DE60221353D1 - Radarsensor - Google Patents

Radarsensor

Info

Publication number
DE60221353D1
DE60221353D1 DE60221353T DE60221353T DE60221353D1 DE 60221353 D1 DE60221353 D1 DE 60221353D1 DE 60221353 T DE60221353 T DE 60221353T DE 60221353 T DE60221353 T DE 60221353T DE 60221353 D1 DE60221353 D1 DE 60221353D1
Authority
DE
Germany
Prior art keywords
radar sensor
radar
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60221353T
Other languages
English (en)
Other versions
DE60221353T2 (de
Inventor
Toshiyuki Nagasaku
Hiroshi Kondoh
Hiroshi Shinoda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of DE60221353D1 publication Critical patent/DE60221353D1/de
Publication of DE60221353T2 publication Critical patent/DE60221353T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/02—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S13/00
    • G01S7/03—Details of HF subsystems specially adapted therefor, e.g. common to transmitter and receiver
    • G01S7/032—Constructional details for solid-state radar subsystems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/27—Adaptation for use in or on movable bodies
    • H01Q1/32—Adaptation for use in or on road or rail vehicles
    • H01Q1/3208—Adaptation for use in or on road or rail vehicles characterised by the application wherein the antenna is used
    • H01Q1/3233—Adaptation for use in or on road or rail vehicles characterised by the application wherein the antenna is used particular used as part of a sensor or in a security system, e.g. for automotive radar, navigation systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/40—Radiating elements coated with or embedded in protective material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H01Q1/526—Electromagnetic shields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
    • H01Q15/02—Refracting or diffracting devices, e.g. lens, prism
    • H01Q15/08—Refracting or diffracting devices, e.g. lens, prism formed of solid dielectric material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q19/00—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic
    • H01Q19/06—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using refracting or diffracting devices, e.g. lens
    • H01Q19/09—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using refracting or diffracting devices, e.g. lens wherein the primary active element is coated with or embedded in a dielectric or magnetic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S13/00—Systems using the reflection or reradiation of radio waves, e.g. radar systems; Analogous systems using reflection or reradiation of waves whose nature or wavelength is irrelevant or unspecified
    • G01S13/88—Radar or analogous systems specially adapted for specific applications
    • G01S13/93—Radar or analogous systems specially adapted for specific applications for anti-collision purposes
    • G01S13/931—Radar or analogous systems specially adapted for specific applications for anti-collision purposes of land vehicles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Computer Security & Cryptography (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • General Physics & Mathematics (AREA)
  • Radar Systems Or Details Thereof (AREA)
  • Aerials With Secondary Devices (AREA)
DE60221353T 2002-04-26 2002-08-28 Radarsensor Expired - Lifetime DE60221353T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002125910A JP4523223B2 (ja) 2002-04-26 2002-04-26 レーダセンサ
JP2002125910 2002-04-26

Publications (2)

Publication Number Publication Date
DE60221353D1 true DE60221353D1 (de) 2007-09-06
DE60221353T2 DE60221353T2 (de) 2008-04-17

Family

ID=28786816

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60221353T Expired - Lifetime DE60221353T2 (de) 2002-04-26 2002-08-28 Radarsensor

Country Status (4)

Country Link
US (3) US6717544B2 (de)
EP (1) EP1357395B1 (de)
JP (1) JP4523223B2 (de)
DE (1) DE60221353T2 (de)

Families Citing this family (95)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4239352B2 (ja) * 2000-03-28 2009-03-18 株式会社日立製作所 電子装置の製造方法
JP4523223B2 (ja) * 2002-04-26 2010-08-11 株式会社日立製作所 レーダセンサ
JP3721152B2 (ja) * 2002-09-20 2005-11-30 株式会社日立製作所 電波レーダ装置および車両用電波レーダ装置
CN1318863C (zh) * 2003-03-11 2007-05-30 欧宝士株式会社 物体检测装置
DE102004042661A1 (de) * 2004-04-13 2005-11-03 Mso Messtechnik Und Ortung Gmbh Kraftfahrzeug mit einer Vorrichtung zum berührungslosen Ermitteln einer Kraftfahrzeugeigenbewegung, Vorrichtung mit einer Radareinrichtung und Verwendung einer diesbezüglichen Vorrichtung sowie Verfahren zum berührungslosen Ermitteln einer Fahrzeugeigenbewegung
US7239266B2 (en) * 2004-08-26 2007-07-03 Honeywell International Inc. Radar altimeter
DE102004059395A1 (de) * 2004-12-09 2006-06-14 Siemens Ag Sende- und/oder Empfangseinrichtung
JP4456998B2 (ja) 2004-12-28 2010-04-28 日立オートモティブシステムズ株式会社 速度センサおよびそれを用いた対地車速センサ
US20060276157A1 (en) * 2005-06-03 2006-12-07 Chen Zhi N Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications
EP1772748A1 (de) * 2005-10-05 2007-04-11 Sony Deutschland GmbH Mikrowellen Ausrichtungsvorrichtung
DE102005056756A1 (de) * 2005-11-29 2007-05-31 Robert Bosch Gmbh Antennenanordnung für einen Radar-Sensor
US20090237306A1 (en) * 2005-12-02 2009-09-24 University Of Florida Research Foundation, Inc Compact integrated monopole antennas
JP2007267217A (ja) * 2006-03-29 2007-10-11 Fujitsu Component Ltd アンテナ装置
DE102006019886B4 (de) * 2006-04-28 2013-02-21 Infineon Technologies Ag Radarsystem
US8232919B2 (en) * 2006-12-29 2012-07-31 Broadcom Corporation Integrated circuit MEMs antenna structure
GB0705449D0 (en) * 2007-03-22 2007-05-02 Siemens Milltronics Proc Instr A high frequency radar system
ITTO20070325A1 (it) * 2007-05-11 2008-11-12 St Microelectronics Srl Isolatore galvanico integrato utilizzante trasmissione wireless
WO2009002464A2 (en) 2007-06-22 2008-12-31 Vubiq Incorporated System and method for wireless communication in a backplane fabric architecture
US7768457B2 (en) * 2007-06-22 2010-08-03 Vubiq, Inc. Integrated antenna and chip package and method of manufacturing thereof
DE102007034329A1 (de) * 2007-07-24 2009-01-29 Robert Bosch Gmbh Radarvorrichtung
JP2009058450A (ja) * 2007-08-31 2009-03-19 Fujitsu Ten Ltd レーダ装置のユニットシャーシ
US8022861B2 (en) * 2008-04-04 2011-09-20 Toyota Motor Engineering & Manufacturing North America, Inc. Dual-band antenna array and RF front-end for mm-wave imager and radar
DE102008038365A1 (de) * 2008-07-02 2010-01-07 Adc Automotive Distance Control Systems Gmbh Fahrzeug-Radarsystem und Verfahren zur Bestimmung einer Position zumindest eines Objekts relativ zu einem Fahrzeug
DE102008047103B4 (de) * 2008-09-12 2011-03-24 Cnrs Centre National De La Recherche Scientifique Vorrichtung und Verfahren zur dreidimensionalen Bildgebung mit THz-Strahlung
DE102008042449A1 (de) * 2008-09-29 2010-04-01 Robert Bosch Gmbh Radarsensor mit abgeschirmtem Signalstabilisator
JP5761585B2 (ja) * 2008-10-07 2015-08-12 国立研究開発法人情報通信研究機構 パルスレーダ装置
EP3351910A3 (de) * 2008-10-29 2018-09-05 VEGA Grieshaber KG Hochfrequenzmodul zur füllstandmessung im w-band
US8554136B2 (en) 2008-12-23 2013-10-08 Waveconnex, Inc. Tightly-coupled near-field communication-link connector-replacement chips
US8378759B2 (en) * 2009-01-16 2013-02-19 Toyota Motor Engineering & Manufacturing North America, Inc. First and second coplanar microstrip lines separated by rows of vias for reducing cross-talk there between
EP2417475B1 (de) 2009-04-06 2013-08-21 Conti Temic microelectronic GmbH Radarsystem mit anordnungen und verfahren zur entkopplung von sende- und empfangssignalen sowie unterdrückung von störeinstrahlungen
US8385461B1 (en) 2009-04-20 2013-02-26 Vubiq, Inc. On-off keying using vector modulation
KR100944550B1 (ko) * 2009-06-08 2010-03-03 케빛테크놀로지(주) 모션 감지 모듈
IN2012DN02174A (de) 2009-08-19 2015-08-21 Vubiq Inc
US9893406B2 (en) 2009-08-19 2018-02-13 Vubiq Networks, Inc. Method of forming a waveguide interface by providing a mold to form a support block of the interface
US8407890B2 (en) * 2010-01-25 2013-04-02 Freescale Semiconductor Inc. Method of manufacting an electronic device module with integrated antenna structure
DE102010032458A1 (de) * 2010-06-11 2011-12-15 Rheinmetall Waffe Munition Gmbh Aktive Täuschkörper gegen Radarquellen sowie Verfahren zum Schutz von Objekten mit Hilfe derartiger Täuschkörper
US8786496B2 (en) 2010-07-28 2014-07-22 Toyota Motor Engineering & Manufacturing North America, Inc. Three-dimensional array antenna on a substrate with enhanced backlobe suppression for mm-wave automotive applications
JP5555087B2 (ja) * 2010-07-30 2014-07-23 株式会社豊田中央研究所 レーダ装置
JP5172925B2 (ja) 2010-09-24 2013-03-27 株式会社東芝 無線装置
KR101582395B1 (ko) 2011-03-24 2016-01-11 키사, 아이엔씨. 전자기 통신의 집적회로
DE102011075552A1 (de) * 2011-05-10 2012-11-15 Robert Bosch Gmbh Schaltungsanordnung für Radaranwendungen
US8811526B2 (en) 2011-05-31 2014-08-19 Keyssa, Inc. Delta modulated low power EHF communication link
TWI569031B (zh) 2011-06-15 2017-02-01 奇沙公司 使用ｅｈｆ信號的近端感測與距離量測
JP5417389B2 (ja) 2011-07-13 2014-02-12 株式会社東芝 無線装置
JP5414749B2 (ja) 2011-07-13 2014-02-12 株式会社東芝 無線装置
TWI562555B (en) 2011-10-21 2016-12-11 Keyssa Inc Contactless signal splicing
JP6435194B2 (ja) 2011-12-14 2018-12-05 ケッサ・インコーポレーテッド 触覚フィードバックを提供するコネクタ
DE102011122346A1 (de) * 2011-12-23 2013-06-27 Valeo Schalter Und Sensoren Gmbh Radareinrichtung für ein Kraftfahrzeug, Halter für ein Radargerät und Verfahren zum Herstellen eines Absorptionselements für ein Radargerät
US8866667B2 (en) 2012-02-22 2014-10-21 Honeywell International Inc. High sensitivity single antenna FMCW radar
WO2013131095A2 (en) 2012-03-02 2013-09-06 Waveconnex, Inc. Systems and methods for duplex communication
WO2013134444A1 (en) 2012-03-06 2013-09-12 Waveconnex, Inc. System for constraining an operating parameter of an ehf communication chip
US10305196B2 (en) 2012-04-17 2019-05-28 Keyssa, Inc. Dielectric lens structures for EHF radiation
CN102721959B (zh) * 2012-07-03 2015-03-18 中国科学院上海微系统与信息技术研究所 毫米波单片集成探测器组件
EP2883271B1 (de) 2012-08-10 2020-07-22 Keyssa, Inc. Dielektrische kopplungssysteme für ehf-kommunikation
US9374154B2 (en) 2012-09-14 2016-06-21 Keyssa, Inc. Wireless connections with virtual hysteresis
JP6058144B2 (ja) * 2012-09-26 2017-01-11 オムニラーダー ベスローテン・ヴェンノーツハップＯｍｎｉｒａｄａｒ Ｂｖ 高周波モジュール
JP6121680B2 (ja) 2012-10-05 2017-04-26 日立オートモティブシステムズ株式会社 レーダモジュールおよびそれを用いた速度計測装置
US8854257B2 (en) * 2012-10-22 2014-10-07 The United States Of America As Represented By The Secretary Of The Army Conformal array, luneburg lens antenna system
JP6121705B2 (ja) 2012-12-12 2017-04-26 株式会社東芝 無線装置
WO2014100058A1 (en) 2012-12-17 2014-06-26 Waveconnex, Inc. Modular electronics
KR101417499B1 (ko) 2012-12-21 2014-07-08 주식회사 포스코 캠버량 측정 장치 및 방법
JP5941854B2 (ja) * 2013-02-13 2016-06-29 日立オートモティブシステムズ株式会社 ミリ波誘電体レンズアンテナおよびそれを用いた速度センサ
EP2974057B1 (de) 2013-03-15 2017-10-04 Keyssa, Inc. Chip für kommunikation mit extrem hoher frequenz
EP2974504B1 (de) 2013-03-15 2018-06-20 Keyssa, Inc. Sichere ehf-kommunikationsvorrichtung
NL1040185C2 (en) * 2013-04-26 2014-10-29 Omniradar B V Horn-like extension for integrated antenna.
CN103928481B (zh) * 2014-03-26 2018-04-13 清华大学 一种图像传感器封装结构及封装方法
US9660605B2 (en) 2014-06-12 2017-05-23 Honeywell International Inc. Variable delay line using variable capacitors in a maximally flat time delay filter
DE102014211446A1 (de) * 2014-06-16 2015-12-17 Robert Bosch Gmbh Haltevorrichtung für Nahbereichsradarsensoren
US10018716B2 (en) 2014-06-26 2018-07-10 Honeywell International Inc. Systems and methods for calibration and optimization of frequency modulated continuous wave radar altimeters using adjustable self-interference cancellation
JP6455018B2 (ja) * 2014-08-21 2019-01-23 Toto株式会社 吐水装置
JP6440123B2 (ja) * 2015-05-19 2018-12-19 パナソニックＩｐマネジメント株式会社 アンテナ装置、無線通信装置、及びレーダ装置
EP3107151B1 (de) * 2015-06-17 2022-04-27 Volvo Car Corporation Reflexionsarmer radarhalter
DE102015222884A1 (de) 2015-11-19 2017-05-24 Conti Temic Microelectronic Gmbh Radarsystem mit verschachtelt seriellem Senden und parallelem Empfangen
DE102016114482B4 (de) 2016-08-04 2023-06-29 Silicon Radar GmbH Sensor mit Antenne und Gehäuse
JP7104024B2 (ja) * 2016-08-15 2022-07-20 アリゾナ ボード オブ リージェンツ オン ビハーフ オブ ザ ユニバーシティー オブ アリゾナ ３ｄプリント・ルーネブルグ・レンズを使用する新規な自動車用レーダ
JP6723133B2 (ja) * 2016-10-04 2020-07-15 日立オートモティブシステムズ株式会社 アンテナ、センサ及び車載システム
WO2018072826A1 (de) * 2016-10-20 2018-04-26 G. Lufft Mess- Und Regeltechnik Gmbh Vorrichtung und verfahren zur niederschlagsmessung
DE102016120665B3 (de) 2016-10-28 2018-04-05 Silicon Radar GmbH Radarsensoreinheit zum Einsatz in rauen Umgebungen
US10756441B2 (en) * 2017-02-21 2020-08-25 Taoglas Group Holdings Limited Radar lens antenna arrays and methods
DE102017203823A1 (de) 2017-03-08 2018-09-13 Vega Grieshaber Kg Hochfrequenz-Radarmodul für ein Füllstandradar
CN107144822A (zh) * 2017-06-29 2017-09-08 成都瑞达物联科技有限公司 毫米波雷达一体化射频前端
DE102017114686A1 (de) * 2017-06-30 2019-01-03 Endress+Hauser SE+Co. KG Elektronisches Bauteil zum Aussenden und Empfangen von Radar-Signalen
US11169250B2 (en) 2017-10-27 2021-11-09 Mediatek Inc. Radar module incorporated with a pattern-shaping device
US10818997B2 (en) 2017-12-29 2020-10-27 Vubiq Networks, Inc. Waveguide interface and printed circuit board launch transducer assembly and methods of use thereof
DE102018205670A1 (de) 2018-04-13 2019-10-17 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Hermetisch abgedichtete Moduleinheit mit integrierten Antennen
US10928501B2 (en) 2018-08-28 2021-02-23 Infineon Technologies Ag Target detection in rainfall and snowfall conditions using mmWave radar
DE102018121416A1 (de) * 2018-09-03 2020-03-05 Infineon Technologies Ag Radar-transmitter mit regelung der ausgangsphase
EP3667813B1 (de) * 2018-12-10 2023-11-29 indie Semiconductor FFO GmbH Radarsensor mit integrierter antenne und fokussierender linse
EP3712640A1 (de) * 2019-03-19 2020-09-23 Silicon Radar GmbH Radarsensor in transparentem gehäuse
DE102019204680A1 (de) * 2019-04-02 2020-10-08 Vega Grieshaber Kg Radarmodul mit Mikrowellen-Chip
EP3964864A1 (de) * 2020-09-07 2022-03-09 Infineon Technologies AG Elektronische vorrichtung und verfahren für elektronische vorrichtung
LU102493B1 (de) 2021-01-18 2022-07-18 Mecorad Gmbh Messvorrichtung und Verfahren zur Messung elektromagnetischer Wellen
WO2022185901A1 (ja) * 2021-03-05 2022-09-09 株式会社村田製作所 アンテナモジュール
CN116998065A (zh) * 2021-03-05 2023-11-03 株式会社村田制作所 天线模块
WO2023153374A1 (ja) * 2022-02-09 2023-08-17 京セラ株式会社 通信装置

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4127892A1 (de) 1991-08-22 1993-02-25 Telefunken Systemtechnik Dopplersensor fuer den mikrowellenbereich
JPH08292270A (ja) * 1995-04-24 1996-11-05 Kawasaki Chishitsu Kk 耐熱耐圧性坑井内レーダ
EP0778953B1 (de) 1995-07-01 2002-10-23 Robert Bosch GmbH Monostatischer fmcw-radarsensor
DE69729344T8 (de) * 1996-04-03 2005-02-17 Honda Giken Kogyo K.K. Radarmodul und MMIC-Anordnung dafür
US5864061A (en) 1997-02-05 1999-01-26 Dilz, Jr.; Albert E. Miniature sports radar speed measuring device
DE19710811B4 (de) * 1997-03-15 2006-06-01 Robert Bosch Gmbh Vorrichtung zum gerichteten Abstrahlen und/oder Aufnehmen elektromagnetischer Wellen
JPH10321762A (ja) * 1997-05-15 1998-12-04 Matsushita Electric Ind Co Ltd 半導体装置
JP3786497B2 (ja) 1997-06-13 2006-06-14 富士通株式会社 アンテナ素子を内蔵する半導体モジュール
JPH1134553A (ja) * 1997-07-18 1999-02-09 Rohm Co Ltd Ｉｃモジュール、およびその製造方法、ならびにこれを備えたｉｃカード
JPH11134464A (ja) * 1997-10-31 1999-05-21 Rohm Co Ltd Ｉｃモジュールの製造方法、およびこの製造方法により製造されたｉｃモジュールを備えたｉｃカード
JP3419675B2 (ja) * 1998-02-10 2003-06-23 三菱電機株式会社 車載用電波レーダ装置
JPH11266172A (ja) * 1998-03-17 1999-09-28 Nec Eng Ltd 送受信機フロントエンド
JP3758397B2 (ja) 1999-01-12 2006-03-22 株式会社日立製作所 高周波送受信装置および車載レーダシステム
JP2000059140A (ja) * 1998-08-07 2000-02-25 Hitachi Ltd 高周波送受信装置
JP2000174543A (ja) * 1998-12-01 2000-06-23 Nippon Signal Co Ltd:The アンテナ装置及び自動列車制御装置
JP2000201009A (ja) * 1999-01-05 2000-07-18 Seiko Epson Corp 高周波素子
SE514076C2 (sv) 1999-04-23 2000-12-18 Ericsson Telefon Ab L M Förfarande och anordning relaterade till mikrovågslins
JP2001077128A (ja) * 1999-09-07 2001-03-23 Hitachi Ltd 高周波モジュール
JP3608987B2 (ja) * 1999-09-30 2005-01-12 富士通テン株式会社 ミリ波ユニットの構造
JP4021600B2 (ja) * 2000-05-11 2007-12-12 日本放送協会 アクティブアンテナ
JP3709770B2 (ja) * 2000-07-27 2005-10-26 株式会社村田製作所 半導体スイッチ回路および半導体装置
US6501417B1 (en) * 2001-11-13 2002-12-31 Mph Industries, Inc. Transceiver assembly used in a Doppler-based traffic radar system
JP4523223B2 (ja) * 2002-04-26 2010-08-11 株式会社日立製作所 レーダセンサ

Also Published As

Publication number Publication date
EP1357395B1 (de) 2007-07-25
US6833806B2 (en) 2004-12-21
DE60221353T2 (de) 2008-04-17
US20040160357A1 (en) 2004-08-19
JP4523223B2 (ja) 2010-08-11
JP2003315438A (ja) 2003-11-06
EP1357395A1 (de) 2003-10-29
US6717544B2 (en) 2004-04-06
US20050093738A1 (en) 2005-05-05
US20030201930A1 (en) 2003-10-30
US7154432B2 (en) 2006-12-26

Similar Documents

Publication Publication Date Title
DE60221353D1 (de) Radarsensor
DE60327418D1 (de) Lagesensor
DE60222471D1 (de) Radareinrichtung
DE602004016424D1 (de) Umweltsensor
DE10362125B8 (de) Drehmomentsensor
DE50313358D1 (de) Drehmomentsensor
FI20020394A0 (fi) Valotutka
DE50214737D1 (de) Sensor-anordnung
DE60336282D1 (de) Kapazitiver Positionssensor
DE602004002713D1 (de) Radarvorrichtung
DE60303693D1 (de) Radarsystem
DE60310477D1 (de) Radarsystem
DE60317962D1 (de) Radarsystem
DE60308797D1 (de) Drehmomentsensor
DE60332694D1 (de) Näherungssensor
DE60309262D1 (de) Drehmomentsensor
DE60306998D1 (de) Drehmomentsensor
NO20031114D0 (no) Signallys
DE60326800D1 (de) Radarsystem
DE50309063D1 (de) Kraftsensor
DE50304535D1 (de) Mikrowellen-Sensor
DE50205967D1 (de) Sensoranordnung
DE502005001932D1 (de) Radarsensor
ATA16882004A (de) Sensor
BR0311793B1 (pt) Projétil de neblina

Legal Events

Date Code Title Description
8364 No opposition during term of opposition