DE60322331D1 - Verfahren zur Herstellung eines Artikels unter Verwendung einer lithographischen Projektionsmaske - Google Patents
Verfahren zur Herstellung eines Artikels unter Verwendung einer lithographischen ProjektionsmaskeInfo
- Publication number
- DE60322331D1 DE60322331D1 DE60322331T DE60322331T DE60322331D1 DE 60322331 D1 DE60322331 D1 DE 60322331D1 DE 60322331 T DE60322331 T DE 60322331T DE 60322331 T DE60322331 T DE 60322331T DE 60322331 D1 DE60322331 D1 DE 60322331D1
- Authority
- DE
- Germany
- Prior art keywords
- article
- making
- lithographic projection
- projection mask
- mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
- G03F9/7084—Position of mark on substrate, i.e. position in (x, y, z) of mark, e.g. buried or resist covered mark, mark on rearside, at the substrate edge, in the circuit area, latent image mark, marks in plural levels
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
- G03F9/7076—Mark details, e.g. phase grating mark, temporary mark
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP02258762 | 2002-12-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60322331D1 true DE60322331D1 (de) | 2008-09-04 |
Family
ID=32748763
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60322331T Expired - Fee Related DE60322331D1 (de) | 2002-12-19 | 2003-12-18 | Verfahren zur Herstellung eines Artikels unter Verwendung einer lithographischen Projektionsmaske |
Country Status (7)
Country | Link |
---|---|
US (1) | US7019814B2 (de) |
JP (1) | JP4058405B2 (de) |
KR (1) | KR100549781B1 (de) |
CN (1) | CN100335974C (de) |
DE (1) | DE60322331D1 (de) |
SG (1) | SG123589A1 (de) |
TW (1) | TWI264619B (de) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4340638B2 (ja) * | 2004-03-02 | 2009-10-07 | エーエスエムエル ネザーランズ ビー.ブイ. | 基板の表側または裏側に結像するためのリソグラフィ装置、基板識別方法、デバイス製造方法、基板、およびコンピュータプログラム |
CN1296776C (zh) * | 2004-09-22 | 2007-01-24 | 中国电子科技集团公司第二十四研究所 | 厚外延层上进行投影光刻的方法 |
JP4577231B2 (ja) * | 2006-02-21 | 2010-11-10 | 株式会社島津製作所 | 磁気マッピング装置ならびにその位置決め方法 |
US7808613B2 (en) * | 2006-08-03 | 2010-10-05 | Asml Netherlands B.V. | Individual wafer history storage for overlay corrections |
US7879514B2 (en) * | 2006-08-04 | 2011-02-01 | Asml Netherlands B.V. | Lithographic method and patterning device |
JP5253916B2 (ja) * | 2008-03-10 | 2013-07-31 | 株式会社ジャパンディスプレイイースト | マスクレス露光方法 |
NL2003762A (en) * | 2008-11-18 | 2010-05-20 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method. |
JP5126370B2 (ja) * | 2008-12-16 | 2013-01-23 | 株式会社村田製作所 | 回路モジュール |
WO2011024289A1 (ja) * | 2009-08-28 | 2011-03-03 | 富士通株式会社 | 光学部品製造方法および光学部品製造装置 |
TWI424471B (zh) * | 2009-10-27 | 2014-01-21 | Chunghwa Picture Tubes Ltd | 用以製造具有可辨識標記之基板之方法 |
CN101726989B (zh) * | 2009-11-16 | 2011-09-07 | 华映光电股份有限公司 | 用以制造具有可辨识标记的基板的方法 |
CN103246172B (zh) * | 2012-02-10 | 2016-12-28 | 约翰内斯﹒海德汉博士有限公司 | 具有位置测量装置的多个扫描单元的装置 |
CN105051611B (zh) * | 2013-03-14 | 2017-04-12 | Asml荷兰有限公司 | 图案形成装置、在衬底上生成标记的方法以及器件制造方法 |
CN103592823B (zh) * | 2013-11-25 | 2015-08-26 | 杭州士兰集成电路有限公司 | 光栅位置的测量方法 |
US9087740B2 (en) | 2013-12-09 | 2015-07-21 | International Business Machines Corporation | Fabrication of lithographic image fields using a proximity stitch metrology |
KR102392043B1 (ko) * | 2015-05-06 | 2022-04-28 | 삼성디스플레이 주식회사 | 표시 기판 노광 방법 |
IT201700079201A1 (it) * | 2017-07-13 | 2019-01-13 | Lfoundry Srl | Metodo di allineamento di maschere fotolitografiche e relativo procedimento di fabbricazione di circuiti integrati in una fetta di materiale semiconduttore |
TWI639886B (zh) * | 2017-10-23 | 2018-11-01 | Powerchip Technology Corporation | 光罩承載平台的維護方法 |
US11251096B2 (en) * | 2018-09-05 | 2022-02-15 | Micron Technology, Inc. | Wafer registration and overlay measurement systems and related methods |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4355892A (en) * | 1980-12-18 | 1982-10-26 | Censor Patent- Und Versuchs-Anstalt | Method for the projection printing |
JPH0616476B2 (ja) * | 1984-05-11 | 1994-03-02 | 株式会社ニコン | パターン露光方法 |
JPS61201427A (ja) * | 1985-03-04 | 1986-09-06 | Nippon Kogaku Kk <Nikon> | 位置ずれ検出方法 |
JP2593440B2 (ja) * | 1985-12-19 | 1997-03-26 | 株式会社ニコン | 投影型露光装置 |
US5523193A (en) | 1988-05-31 | 1996-06-04 | Texas Instruments Incorporated | Method and apparatus for patterning and imaging member |
EP0527166B1 (de) | 1990-05-02 | 1995-06-14 | Fraunhofer-Gesellschaft Zur Förderung Der Angewandten Forschung E.V. | Belichtungsvorrichtung |
JPH0444307A (ja) * | 1990-06-12 | 1992-02-14 | Nec Corp | 半導体装置の製造方法 |
US5298761A (en) * | 1991-06-17 | 1994-03-29 | Nikon Corporation | Method and apparatus for exposure process |
US5229872A (en) | 1992-01-21 | 1993-07-20 | Hughes Aircraft Company | Exposure device including an electrically aligned electronic mask for micropatterning |
JP3198310B2 (ja) * | 1993-01-06 | 2001-08-13 | 株式会社ニコン | 露光方法及び装置 |
JPH08316134A (ja) * | 1995-05-24 | 1996-11-29 | Nikon Corp | 露光方法 |
KR970016827A (ko) * | 1995-09-13 | 1997-04-28 | 오노 시게오 | 노광 방법 및 노광 장치 |
JP2988393B2 (ja) * | 1996-08-29 | 1999-12-13 | 日本電気株式会社 | 露光方法 |
JPH10172890A (ja) * | 1996-12-12 | 1998-06-26 | Nikon Corp | 投影露光方法 |
EP1197801B1 (de) | 1996-12-24 | 2005-12-28 | ASML Netherlands B.V. | Lithographisches Gerät mit zwei Objekthaltern |
EP0956516B1 (de) | 1997-01-29 | 2002-04-10 | Micronic Laser Systems Ab | Verfahren und gerät zur erzeugung eines musters auf einem mit fotoresist beschichteten substrat mittels fokusiertem laserstrahl |
SE509062C2 (sv) | 1997-02-28 | 1998-11-30 | Micronic Laser Systems Ab | Dataomvandlingsmetod för en laserskrivare med flera strålar för mycket komplexa mikrokolitografiska mönster |
WO1998040791A1 (en) | 1997-03-10 | 1998-09-17 | Koninklijke Philips Electronics N.V. | Positioning device having two object holders |
JPH11219878A (ja) | 1998-01-30 | 1999-08-10 | Sony Corp | 電子ビーム露光方法、電子ビーム露光装置、及びパターン形成方法 |
TW419720B (en) * | 1999-03-26 | 2001-01-21 | Mosel Vitelic Inc | The method of monitoring the overlay accuracy of the stepper and the device using the same |
JP2002134397A (ja) * | 2000-10-25 | 2002-05-10 | Sony Corp | フォトマスク、半導体装置、半導体チップパターンの露光方法、チップアライメント精度検査装置 |
-
2003
- 2003-12-18 JP JP2003420705A patent/JP4058405B2/ja not_active Expired - Fee Related
- 2003-12-18 DE DE60322331T patent/DE60322331D1/de not_active Expired - Fee Related
- 2003-12-18 CN CNB200310123944XA patent/CN100335974C/zh not_active Expired - Fee Related
- 2003-12-18 SG SG200307556A patent/SG123589A1/en unknown
- 2003-12-18 KR KR1020030092892A patent/KR100549781B1/ko not_active IP Right Cessation
- 2003-12-18 TW TW092135991A patent/TWI264619B/zh not_active IP Right Cessation
- 2003-12-19 US US10/738,977 patent/US7019814B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1508632A (zh) | 2004-06-30 |
SG123589A1 (en) | 2006-07-26 |
TW200424812A (en) | 2004-11-16 |
JP4058405B2 (ja) | 2008-03-12 |
US20040156027A1 (en) | 2004-08-12 |
CN100335974C (zh) | 2007-09-05 |
KR20040054559A (ko) | 2004-06-25 |
KR100549781B1 (ko) | 2006-02-06 |
US7019814B2 (en) | 2006-03-28 |
JP2004200701A (ja) | 2004-07-15 |
TWI264619B (en) | 2006-10-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |