DE60238892D1 - Vorrichtung zum Nachweis einer Feinstruktur an der Oberfläche einer Probe und Verfahren zur Herstellung einer Halbleitervorrichtung - Google Patents

Vorrichtung zum Nachweis einer Feinstruktur an der Oberfläche einer Probe und Verfahren zur Herstellung einer Halbleitervorrichtung

Info

Publication number
DE60238892D1
DE60238892D1 DE60238892T DE60238892T DE60238892D1 DE 60238892 D1 DE60238892 D1 DE 60238892D1 DE 60238892 T DE60238892 T DE 60238892T DE 60238892 T DE60238892 T DE 60238892T DE 60238892 D1 DE60238892 D1 DE 60238892D1
Authority
DE
Germany
Prior art keywords
sample
detecting
producing
fine structure
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60238892T
Other languages
English (en)
Inventor
Masahiro Hatakeyama
Takeshi Murakami
Tohru Satake
Nobuharu Noji
Ichirota Nagahama
Yuichiro Yamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Toshiba Corp
Original Assignee
Ebara Corp
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp, Toshiba Corp filed Critical Ebara Corp
Application granted granted Critical
Publication of DE60238892D1 publication Critical patent/DE60238892D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/244—Detectors; Associated components or circuits therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84—Inspecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
    • H01J37/285—Emission microscopes, e.g. field-emission microscopes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/244—Detection characterized by the detecting means
    • H01J2237/2441—Semiconductor detectors, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/244—Detection characterized by the detecting means
    • H01J2237/2446—Position sensitive detectors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
DE60238892T 2001-09-10 2002-09-10 Vorrichtung zum Nachweis einer Feinstruktur an der Oberfläche einer Probe und Verfahren zur Herstellung einer Halbleitervorrichtung Expired - Lifetime DE60238892D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001273432 2001-09-10

Publications (1)

Publication Number Publication Date
DE60238892D1 true DE60238892D1 (de) 2011-02-24

Family

ID=19098650

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60238892T Expired - Lifetime DE60238892D1 (de) 2001-09-10 2002-09-10 Vorrichtung zum Nachweis einer Feinstruktur an der Oberfläche einer Probe und Verfahren zur Herstellung einer Halbleitervorrichtung

Country Status (7)

Country Link
US (2) US7075072B2 (de)
EP (3) EP2190002B8 (de)
JP (2) JP3886871B2 (de)
KR (1) KR100888688B1 (de)
CN (2) CN1940546B (de)
DE (1) DE60238892D1 (de)
TW (1) TW589723B (de)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1721330A2 (de) * 2004-03-05 2006-11-15 Oi Corporation Fokalebenen-detektorbaugruppe eines massenspektrometers
US7480082B2 (en) * 2004-03-31 2009-01-20 Carestream Health, Inc. Radiation image scanning apparatus and method
JP4613554B2 (ja) * 2004-09-08 2011-01-19 カシオ計算機株式会社 電子顕微鏡
TW200629454A (en) 2005-02-14 2006-08-16 Powerchip Semiconductor Corp Method of detecting piping defect
TW201307833A (zh) * 2005-02-17 2013-02-16 Ebara Corp 電子射線裝置
JP2007335125A (ja) * 2006-06-13 2007-12-27 Ebara Corp 電子線装置
US7544950B2 (en) * 2006-10-30 2009-06-09 Applied Materials, Israel, Ltd. Microscope with vacuum objective
JP2008233035A (ja) * 2007-03-23 2008-10-02 Toshiba Corp 基板検査方法
US8175831B2 (en) * 2007-04-23 2012-05-08 Kla-Tencor Corp. Methods and systems for creating or performing a dynamic sampling scheme for a process during which measurements are performed on wafers
JP4988444B2 (ja) * 2007-06-19 2012-08-01 株式会社日立製作所 検査方法および装置
NL2003263A (en) * 2008-08-20 2010-03-10 Asml Holding Nv Particle detection on an object surface.
FR2942070B1 (fr) * 2009-02-11 2011-03-11 Commissariat Energie Atomique Procede de correction d'astigmatisme en imagerie par spectromicroscopie a emission d'electrons
CN102175933B (zh) * 2011-01-28 2013-09-11 南京理工大学 微通道板噪声因子测试方法
JP5963453B2 (ja) * 2011-03-15 2016-08-03 株式会社荏原製作所 検査装置
US9503606B2 (en) 2011-09-28 2016-11-22 Semiconductor Components Industries, Llc Time-delay-and-integrate image sensors having variable integration times
US10401374B2 (en) * 2014-11-30 2019-09-03 Tichauer Technical Laboratories, Llc Device and method of detecting and generating combined modulated particle wave-fronts
RU2608382C1 (ru) * 2015-10-15 2017-01-18 Акционерное общество "Лыткаринский завод оптического стекла" Способ установки ионного источника относительно обрабатываемой детали
FR3042615B1 (fr) * 2015-10-20 2017-12-08 Shyftec Dispositif pour emettre un signal d'authentification
WO2017158744A1 (ja) * 2016-03-16 2017-09-21 株式会社 日立ハイテクノロジーズ 欠陥検査方法及び欠陥検査装置
JP6666627B2 (ja) * 2016-03-28 2020-03-18 株式会社日立ハイテク 荷電粒子線装置、及び荷電粒子線装置の調整方法
US11480606B2 (en) * 2016-06-14 2022-10-25 Taiwan Semiconductor Manufacturing Co., Ltd. In-line device electrical property estimating method and test structure of the same
CN108646167B (zh) * 2018-04-27 2020-12-04 中科晶源微电子技术（北京）有限公司 用于半导体器件的激光辅助的电子束检测设备和方法
KR102630568B1 (ko) * 2018-06-15 2024-01-29 삼성전자주식회사 반도체 소자의 제조 방법
JP7102271B2 (ja) * 2018-07-17 2022-07-19 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
US10753729B2 (en) 2018-10-02 2020-08-25 Saudi Arabian Oil Company Photonic sensing analytical device
JP7157708B2 (ja) * 2019-06-25 2022-10-20 株式会社荏原製作所 電子線検査装置の二次光学系を評価する方法
US11079671B2 (en) 2019-08-23 2021-08-03 Taiwan Semiconductor Manufacturing Company Ltd. Fabricating method of photomask, photomask structure thereof, and semiconductor manufacturing method using the same

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4453086A (en) 1981-12-31 1984-06-05 International Business Machines Corporation Electron beam system with reduced charge buildup
KR860002082B1 (ko) * 1983-01-19 1986-11-24 가부시기가이샤 도시바 레지스트 패턴의 형성 방법 및 장치
US4666228A (en) * 1983-09-28 1987-05-19 Pave Technology Co. Hermetic connector and method
US4550039A (en) * 1984-03-01 1985-10-29 Lucitron, Inc. Method and apparatus for making electric connections into a compliant sealed package
US4795977A (en) * 1987-03-19 1989-01-03 Pacific Western Systems, Inc. Interface system for interfacing a device tester to a device under test
US5004919A (en) 1989-07-05 1991-04-02 Jeol, Ltd. Transmission electron microscope
JPH03297083A (ja) 1990-04-13 1991-12-27 Texas Instr Japan Ltd ソケット
US5065029A (en) * 1990-08-03 1991-11-12 Gatan, Inc. Cooled CCD camera for an electron microscope
JPH071688B2 (ja) * 1991-02-15 1995-01-11 株式会社島津製作所 走査型反射電子回折顕微鏡
JP3148353B2 (ja) 1991-05-30 2001-03-19 ケーエルエー・インストルメンツ・コーポレーション 電子ビーム検査方法とそのシステム
JP3730263B2 (ja) 1992-05-27 2005-12-21 ケーエルエー・インストルメンツ・コーポレーション 荷電粒子ビームを用いた自動基板検査の装置及び方法
US5315113A (en) * 1992-09-29 1994-05-24 The Perkin-Elmer Corporation Scanning and high resolution x-ray photoelectron spectroscopy and imaging
CN1073014A (zh) * 1992-10-28 1993-06-09 复旦大学 获得固体表面元素分布图的方法
US5434901A (en) 1992-12-07 1995-07-18 Olympus Optical Co., Ltd. Soft X-ray microscope
JP3409909B2 (ja) 1994-03-11 2003-05-26 株式会社東芝 ウェーハパターンの欠陥検出方法及び同装置
JP3258821B2 (ja) * 1994-06-02 2002-02-18 三菱電機株式会社 微小異物の位置決め方法、分析方法、これに用いる分析装置およびこれを用いた半導体素子もしくは液晶表示素子の製法
JPH0990607A (ja) * 1995-07-14 1997-04-04 Canon Inc 原版検査修正装置及び方法
US5868664A (en) * 1996-02-23 1999-02-09 Envision Medical Corporation Electrically isolated sterilizable endoscopic video camera head
JP3791095B2 (ja) * 1996-03-05 2006-06-28 株式会社日立製作所 回路パターンの検査方法及び検査装置
JPH09312318A (ja) * 1996-05-21 1997-12-02 Hitachi Ltd パタ−ン欠陥検査装置
JP4310824B2 (ja) * 1998-10-05 2009-08-12 株式会社ニコン 電子ビーム検査装置
US6184526B1 (en) * 1997-01-08 2001-02-06 Nikon Corporation Apparatus and method for inspecting predetermined region on surface of specimen using electron beam
WO1999029103A1 (fr) * 1997-11-28 1999-06-10 Hamamatsu Photonics K.K. Dispositif de capture d'images a semi-conducteurs et analyseur utilisant ledit dispositif
JPH11242943A (ja) 1997-12-18 1999-09-07 Nikon Corp 検査装置
JPH11283545A (ja) * 1998-03-30 1999-10-15 Nikon Corp 電子画像観察装置
JP3724949B2 (ja) * 1998-05-15 2005-12-07 株式会社東芝 基板検査装置およびこれを備えた基板検査システム並びに基板検査方法
JP3533335B2 (ja) * 1999-01-26 2004-05-31 独立行政法人 科学技術振興機構 化学分析用複合放出電子顕微鏡装置
JP3851740B2 (ja) * 1999-02-10 2006-11-29 株式会社東芝 基板検査装置
KR100664422B1 (ko) * 1999-05-28 2007-01-04 닛폰 하츠죠 가부시키가이샤 도전성 접촉자
JP2001235430A (ja) 2000-02-25 2001-08-31 Nikon Corp 光学式検査装置および光学式表面検査装置
KR20010007152A (ko) 1999-06-01 2001-01-26 오노 시게오 결함검사장치 및 결함검사방법
JP3805565B2 (ja) * 1999-06-11 2006-08-02 株式会社日立製作所 電子線画像に基づく検査または計測方法およびその装置
JP2001102429A (ja) 1999-07-29 2001-04-13 Nikon Corp ステージ装置およびそれを備えた検査装置
WO2001024218A1 (en) * 1999-09-30 2001-04-05 Gatan, Inc. Electron image detector coupled by optical fibers with absorbing outer cladding to reduce blurring
JP2001118536A (ja) * 1999-10-19 2001-04-27 Nikon Corp 荷電粒子ビーム制御素子および荷電粒子ビーム装置
US6531041B1 (en) 2000-07-20 2003-03-11 Symyx Technologies, Inc. Multiplexed capillary electrophoresis system with rotatable photodetector
US6567497B2 (en) * 2001-04-20 2003-05-20 Lockheed Martin Corporation Method and apparatus for inspecting a structure using X-rays

Also Published As

Publication number Publication date
CN1940546B (zh) 2011-07-20
JP2006080541A (ja) 2006-03-23
JP3886871B2 (ja) 2007-02-28
EP3089193A1 (de) 2016-11-02
JP2003179113A (ja) 2003-06-27
EP2190002B1 (de) 2016-06-01
CN1310025C (zh) 2007-04-11
US7449691B2 (en) 2008-11-11
US20030047682A1 (en) 2003-03-13
EP1291900B1 (de) 2011-01-12
KR100888688B1 (ko) 2009-03-13
TW589723B (en) 2004-06-01
EP1291900A2 (de) 2003-03-12
CN1407334A (zh) 2003-04-02
EP1291900A3 (de) 2003-05-28
KR20030022712A (ko) 2003-03-17
EP2190002B8 (de) 2016-09-14
EP2190002A1 (de) 2010-05-26
US20060219909A1 (en) 2006-10-05
CN1940546A (zh) 2007-04-04
US7075072B2 (en) 2006-07-11

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