DE68907300D1 - Vorrichtung zur temperaturdetektion in einer anordnung von integrierten schaltkreisen. - Google Patents

Vorrichtung zur temperaturdetektion in einer anordnung von integrierten schaltkreisen.

Info

Publication number
DE68907300D1
DE68907300D1 DE8989115708T DE68907300T DE68907300D1 DE 68907300 D1 DE68907300 D1 DE 68907300D1 DE 8989115708 T DE8989115708 T DE 8989115708T DE 68907300 T DE68907300 T DE 68907300T DE 68907300 D1 DE68907300 D1 DE 68907300D1
Authority
DE
Germany
Prior art keywords
arrangement
integrated circuits
temperature detection
detection
circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8989115708T
Other languages
English (en)
Other versions
DE68907300T2 (de
Inventor
Kazuhiko Umezawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP21166088A external-priority patent/JPH0732217B2/ja
Priority claimed from JP512889A external-priority patent/JPH0770674B2/ja
Application filed by NEC Corp filed Critical NEC Corp
Application granted granted Critical
Publication of DE68907300D1 publication Critical patent/DE68907300D1/de
Publication of DE68907300T2 publication Critical patent/DE68907300T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/16—Special arrangements for conducting heat from the object to the sensitive element

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE89115708T 1988-08-26 1989-08-25 Vorrichtung zur Temperaturdetektion in einer Anordnung von integrierten Schaltkreisen. Expired - Lifetime DE68907300T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP21166088A JPH0732217B2 (ja) 1988-08-26 1988-08-26 集積回路パッケージの温度検出構造
JP512889A JPH0770674B2 (ja) 1989-01-11 1989-01-11 集積回路パッケージの温度検出構造

Publications (2)

Publication Number Publication Date
DE68907300D1 true DE68907300D1 (de) 1993-07-29
DE68907300T2 DE68907300T2 (de) 1993-09-30

Family

ID=26339031

Family Applications (1)

Application Number Title Priority Date Filing Date
DE89115708T Expired - Lifetime DE68907300T2 (de) 1988-08-26 1989-08-25 Vorrichtung zur Temperaturdetektion in einer Anordnung von integrierten Schaltkreisen.

Country Status (4)

Country Link
US (1) US4975766A (de)
EP (1) EP0359007B1 (de)
CA (1) CA1303239C (de)
DE (1) DE68907300T2 (de)

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CA1303238C (en) * 1988-05-09 1992-06-09 Kazuhiko Umezawa Flat cooling structure of integrated circuit
JP2826387B2 (ja) * 1991-02-26 1998-11-18 甲府日本電気株式会社 温度異常検出方式
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US5802707A (en) * 1996-03-28 1998-09-08 Intel Corporation Controlled bondline thickness attachment mechanism
US5831333A (en) * 1996-05-14 1998-11-03 Sun Microsystems, Inc. Integrated junction temperature sensor/package design and method of implementing same
DE19708653C2 (de) * 1997-03-04 1999-07-08 Telefunken Microelectron Vorrichtung zur Bestimmung der Temperatur mindestens eines auf einem Trägerkörper mit geringer Wärmeleitfähigkeit angeordneten Halbleiterbauelements
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DE102005039764B4 (de) * 2005-08-23 2018-10-25 Robert Bosch Gmbh Verfahren zur Herstellung einer thermischen Kopplung
KR100656431B1 (ko) * 2005-11-09 2006-12-11 주식회사 하이닉스반도체 트랜지스터를 이용한 온도 감지 장치
US8025097B2 (en) * 2006-05-18 2011-09-27 Centipede Systems, Inc. Method and apparatus for setting and controlling temperature
US8151872B2 (en) * 2007-03-16 2012-04-10 Centipede Systems, Inc. Method and apparatus for controlling temperature
US9806003B2 (en) * 2016-01-30 2017-10-31 Intel Corporation Single base multi-floating surface cooling solution
US10168222B2 (en) * 2017-03-30 2019-01-01 Qualcomm Incorporated Thermal detector array configured to detect thermal radiation from the integrated circuit
DE102017205857B3 (de) 2017-04-06 2018-06-07 Audi Ag Kühleinrichtung, insbesondere für Elektronikbauteile, und Elektronikanordnung damit
EP3767813A4 (de) * 2018-03-13 2021-03-10 Nissan Motor Co., Ltd. Stromwandler
JP7077717B2 (ja) * 2018-03-29 2022-05-31 株式会社デンソー 電力変換装置
JP7024870B2 (ja) * 2018-06-27 2022-02-24 富士電機株式会社 冷却装置、半導体モジュールおよび車両
JP7103109B2 (ja) 2018-09-21 2022-07-20 富士電機株式会社 半導体モジュールおよび車両
EP3893274A1 (de) * 2020-04-07 2021-10-13 ABB Schweiz AG Kühlelement und verfahren zur herstellung eines kühlelements

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US4381032A (en) * 1981-04-23 1983-04-26 Cutchaw John M Apparatus for cooling high-density integrated circuit packages
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US4493010A (en) * 1982-11-05 1985-01-08 Lockheed Corporation Electronic packaging module utilizing phase-change conductive cooling
US4498122A (en) * 1982-12-29 1985-02-05 At&T Bell Laboratories High-speed, high pin-out LSI chip package
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EP0120500B1 (de) * 1983-03-29 1989-08-16 Nec Corporation LSI Verpackung hoher Dichte für logische Schaltungen
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JPS59213153A (ja) * 1983-05-18 1984-12-03 Nec Corp 集積回路冷却装置
US4602678A (en) * 1983-09-02 1986-07-29 The Bergquist Company Interfacing of heat sinks with electrical devices, and the like
JPH0673364B2 (ja) * 1983-10-28 1994-09-14 株式会社日立製作所 集積回路チップ冷却装置
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US4574879A (en) * 1984-02-29 1986-03-11 The Bergquist Company Mounting pad for solid-state devices
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JPS61189658A (ja) * 1985-02-18 1986-08-23 Fuji Photo Film Co Ltd 半導体素子温度制御装置
JPS61189657A (ja) * 1985-02-18 1986-08-23 Fuji Photo Film Co Ltd 半導体素子温度制御装置
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JPS61226946A (ja) * 1985-04-01 1986-10-08 Hitachi Ltd 集積回路チツプ冷却装置
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Also Published As

Publication number Publication date
EP0359007A3 (en) 1990-10-31
EP0359007B1 (de) 1993-06-23
EP0359007A2 (de) 1990-03-21
DE68907300T2 (de) 1993-09-30
US4975766A (en) 1990-12-04
CA1303239C (en) 1992-06-09

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee