DE60210166D1 - Klebstofffilm zum Schneiden - Google Patents

Klebstofffilm zum Schneiden

Info

Publication number
DE60210166D1
DE60210166D1 DE60210166T DE60210166T DE60210166D1 DE 60210166 D1 DE60210166 D1 DE 60210166D1 DE 60210166 T DE60210166 T DE 60210166T DE 60210166 T DE60210166 T DE 60210166T DE 60210166 D1 DE60210166 D1 DE 60210166D1
Authority
DE
Germany
Prior art keywords
base film
during dicing
dicing
fibrous
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60210166T
Other languages
English (en)
Other versions
DE60210166T2 (de
Inventor
Shouji Yamamoto
Kenjiro Takayanagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2001194021A external-priority patent/JP3443110B2/ja
Priority claimed from JP2002051693A external-priority patent/JP3984076B2/ja
Priority claimed from JP2002051682A external-priority patent/JP3984075B2/ja
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of DE60210166D1 publication Critical patent/DE60210166D1/de
Application granted granted Critical
Publication of DE60210166T2 publication Critical patent/DE60210166T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/16—Elastomeric ethene-propene or ethene-propene-diene copolymers, e.g. EPR and EPDM rubbers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/241—Polyolefin, e.g.rubber
    • C09J7/243—Ethylene or propylene polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/06—Polyethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2809—Web or sheet containing structurally defined element or component and having an adhesive outermost layer including irradiated or wave energy treated component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2848—Three or more layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
DE2002610166 2001-06-27 2002-06-18 Klebstoff-Film zum Schneiden Expired - Lifetime DE60210166T2 (de)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2001194021A JP3443110B2 (ja) 2001-06-27 2001-06-27 ダイシング用粘着シート
JP2001194021 2001-06-27
JP2002051682 2002-02-27
JP2002051693A JP3984076B2 (ja) 2002-02-27 2002-02-27 ダイシング用粘着シート
JP2002051693 2002-02-27
JP2002051682A JP3984075B2 (ja) 2002-02-27 2002-02-27 ダイシング用粘着シート

Publications (2)

Publication Number Publication Date
DE60210166D1 true DE60210166D1 (de) 2006-05-18
DE60210166T2 DE60210166T2 (de) 2007-03-15

Family

ID=27347026

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2002610166 Expired - Lifetime DE60210166T2 (de) 2001-06-27 2002-06-18 Klebstoff-Film zum Schneiden

Country Status (8)

Country Link
US (1) US7141300B2 (de)
EP (1) EP1270696B1 (de)
KR (1) KR100871037B1 (de)
CN (2) CN1304509C (de)
AT (1) ATE321825T1 (de)
DE (1) DE60210166T2 (de)
SG (1) SG107599A1 (de)
TW (1) TWI232235B (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3838637B2 (ja) * 2002-06-10 2006-10-25 日東電工株式会社 ガラス基板ダイシング用粘着シートおよびガラス基板ダイシング方法
WO2004046214A2 (en) 2002-10-15 2004-06-03 Exxonmobil Chemical Patents Inc. Multiple catalyst system for olefin polymerization and polymers produced therefrom
US7700707B2 (en) 2002-10-15 2010-04-20 Exxonmobil Chemical Patents Inc. Polyolefin adhesive compositions and articles made therefrom
JP4554908B2 (ja) * 2003-10-24 2010-09-29 日東電工株式会社 ダイシング用粘着シート、ダイシング方法および半導体素子の製造方法
JP4565609B2 (ja) * 2003-10-31 2010-10-20 ニットウ ヨーロッパ エヌ． ブイ． 粘着テープ
JP4412463B2 (ja) * 2003-12-11 2010-02-10 藤森工業株式会社 複室容器
JP4699075B2 (ja) * 2005-04-20 2011-06-08 日東電工株式会社 防水気密用両面粘着テープ
JP4699076B2 (ja) * 2005-04-20 2011-06-08 日東電工株式会社 防水気密用粘着テープ
JP4925173B2 (ja) * 2006-06-02 2012-04-25 日東電工株式会社 ダイシング用粘着シート、及びそれを用いた被切断体の加工方法
JP5027460B2 (ja) 2006-07-28 2012-09-19 東京応化工業株式会社 ウエハの接着方法、薄板化方法、及び剥離方法
US8207270B2 (en) 2006-09-29 2012-06-26 Exxonmobil Chemical Patents Inc. Thermoplastic elastomer compositions, methods of making and articles made from the same
JP4767144B2 (ja) * 2006-10-04 2011-09-07 日東電工株式会社 レーザ加工用粘着シート
JP5863157B2 (ja) * 2006-12-18 2016-02-16 日東電工株式会社 粘着シート
KR101019063B1 (ko) * 2007-05-25 2011-03-07 주식회사 엘지화학 아크릴 점착제 조성물 및 이를 이용한 다이싱 테이프
JP5246583B2 (ja) * 2008-02-29 2013-07-24 旭硝子株式会社 ガラス基板吸着テーブル、及びガラス基板加工方法
KR101494244B1 (ko) * 2010-03-31 2015-02-17 린텍 가부시키가이샤 다이싱 시트용 기재 필름 및 다이싱 시트
KR101393878B1 (ko) 2010-09-30 2014-05-12 미쓰이 가가쿠 토세로 가부시키가이샤 확장성 필름, 다이싱 필름, 및 반도체 장치의 제조 방법
TW201250783A (en) * 2011-03-24 2012-12-16 Sumitomo Bakelite Co Adhesive tape for processing semiconductor wafer or the like
CN103121794B (zh) * 2013-02-27 2017-06-13 京东方科技集团股份有限公司 单层阵列玻璃基板的切割方法及切割系统
US9442263B1 (en) * 2014-08-08 2016-09-13 Superior Essex International LP Cable components formed with a thermoplastic elastomer as a nucleating agent
WO2017098736A1 (ja) * 2015-12-08 2017-06-15 リンテック株式会社 ダイシングシートおよびダイシングシートの製造方法
CN110872474A (zh) * 2018-08-31 2020-03-10 翊圣企业股份有限公司 切割片胶膜用基膜及其制作方法
JP2023516571A (ja) * 2020-03-06 2023-04-20 トレデガー サーフェイス プロテクション エルエルシー 半導体ウェーハ処理用キャリア・フィルム

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JP2545170B2 (ja) 1991-12-05 1996-10-16 リンテック株式会社 ウェハ貼着用粘着シ―トおよびウェハダイシング方法
JPH05211234A (ja) 1991-12-05 1993-08-20 Lintec Corp ウェハ貼着用粘着シートおよびウェハダイシング方法
JPH05335411A (ja) 1992-06-02 1993-12-17 Toshiba Corp ペレットの製造方法
US5458845A (en) * 1992-12-02 1995-10-17 Chisso Corporation Process for producing molding product
JPH07156355A (ja) 1993-12-06 1995-06-20 Sekisui Chem Co Ltd 表面保護シート
JP3521099B2 (ja) * 1994-11-29 2004-04-19 リンテック株式会社 ダイシング用リングフレームへの接着剤の付着防止用粘着シートおよび該粘着シートを備えたウェハ加工用シート
EP0863183B2 (de) * 1995-11-24 2008-05-28 Chisso Corporation Propylenzusammensetzung, verfahren zu deren herstellung, polypropylenzusammensetzung und geformte gegenstände
JPH1077375A (ja) 1996-09-03 1998-03-24 Heisei Polymer Co Ltd 軟質樹脂組成物およびそれを用いた軟質フィルム、積層体
JPH1099426A (ja) * 1996-09-27 1998-04-21 Minoru Terano 生体適合性材料、その製造方法、及び医療用器具
BR9813247A (pt) 1998-01-09 2000-10-03 Minnesota Mining & Mfg Substrato de pelìcula adequado para uso com um adesivo como uma fita protetora isolante , e, fita adesiva adequada para uso como uma fita protetora isolante
JP4510954B2 (ja) * 1998-08-10 2010-07-28 リンテック株式会社 ダイシングテープ及びダイシング方法
DE69914418T2 (de) * 1998-08-10 2004-12-02 Lintec Corp. Dicing tape und Verfahren zum Zerteilen einer Halbleiterscheibe
JP4050397B2 (ja) * 1998-08-26 2008-02-20 藤森工業株式会社 加工布
JP2000173951A (ja) 1998-12-02 2000-06-23 Okura Ind Co Ltd ダイシング用基材フィルム
DE19923780A1 (de) 1999-05-22 2000-11-23 Beiersdorf Ag Unverstreckte Oberflächenschutzfolie aus Polypropylenblockcopolymer
JP2001064602A (ja) * 1999-08-26 2001-03-13 Sekisui Chem Co Ltd 粘着テープ用基材フィルム及び粘着テープ
JP3340979B2 (ja) * 1999-09-06 2002-11-05 日東電工株式会社 ダイシング用粘着シート
JP2001288421A (ja) * 2000-04-06 2001-10-16 Sekisui Chem Co Ltd 粘着テープ用基材フィルム及び粘着テープ
JP4780828B2 (ja) 2000-11-22 2011-09-28 三井化学株式会社 ウエハ加工用粘着テープ及びその製造方法並びに使用方法

Also Published As

Publication number Publication date
US7141300B2 (en) 2006-11-28
TWI232235B (en) 2005-05-11
CN1395293A (zh) 2003-02-05
SG107599A1 (en) 2004-12-29
ATE321825T1 (de) 2006-04-15
US20030031862A1 (en) 2003-02-13
CN1225771C (zh) 2005-11-02
CN1683463A (zh) 2005-10-19
EP1270696A2 (de) 2003-01-02
KR20030004077A (ko) 2003-01-14
DE60210166T2 (de) 2007-03-15
EP1270696A3 (de) 2003-06-25
CN1304509C (zh) 2007-03-14
EP1270696B1 (de) 2006-03-29
KR100871037B1 (ko) 2008-11-27

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