DE60227433D1 - Einkomponentige thermoset epoxidharzzusammensetzung und unterfüllungsmaterial für halbleitermontage - Google Patents

Einkomponentige thermoset epoxidharzzusammensetzung und unterfüllungsmaterial für halbleitermontage

Info

Publication number
DE60227433D1
DE60227433D1 DE60227433T DE60227433T DE60227433D1 DE 60227433 D1 DE60227433 D1 DE 60227433D1 DE 60227433 T DE60227433 T DE 60227433T DE 60227433 T DE60227433 T DE 60227433T DE 60227433 D1 DE60227433 D1 DE 60227433D1
Authority
DE
Germany
Prior art keywords
epoxy resin
resin composition
semiconductor assembly
type epoxy
thermoset epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60227433T
Other languages
German (de)
English (en)
Inventor
Johshi Gotoh
Tatsuya Okuno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sunstar Giken KK
Sunstar Engineering Inc
Original Assignee
Sunstar Giken KK
Sunstar Engineering Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sunstar Giken KK, Sunstar Engineering Inc filed Critical Sunstar Giken KK
Application granted granted Critical
Publication of DE60227433D1 publication Critical patent/DE60227433D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01012—Magnesium [Mg]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers

Landscapes

  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
DE60227433T 2001-03-30 2002-03-29 Einkomponentige thermoset epoxidharzzusammensetzung und unterfüllungsmaterial für halbleitermontage Expired - Lifetime DE60227433D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001099479A JP5280597B2 (ja) 2001-03-30 2001-03-30 一液加熱硬化型エポキシ樹脂組成物および半導体実装用アンダーフィル材

Publications (1)

Publication Number Publication Date
DE60227433D1 true DE60227433D1 (de) 2008-08-14

Family

ID=18953017

Family Applications (2)

Application Number Title Priority Date Filing Date
DE60227433T Expired - Lifetime DE60227433D1 (de) 2001-03-30 2002-03-29 Einkomponentige thermoset epoxidharzzusammensetzung und unterfüllungsmaterial für halbleitermontage
DE60217095T Expired - Lifetime DE60217095T2 (de) 2001-03-30 2002-03-29 Einkomponentige heisshärtende epoxidharzzusammensetzung und halbleitermontage-unterfüllungsmaterial

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE60217095T Expired - Lifetime DE60217095T2 (de) 2001-03-30 2002-03-29 Einkomponentige heisshärtende epoxidharzzusammensetzung und halbleitermontage-unterfüllungsmaterial

Country Status (6)

Country Link
US (1) US7449362B2 (fr)
EP (2) EP1384738B1 (fr)
JP (1) JP5280597B2 (fr)
AT (2) ATE349475T1 (fr)
DE (2) DE60227433D1 (fr)
WO (1) WO2002079294A1 (fr)

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JP2007162001A (ja) 2005-11-21 2007-06-28 Shin Etsu Chem Co Ltd 液状エポキシ樹脂組成物
US20080036097A1 (en) * 2006-08-10 2008-02-14 Teppei Ito Semiconductor package, method of production thereof and encapsulation resin
WO2008136352A1 (fr) 2007-04-27 2008-11-13 Sumitomo Bakelite Company Limited Procédé de liaison de tranches semi-conductrices et procédé de fabrication d'un dispositif semi-conducteur
KR101840486B1 (ko) * 2010-04-21 2018-03-20 미츠비시 가스 가가쿠 가부시키가이샤 열경화성 조성물
KR101319493B1 (ko) * 2010-12-30 2013-10-22 주식회사 삼양사 감광성 수지 조성물 및 이로부터 제조되는 절연막
JP5467469B2 (ja) 2011-01-04 2014-04-09 山栄化学株式会社 プリント配線基板に表面実装する方法
JP5739372B2 (ja) * 2012-04-25 2015-06-24 信越化学工業株式会社 接着剤組成物、並びにこれを用いた接着シート、半導体装置保護用材料、及び半導体装置
CN108587385A (zh) * 2018-05-30 2018-09-28 安徽润晟建设有限公司 一种耐冲击防水环氧涂料
CN110649241B (zh) * 2019-09-27 2021-01-26 东北大学 硅基Si-B-C负极材料及其电化学合成方法和应用
WO2021152934A1 (fr) * 2020-01-29 2021-08-05 株式会社村田製作所 Composant passif pourvu d'une électrode et ensemble de type composant passif pourvu d'une électrode

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Also Published As

Publication number Publication date
ATE349475T1 (de) 2007-01-15
WO2002079294A1 (fr) 2002-10-10
EP1754735B1 (fr) 2008-07-02
US20040209403A1 (en) 2004-10-21
JP5280597B2 (ja) 2013-09-04
EP1384738B1 (fr) 2006-12-27
JP2002293883A (ja) 2002-10-09
DE60217095T2 (de) 2007-10-31
EP1384738A1 (fr) 2004-01-28
US7449362B2 (en) 2008-11-11
DE60217095D1 (de) 2007-02-08
EP1384738A4 (fr) 2005-08-10
EP1754735A1 (fr) 2007-02-21
ATE399806T1 (de) 2008-07-15

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