JP4875251B2 - シリコーンゲル組成物 - Google Patents

シリコーンゲル組成物 Download PDF

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Publication number
JP4875251B2
JP4875251B2 JP2001128722A JP2001128722A JP4875251B2 JP 4875251 B2 JP4875251 B2 JP 4875251B2 JP 2001128722 A JP2001128722 A JP 2001128722A JP 2001128722 A JP2001128722 A JP 2001128722A JP 4875251 B2 JP4875251 B2 JP 4875251B2
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JP
Japan
Prior art keywords
sub
group
component
units
silicone gel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2001128722A
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English (en)
Japanese (ja)
Other versions
JP2002322364A (ja
JP2002322364A5 (https=
Inventor
匡慶 寺田
博司 江南
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Original Assignee
Dow Corning Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Priority to JP2001128722A priority Critical patent/JP4875251B2/ja
Priority to TW091106774A priority patent/TW593546B/zh
Priority to EP02718590A priority patent/EP1381650B1/en
Priority to KR1020037013990A priority patent/KR100863148B1/ko
Priority to DE60223009T priority patent/DE60223009T2/de
Priority to US10/476,055 priority patent/US6881807B2/en
Priority to PCT/JP2002/003744 priority patent/WO2002088252A1/en
Priority to AT02718590T priority patent/ATE376032T1/de
Publication of JP2002322364A publication Critical patent/JP2002322364A/ja
Publication of JP2002322364A5 publication Critical patent/JP2002322364A5/ja
Application granted granted Critical
Publication of JP4875251B2 publication Critical patent/JP4875251B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0091—Complexes with metal-heteroatom-bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Agricultural Chemicals And Associated Chemicals (AREA)
  • Cosmetics (AREA)
JP2001128722A 2001-04-26 2001-04-26 シリコーンゲル組成物 Expired - Lifetime JP4875251B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2001128722A JP4875251B2 (ja) 2001-04-26 2001-04-26 シリコーンゲル組成物
TW091106774A TW593546B (en) 2001-04-26 2002-04-03 Silicone gel composition
KR1020037013990A KR100863148B1 (ko) 2001-04-26 2002-04-15 부가 경화성 실리콘 겔 조성물
DE60223009T DE60223009T2 (de) 2001-04-26 2002-04-15 Additionsvernetzbare silikonzusammensetzung gelartiger konsistenz
EP02718590A EP1381650B1 (en) 2001-04-26 2002-04-15 Addition-curable silicone gel composition
US10/476,055 US6881807B2 (en) 2001-04-26 2002-04-15 Addition-curable silicone gel composition
PCT/JP2002/003744 WO2002088252A1 (en) 2001-04-26 2002-04-15 Addition-curable silicone gel composition
AT02718590T ATE376032T1 (de) 2001-04-26 2002-04-15 Additionsvernetzbare silikonzusammensetzung gelartiger konsistenz

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001128722A JP4875251B2 (ja) 2001-04-26 2001-04-26 シリコーンゲル組成物

Publications (3)

Publication Number Publication Date
JP2002322364A JP2002322364A (ja) 2002-11-08
JP2002322364A5 JP2002322364A5 (https=) 2008-05-01
JP4875251B2 true JP4875251B2 (ja) 2012-02-15

Family

ID=18977379

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001128722A Expired - Lifetime JP4875251B2 (ja) 2001-04-26 2001-04-26 シリコーンゲル組成物

Country Status (8)

Country Link
US (1) US6881807B2 (https=)
EP (1) EP1381650B1 (https=)
JP (1) JP4875251B2 (https=)
KR (1) KR100863148B1 (https=)
AT (1) ATE376032T1 (https=)
DE (1) DE60223009T2 (https=)
TW (1) TW593546B (https=)
WO (1) WO2002088252A1 (https=)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0212324D0 (en) * 2002-05-29 2002-07-10 Dow Corning Silicon composition
JP4520137B2 (ja) * 2002-12-10 2010-08-04 信越化学工業株式会社 一液型オルガノポリシロキサンゲル組成物
JP4703374B2 (ja) * 2005-11-04 2011-06-15 信越化学工業株式会社 シリコーンゲル組成物
US7767754B2 (en) * 2005-11-08 2010-08-03 Momentive Performance Materials Inc. Silicone composition and process of making same
US7479522B2 (en) * 2005-11-09 2009-01-20 Momentive Performance Materials Inc. Silicone elastomer composition
DE102006022880B4 (de) * 2006-05-15 2010-09-30 Kettenbach Gmbh & Co. Kg Mehrstufiges Verfahren zur Sterilisation von aushärtbaren, medizinischen Mehrkomponenten-Abformmaterialien
JP5148088B2 (ja) * 2006-08-25 2013-02-20 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP2010120979A (ja) * 2008-11-17 2010-06-03 Taika:Kk 熱伝導性シリコーンゲル硬化物
JP2010144130A (ja) * 2008-12-22 2010-07-01 Taika:Kk 硬化性オルガノポリシロキサン組成物
JPWO2012137977A1 (ja) * 2011-04-08 2014-07-28 東レ・ダウコーニング株式会社 被膜形成用組成物
JP5477365B2 (ja) * 2011-12-02 2014-04-23 日立金属株式会社 光コネクタ
CN104937035B (zh) 2012-12-12 2018-11-16 3M创新有限公司 可室温固化的硅氧烷基凝胶
DE102013013984A1 (de) * 2013-08-23 2015-02-26 Elantas Gmbh Silikongel mit verringerter Schadgasemission
WO2015030262A1 (en) * 2013-08-28 2015-03-05 Dow Corning Toray Co., Ltd. Curable silicone composition, cured product thereof, and optical semiconductor device
US9951186B2 (en) 2013-09-03 2018-04-24 Dow Corning Toray Co., Ltd Silicone gel composition and use thereof
JP6023894B2 (ja) 2013-10-17 2016-11-09 信越化学工業株式会社 シリコーンゲル組成物及びシリコーンゲル硬化物
CN106103594B (zh) 2014-01-27 2019-06-28 陶氏东丽株式会社 有机硅凝胶组合物
CN108369927B (zh) * 2015-11-27 2021-06-11 三菱电机株式会社 电力用半导体装置
CN107502279B (zh) * 2017-08-11 2020-11-06 汕头市骏码凯撒有限公司 一种耐高温触变性led封装胶及其制备方法
JP7074093B2 (ja) * 2019-02-07 2022-05-24 信越化学工業株式会社 剥離性シリコーンゲル組成物
CN114651032A (zh) * 2019-11-08 2022-06-21 汉高股份有限及两合公司 耐高温双组分有机硅粘合剂
EP4181183B1 (en) 2020-07-13 2025-12-03 Dow Toray Co., Ltd. Silicone gel composition, cured product thereof, and use therefor
CN115926742A (zh) * 2022-12-02 2023-04-07 江苏中恒电子新材料有限公司 一种用于仪器仪表防水的有机硅凝胶及其制备方法
EP4632011A1 (en) 2022-12-06 2025-10-15 Dow Toray Co., Ltd. Organopolysiloxane composition, cured product thereof, electronic component sealing agent, electronic component, and method for protecting semiconductor chip

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4743474A (en) * 1983-08-05 1988-05-10 Dow Corning Corporation Coating process and moisture-curable organopolysiloxane compositions therefor
JP2522721B2 (ja) 1990-08-01 1996-08-07 信越化学工業株式会社 オルガノポリシロキサン組成物及びそのゲル硬化物
US5432280A (en) 1992-07-03 1995-07-11 Shin-Etsu Chemical Co., Ltd. Gel-forming silicone composition
JP2711621B2 (ja) * 1992-07-16 1998-02-10 信越化学工業株式会社 耐熱性シリコーンゴム組成物
JPH06145525A (ja) * 1992-11-05 1994-05-24 Toray Dow Corning Silicone Co Ltd 硬化性オルガノポリシロキサン組成物
JP2739407B2 (ja) * 1993-02-09 1998-04-15 信越化学工業株式会社 低弾性率シリコーンゲル組成物及びそのゲル状硬化物
EP0661335A1 (en) 1993-12-27 1995-07-05 Dow Corning Corporation Organosiloxane compositions capable of curing against acid-containing solder fluxes
JP3028744B2 (ja) * 1994-02-28 2000-04-04 信越化学工業株式会社 シリコーンコーティング加工基材及びエアバッグ基材
JPH0853622A (ja) * 1994-06-07 1996-02-27 Shin Etsu Chem Co Ltd シリコーンゲル組成物
JP3277749B2 (ja) * 1995-04-03 2002-04-22 信越化学工業株式会社 シリコーンゲル組成物及びポッティング材
JP3576639B2 (ja) * 1995-05-29 2004-10-13 東レ・ダウコーニング・シリコーン株式会社 熱伝導性シリコーンゴム組成物
JP3638746B2 (ja) * 1997-01-30 2005-04-13 東レ・ダウコーニング・シリコーン株式会社 電気・電子部品封止・充填用シリコーンゲル組成物およびシリコーンゲル
JP3718350B2 (ja) * 1998-08-10 2005-11-24 富士高分子工業株式会社 熱伝導性・電気絶縁性シリコーンゴム組成物およびシリコーンゲル組成物
JP3700908B2 (ja) * 1998-09-25 2005-09-28 東レ・ダウコーニング株式会社 シリコーン系接着性シート

Also Published As

Publication number Publication date
EP1381650A1 (en) 2004-01-21
TW593546B (en) 2004-06-21
WO2002088252A1 (en) 2002-11-07
US20040147702A1 (en) 2004-07-29
DE60223009D1 (de) 2007-11-29
US6881807B2 (en) 2005-04-19
KR20040015156A (ko) 2004-02-18
JP2002322364A (ja) 2002-11-08
KR100863148B1 (ko) 2008-10-13
EP1381650B1 (en) 2007-10-17
ATE376032T1 (de) 2007-11-15
DE60223009T2 (de) 2008-07-31

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