DE69303837D1 - Gedruckter Schaltungsträger mit vorspringender Elektrode und Verbindungsverfahren - Google Patents
Gedruckter Schaltungsträger mit vorspringender Elektrode und VerbindungsverfahrenInfo
- Publication number
- DE69303837D1 DE69303837D1 DE69303837T DE69303837T DE69303837D1 DE 69303837 D1 DE69303837 D1 DE 69303837D1 DE 69303837 T DE69303837 T DE 69303837T DE 69303837 T DE69303837 T DE 69303837T DE 69303837 D1 DE69303837 D1 DE 69303837D1
- Authority
- DE
- Germany
- Prior art keywords
- circuit board
- printed circuit
- connection method
- projecting electrode
- projecting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0367—Metallic bump or raised conductor not used as solder bump
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10446—Mounted on an edge
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24777—Edge feature
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Combinations Of Printed Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4073453A JPH05235498A (ja) | 1992-02-24 | 1992-02-24 | 突起電極付プリント回路基板および接合方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69303837D1 true DE69303837D1 (de) | 1996-09-05 |
DE69303837T2 DE69303837T2 (de) | 1996-12-12 |
Family
ID=13518674
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69303837T Expired - Fee Related DE69303837T2 (de) | 1992-02-24 | 1993-02-11 | Gedruckter Schaltungsträger mit vorspringender Elektrode und Verbindungsverfahren |
Country Status (4)
Country | Link |
---|---|
US (1) | US5330825A (de) |
EP (1) | EP0557812B1 (de) |
JP (1) | JPH05235498A (de) |
DE (1) | DE69303837T2 (de) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102202463A (zh) * | 2010-03-24 | 2011-09-28 | 南亚电路板股份有限公司 | 侧边封装型印刷电路板 |
JP5501846B2 (ja) | 2010-05-07 | 2014-05-28 | オリンパス株式会社 | 電子デバイス、ケーブル接続構造および電子デバイスの製造方法 |
JP7090622B2 (ja) * | 2017-08-14 | 2022-06-24 | 住友電工プリントサーキット株式会社 | フレキシブルプリント配線板 |
JP2019036616A (ja) * | 2017-08-14 | 2019-03-07 | 住友電気工業株式会社 | フレキシブルプリント配線板 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1336575A (fr) * | 1961-10-20 | 1963-08-30 | Licentia Gmbh | Structure de circuit imprimé |
US3545079A (en) * | 1968-05-02 | 1970-12-08 | Vitramon Inc | Method of making multilayer circuit system |
US3747210A (en) * | 1971-09-13 | 1973-07-24 | Int Standard Electric Corp | Method of producing terminal pins of a printed circuit board |
US4164071A (en) * | 1977-12-27 | 1979-08-14 | Ford Motor Company | Method of forming a circuit board with integral terminals |
US4597177A (en) * | 1984-01-03 | 1986-07-01 | International Business Machines Corporation | Fabricating contacts for flexible module carriers |
DE3740741A1 (de) * | 1987-12-01 | 1989-06-22 | Interpane Entw & Beratungsges | Verfahren zum aufbringen von kontaktbahnen auf ein substrat |
US5196652A (en) * | 1990-12-26 | 1993-03-23 | Xerox Corporation | Wireless electrical connections of abutting tiled arrays |
-
1992
- 1992-02-24 JP JP4073453A patent/JPH05235498A/ja active Pending
-
1993
- 1993-02-11 DE DE69303837T patent/DE69303837T2/de not_active Expired - Fee Related
- 1993-02-11 EP EP93102181A patent/EP0557812B1/de not_active Expired - Lifetime
- 1993-02-24 US US08/021,683 patent/US5330825A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0557812B1 (de) | 1996-07-31 |
EP0557812A2 (de) | 1993-09-01 |
DE69303837T2 (de) | 1996-12-12 |
EP0557812A3 (de) | 1994-03-23 |
JPH05235498A (ja) | 1993-09-10 |
US5330825A (en) | 1994-07-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |