DE69303837D1 - Gedruckter Schaltungsträger mit vorspringender Elektrode und Verbindungsverfahren - Google Patents

Gedruckter Schaltungsträger mit vorspringender Elektrode und Verbindungsverfahren

Info

Publication number
DE69303837D1
DE69303837D1 DE69303837T DE69303837T DE69303837D1 DE 69303837 D1 DE69303837 D1 DE 69303837D1 DE 69303837 T DE69303837 T DE 69303837T DE 69303837 T DE69303837 T DE 69303837T DE 69303837 D1 DE69303837 D1 DE 69303837D1
Authority
DE
Germany
Prior art keywords
circuit board
printed circuit
connection method
projecting electrode
projecting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69303837T
Other languages
English (en)
Other versions
DE69303837T2 (de
Inventor
Kazuuo Ouchi
Masakazu Sugimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of DE69303837D1 publication Critical patent/DE69303837D1/de
Application granted granted Critical
Publication of DE69303837T2 publication Critical patent/DE69303837T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/118Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007Surface contacts, e.g. bumps
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0335Layered conductors or foils
    • H05K2201/0347Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0364Conductor shape
    • H05K2201/0367Metallic bump or raised conductor not used as solder bump
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10439Position of a single component
    • H05K2201/10446Mounted on an edge
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/281Applying non-metallic protective coatings by means of a preformed insulating foil
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405Edge mounted components, e.g. terminals
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00Stock material or miscellaneous articles
    • Y10S428/901Printed circuit
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24777Edge feature
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)
DE69303837T 1992-02-24 1993-02-11 Gedruckter Schaltungsträger mit vorspringender Elektrode und Verbindungsverfahren Expired - Fee Related DE69303837T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4073453A JPH05235498A (ja) 1992-02-24 1992-02-24 突起電極付プリント回路基板および接合方法

Publications (2)

Publication Number Publication Date
DE69303837D1 true DE69303837D1 (de) 1996-09-05
DE69303837T2 DE69303837T2 (de) 1996-12-12

Family

ID=13518674

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69303837T Expired - Fee Related DE69303837T2 (de) 1992-02-24 1993-02-11 Gedruckter Schaltungsträger mit vorspringender Elektrode und Verbindungsverfahren

Country Status (4)

Country Link
US (1) US5330825A (de)
EP (1) EP0557812B1 (de)
JP (1) JPH05235498A (de)
DE (1) DE69303837T2 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102202463A (zh) * 2010-03-24 2011-09-28 南亚电路板股份有限公司 侧边封装型印刷电路板
JP5501846B2 (ja) 2010-05-07 2014-05-28 オリンパス株式会社 電子デバイス、ケーブル接続構造および電子デバイスの製造方法
JP7090622B2 (ja) * 2017-08-14 2022-06-24 住友電工プリントサーキット株式会社 フレキシブルプリント配線板
JP2019036616A (ja) * 2017-08-14 2019-03-07 住友電気工業株式会社 フレキシブルプリント配線板

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1336575A (fr) * 1961-10-20 1963-08-30 Licentia Gmbh Structure de circuit imprimé
US3545079A (en) * 1968-05-02 1970-12-08 Vitramon Inc Method of making multilayer circuit system
US3747210A (en) * 1971-09-13 1973-07-24 Int Standard Electric Corp Method of producing terminal pins of a printed circuit board
US4164071A (en) * 1977-12-27 1979-08-14 Ford Motor Company Method of forming a circuit board with integral terminals
US4597177A (en) * 1984-01-03 1986-07-01 International Business Machines Corporation Fabricating contacts for flexible module carriers
DE3740741A1 (de) * 1987-12-01 1989-06-22 Interpane Entw & Beratungsges Verfahren zum aufbringen von kontaktbahnen auf ein substrat
US5196652A (en) * 1990-12-26 1993-03-23 Xerox Corporation Wireless electrical connections of abutting tiled arrays

Also Published As

Publication number Publication date
EP0557812B1 (de) 1996-07-31
EP0557812A2 (de) 1993-09-01
DE69303837T2 (de) 1996-12-12
EP0557812A3 (de) 1994-03-23
JPH05235498A (ja) 1993-09-10
US5330825A (en) 1994-07-19

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee