DE69017332D1 - Verfahren zum Herstellen einer eine Mesa enthaltenden Halbleiteranordnung. - Google Patents

Verfahren zum Herstellen einer eine Mesa enthaltenden Halbleiteranordnung.

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Publication number
DE69017332D1
DE69017332D1 DE69017332T DE69017332T DE69017332D1 DE 69017332 D1 DE69017332 D1 DE 69017332D1 DE 69017332 T DE69017332 T DE 69017332T DE 69017332 T DE69017332 T DE 69017332T DE 69017332 D1 DE69017332 D1 DE 69017332D1
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DE
Germany
Prior art keywords
mesa
manufacturing
semiconductor device
device containing
semiconductor
Prior art date
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Expired - Fee Related
Application number
DE69017332T
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English (en)
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DE69017332T2 (de
Inventor
Johannes Jordanus Maria Binsma
Rudolf Paulus Tijburg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Viavi Solutions Inc
Original Assignee
Philips Electronics NV
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Application filed by Philips Electronics NV filed Critical Philips Electronics NV
Publication of DE69017332D1 publication Critical patent/DE69017332D1/de
Application granted granted Critical
Publication of DE69017332T2 publication Critical patent/DE69017332T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02225Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/02227Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
    • H01L21/02258Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by anodic treatment, e.g. anodic oxidation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y20/00Nanooptics, e.g. quantum optics or photonic crystals
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13Integrated optical circuits characterised by the manufacturing method
    • G02B6/131Integrated optical circuits characterised by the manufacturing method by using epitaxial growth
    • HELECTRICITY
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    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/0237Materials
    • H01L21/02387Group 13/15 materials
    • H01L21/02392Phosphides
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    • H01L21/02436Intermediate layers between substrates and deposited layers
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    • H01L21/02461Phosphides
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    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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    • H01L21/306Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/308Chemical or electrical treatment, e.g. electrolytic etching using masks
    • H01L21/3083Chemical or electrical treatment, e.g. electrolytic etching using masks characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
    • H01L21/3085Chemical or electrical treatment, e.g. electrolytic etching using masks characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by their behaviour during the process, e.g. soluble masks, redeposited masks
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    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/314Inorganic layers
    • H01L21/316Inorganic layers composed of oxides or glassy oxides or oxide based glass
    • H01L21/3165Inorganic layers composed of oxides or glassy oxides or oxide based glass formed by oxidation
    • H01L21/31654Inorganic layers composed of oxides or glassy oxides or oxide based glass formed by oxidation of semiconductor materials, e.g. the body itself
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    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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    • H01L33/0062Processes for devices with an active region comprising only III-V compounds
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    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
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    • H01S5/3434Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser with a well layer comprising at least both As and P as V-compounds
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    • H01L21/02263Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
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    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
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    • H01S5/2054Methods of obtaining the confinement
    • H01S5/2081Methods of obtaining the confinement using special etching techniques
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    • H01S5/22Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
    • H01S5/227Buried mesa structure ; Striped active layer
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    • H01S5/3235Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength longer than 1000 nm, e.g. InP-based 1300 nm and 1500 nm lasers
    • H01S5/32391Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength longer than 1000 nm, e.g. InP-based 1300 nm and 1500 nm lasers based on In(Ga)(As)P
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    • H01S5/343Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
    • H01S5/34306Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength longer than 1000nm, e.g. InP based 1300 and 1500nm lasers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
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    • Y10S438/00Semiconductor device manufacturing: process
    • Y10S438/911Differential oxidation and etching
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00Semiconductor device manufacturing: process
    • Y10S438/978Semiconductor device manufacturing: process forming tapered edges on substrate or adjacent layers

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  • Engineering & Computer Science (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
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  • Optics & Photonics (AREA)
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  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Semiconductor Lasers (AREA)
  • Weting (AREA)
DE69017332T 1989-09-14 1990-09-10 Verfahren zum Herstellen einer eine Mesa enthaltenden Halbleiteranordnung. Expired - Fee Related DE69017332T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL8902292A NL8902292A (nl) 1989-09-14 1989-09-14 Werkwijze voor het vervaardigen van een een mesa bevattende halfgeleiderinrichting.

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Publication Number Publication Date
DE69017332D1 true DE69017332D1 (de) 1995-04-06
DE69017332T2 DE69017332T2 (de) 1995-09-14

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DE69017332T Expired - Fee Related DE69017332T2 (de) 1989-09-14 1990-09-10 Verfahren zum Herstellen einer eine Mesa enthaltenden Halbleiteranordnung.

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US (1) US5266518A (de)
EP (1) EP0418953B1 (de)
JP (1) JP2958084B2 (de)
KR (1) KR0174537B1 (de)
DE (1) DE69017332T2 (de)
NL (1) NL8902292A (de)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04373190A (ja) * 1991-06-24 1992-12-25 Matsushita Electric Ind Co Ltd 歪量子井戸半導体レーザおよびその製造方法
JPH0677205A (ja) * 1992-08-26 1994-03-18 Matsushita Electric Ind Co Ltd 化合物半導体の微細構造形成方法
KR0146714B1 (ko) * 1994-08-08 1998-11-02 양승택 평면 매립형 레이저 다이오드의 제조방법
JP3374878B2 (ja) * 1994-09-02 2003-02-10 三菱電機株式会社 半導体エッチング方法
EP0808522B1 (de) * 1995-11-08 2000-02-16 Uniphase Opto Holdings, Inc. Halbleiterlaser, insbesondere laserverstärker und herstellungsverfahren dieses lasers
US5834379A (en) * 1996-07-16 1998-11-10 Cornell Research Foundation, Inc. Process for synthesis of cubic GaN on GaAs using NH3 in an RF plasma process
JP2001111160A (ja) * 1999-04-19 2001-04-20 Canon Inc 半導体素子の製造方法及び半導体素子、リング共振器型半導体レーザ、ジャイロ
JP2003519438A (ja) 1999-04-27 2003-06-17 シュラムバーガー ホールディングス リミテッド 放射源
US6228673B1 (en) * 1999-05-13 2001-05-08 Hughes Electronics Corporation Method of fabricating a surface coupled InGaAs photodetector
JP2005234241A (ja) * 2004-02-19 2005-09-02 Sharp Corp 液晶表示装置
US7518196B2 (en) 2005-02-23 2009-04-14 Intel Corporation Field effect transistor with narrow bandgap source and drain regions and method of fabrication
US7858481B2 (en) 2005-06-15 2010-12-28 Intel Corporation Method for fabricating transistor with thinned channel
US7547637B2 (en) 2005-06-21 2009-06-16 Intel Corporation Methods for patterning a semiconductor film
US9263611B2 (en) * 2011-11-17 2016-02-16 Solar Junction Corporation Method for etching multi-layer epitaxial material
US9142615B2 (en) 2012-10-10 2015-09-22 Solar Junction Corporation Methods and apparatus for identifying and reducing semiconductor failures
US9413137B2 (en) 2013-03-15 2016-08-09 Nlight, Inc. Pulsed line beam device processing systems using laser diodes
US10466494B2 (en) 2015-12-18 2019-11-05 Nlight, Inc. Reverse interleaving for laser line generators
DE102016013749A1 (de) * 2016-11-18 2018-05-24 Azur Space Solar Power Gmbh Stapelförmige Halbleiterstruktur

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4190813A (en) * 1977-12-28 1980-02-26 Bell Telephone Laboratories, Incorporated Strip buried heterostructure laser
EP0042484A3 (de) * 1980-06-25 1982-07-14 Northern Telecom Limited LED's mit hoher Lichtausstrahlung
US4460910A (en) * 1981-11-23 1984-07-17 International Business Machines Corporation Heterojunction semiconductor
US4417385A (en) * 1982-08-09 1983-11-29 General Electric Company Processes for manufacturing insulated-gate semiconductor devices with integral shorts
JPS61147571A (ja) * 1984-12-21 1986-07-05 Toshiba Corp ヘテロ接合バイポ−ラトランジスタの製造方法
DE3751243T2 (de) * 1986-02-18 1995-08-31 Toshiba Kawasaki Kk Opto-elektronisches Bauelement und Verfahren zu seiner Herstellung.
US4792958A (en) * 1986-02-28 1988-12-20 Kabushiki Kaisha Toshiba Semiconductor laser with mesa stripe waveguide structure
JPS6338277A (ja) * 1986-08-01 1988-02-18 Fujitsu Ltd 半導体装置の製造方法
GB8622767D0 (en) * 1986-09-22 1986-10-29 British Telecomm Semiconductor structures

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JPH03106026A (ja) 1991-05-02
JP2958084B2 (ja) 1999-10-06
KR910007153A (ko) 1991-04-30
KR0174537B1 (ko) 1999-02-01
NL8902292A (nl) 1991-04-02
US5266518A (en) 1993-11-30
EP0418953A1 (de) 1991-03-27
DE69017332T2 (de) 1995-09-14
EP0418953B1 (de) 1995-03-01

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