-28 Albert-Ludwigs-Universität Freiburg Implantierbare elektrische Verbindungseinrichtung
CN111970847B (zh) * 2020-08-20 2021-12-28 昊阳天宇科技(深圳)有限公司 一种pcba双面压合件拆卸设备及方法

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US3562798A (en) * 1969-01-29 1971-02-09 Honeywell Inc Connector apparatus
DE2043315A1 (de) * 1970-08-22 1972-02-24 Clements J Elektrisches Verbindungsstuck
US4403272A (en) * 1980-06-02 1983-09-06 Oak Industries Inc. Membrane switch interconnect tail and printed circuit board connection
JPS5862560U (ja) * 1981-10-22 1983-04-27 岩崎通信機株式会社 カ−ドケ−ブル接続構造
JPS5928987U (ja) * 1982-08-19 1984-02-23 星電器製造株式会社 フレキシブルプリント配線板用コネクタ
US4647125A (en) * 1985-07-22 1987-03-03 Rogers Corporation Solderless connector technique
US4850883A (en) * 1987-05-21 1989-07-25 Intel Corporation High density flexible circuit connector
US5121299A (en) * 1989-12-29 1992-06-09 International Business Machines Corporation Multi-level circuit structure utilizing conductive cores having conductive protrusions and cavities therein
JPH0444172U (de) * 1990-08-15 1992-04-15
US5097101A (en) * 1991-02-05 1992-03-17 Tektronix, Inc. Method of forming a conductive contact bump on a flexible substrate and a flexible substrate

Also Published As

Publication number Publication date
US5213511A (en) 1993-05-25
EP0562340A2 (de) 1993-09-29
CA2090215A1 (en) 1993-09-28
JP2818530B2 (ja) 1998-10-30
CA2090215C (en) 1997-02-04
EP0562340B1 (de) 1999-07-07
EP0562340A3 (en) 1996-05-29
JPH0645019A (ja) 1994-02-18
DE69325536T2 (de) 1999-11-18

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