DE60223009T2 - Additionsvernetzbare silikonzusammensetzung gelartiger konsistenz - Google Patents

Additionsvernetzbare silikonzusammensetzung gelartiger konsistenz Download PDF

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Publication number
DE60223009T2
DE60223009T2 DE60223009T DE60223009T DE60223009T2 DE 60223009 T2 DE60223009 T2 DE 60223009T2 DE 60223009 T DE60223009 T DE 60223009T DE 60223009 T DE60223009 T DE 60223009T DE 60223009 T2 DE60223009 T2 DE 60223009T2
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DE
Germany
Prior art keywords
component
sio
sub
silicone gel
gel composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60223009T
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German (de)
English (en)
Other versions
DE60223009D1 (de
Inventor
Masayoshi Ichihara-shi TERADA
Hiroji Ichihara-shi Enami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Original Assignee
Dow Corning Toray Co Ltd
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Filing date
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Publication of DE60223009D1 publication Critical patent/DE60223009D1/de
Application granted granted Critical
Publication of DE60223009T2 publication Critical patent/DE60223009T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0091—Complexes with metal-heteroatom-bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Agricultural Chemicals And Associated Chemicals (AREA)
  • Cosmetics (AREA)
DE60223009T 2001-04-26 2002-04-15 Additionsvernetzbare silikonzusammensetzung gelartiger konsistenz Expired - Lifetime DE60223009T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001128722A JP4875251B2 (ja) 2001-04-26 2001-04-26 シリコーンゲル組成物
JP2001128722 2001-04-26
PCT/JP2002/003744 WO2002088252A1 (en) 2001-04-26 2002-04-15 Addition-curable silicone gel composition

Publications (2)

Publication Number Publication Date
DE60223009D1 DE60223009D1 (de) 2007-11-29
DE60223009T2 true DE60223009T2 (de) 2008-07-31

Family

ID=18977379

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60223009T Expired - Lifetime DE60223009T2 (de) 2001-04-26 2002-04-15 Additionsvernetzbare silikonzusammensetzung gelartiger konsistenz

Country Status (8)

Country Link
US (1) US6881807B2 (https=)
EP (1) EP1381650B1 (https=)
JP (1) JP4875251B2 (https=)
KR (1) KR100863148B1 (https=)
AT (1) ATE376032T1 (https=)
DE (1) DE60223009T2 (https=)
TW (1) TW593546B (https=)
WO (1) WO2002088252A1 (https=)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0212324D0 (en) * 2002-05-29 2002-07-10 Dow Corning Silicon composition
JP4520137B2 (ja) * 2002-12-10 2010-08-04 信越化学工業株式会社 一液型オルガノポリシロキサンゲル組成物
JP4703374B2 (ja) * 2005-11-04 2011-06-15 信越化学工業株式会社 シリコーンゲル組成物
US7767754B2 (en) * 2005-11-08 2010-08-03 Momentive Performance Materials Inc. Silicone composition and process of making same
US7479522B2 (en) * 2005-11-09 2009-01-20 Momentive Performance Materials Inc. Silicone elastomer composition
DE102006022880B4 (de) * 2006-05-15 2010-09-30 Kettenbach Gmbh & Co. Kg Mehrstufiges Verfahren zur Sterilisation von aushärtbaren, medizinischen Mehrkomponenten-Abformmaterialien
JP5148088B2 (ja) * 2006-08-25 2013-02-20 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP2010120979A (ja) * 2008-11-17 2010-06-03 Taika:Kk 熱伝導性シリコーンゲル硬化物
JP2010144130A (ja) * 2008-12-22 2010-07-01 Taika:Kk 硬化性オルガノポリシロキサン組成物
JPWO2012137977A1 (ja) * 2011-04-08 2014-07-28 東レ・ダウコーニング株式会社 被膜形成用組成物
JP5477365B2 (ja) * 2011-12-02 2014-04-23 日立金属株式会社 光コネクタ
CN104937035B (zh) 2012-12-12 2018-11-16 3M创新有限公司 可室温固化的硅氧烷基凝胶
DE102013013984A1 (de) * 2013-08-23 2015-02-26 Elantas Gmbh Silikongel mit verringerter Schadgasemission
WO2015030262A1 (en) * 2013-08-28 2015-03-05 Dow Corning Toray Co., Ltd. Curable silicone composition, cured product thereof, and optical semiconductor device
US9951186B2 (en) 2013-09-03 2018-04-24 Dow Corning Toray Co., Ltd Silicone gel composition and use thereof
JP6023894B2 (ja) 2013-10-17 2016-11-09 信越化学工業株式会社 シリコーンゲル組成物及びシリコーンゲル硬化物
CN106103594B (zh) 2014-01-27 2019-06-28 陶氏东丽株式会社 有机硅凝胶组合物
CN108369927B (zh) * 2015-11-27 2021-06-11 三菱电机株式会社 电力用半导体装置
CN107502279B (zh) * 2017-08-11 2020-11-06 汕头市骏码凯撒有限公司 一种耐高温触变性led封装胶及其制备方法
JP7074093B2 (ja) * 2019-02-07 2022-05-24 信越化学工業株式会社 剥離性シリコーンゲル組成物
CN114651032A (zh) * 2019-11-08 2022-06-21 汉高股份有限及两合公司 耐高温双组分有机硅粘合剂
EP4181183B1 (en) 2020-07-13 2025-12-03 Dow Toray Co., Ltd. Silicone gel composition, cured product thereof, and use therefor
CN115926742A (zh) * 2022-12-02 2023-04-07 江苏中恒电子新材料有限公司 一种用于仪器仪表防水的有机硅凝胶及其制备方法
EP4632011A1 (en) 2022-12-06 2025-10-15 Dow Toray Co., Ltd. Organopolysiloxane composition, cured product thereof, electronic component sealing agent, electronic component, and method for protecting semiconductor chip

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4743474A (en) * 1983-08-05 1988-05-10 Dow Corning Corporation Coating process and moisture-curable organopolysiloxane compositions therefor
JP2522721B2 (ja) 1990-08-01 1996-08-07 信越化学工業株式会社 オルガノポリシロキサン組成物及びそのゲル硬化物
US5432280A (en) 1992-07-03 1995-07-11 Shin-Etsu Chemical Co., Ltd. Gel-forming silicone composition
JP2711621B2 (ja) * 1992-07-16 1998-02-10 信越化学工業株式会社 耐熱性シリコーンゴム組成物
JPH06145525A (ja) * 1992-11-05 1994-05-24 Toray Dow Corning Silicone Co Ltd 硬化性オルガノポリシロキサン組成物
JP2739407B2 (ja) * 1993-02-09 1998-04-15 信越化学工業株式会社 低弾性率シリコーンゲル組成物及びそのゲル状硬化物
EP0661335A1 (en) 1993-12-27 1995-07-05 Dow Corning Corporation Organosiloxane compositions capable of curing against acid-containing solder fluxes
JP3028744B2 (ja) * 1994-02-28 2000-04-04 信越化学工業株式会社 シリコーンコーティング加工基材及びエアバッグ基材
JPH0853622A (ja) * 1994-06-07 1996-02-27 Shin Etsu Chem Co Ltd シリコーンゲル組成物
JP3277749B2 (ja) * 1995-04-03 2002-04-22 信越化学工業株式会社 シリコーンゲル組成物及びポッティング材
JP3576639B2 (ja) * 1995-05-29 2004-10-13 東レ・ダウコーニング・シリコーン株式会社 熱伝導性シリコーンゴム組成物
JP3638746B2 (ja) * 1997-01-30 2005-04-13 東レ・ダウコーニング・シリコーン株式会社 電気・電子部品封止・充填用シリコーンゲル組成物およびシリコーンゲル
JP3718350B2 (ja) * 1998-08-10 2005-11-24 富士高分子工業株式会社 熱伝導性・電気絶縁性シリコーンゴム組成物およびシリコーンゲル組成物
JP3700908B2 (ja) * 1998-09-25 2005-09-28 東レ・ダウコーニング株式会社 シリコーン系接着性シート

Also Published As

Publication number Publication date
EP1381650A1 (en) 2004-01-21
TW593546B (en) 2004-06-21
WO2002088252A1 (en) 2002-11-07
US20040147702A1 (en) 2004-07-29
DE60223009D1 (de) 2007-11-29
US6881807B2 (en) 2005-04-19
KR20040015156A (ko) 2004-02-18
JP2002322364A (ja) 2002-11-08
KR100863148B1 (ko) 2008-10-13
JP4875251B2 (ja) 2012-02-15
EP1381650B1 (en) 2007-10-17
ATE376032T1 (de) 2007-11-15

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Legal Events

Date Code Title Description
8381 Inventor (new situation)

Inventor name: TERADA, MASAYOSHI, ICHIHARA-SHI, CHIBA 299-010, JP

Inventor name: ENAMI, HIROJI, ICHIHARA-SHI, CHIBA 299-0108, JP

8364 No opposition during term of opposition