DE60200840D1 - Bildaufnahmevorrichtung und Bildaufnahmelinse - Google Patents
Bildaufnahmevorrichtung und BildaufnahmelinseInfo
- Publication number
- DE60200840D1 DE60200840D1 DE60200840T DE60200840T DE60200840D1 DE 60200840 D1 DE60200840 D1 DE 60200840D1 DE 60200840 T DE60200840 T DE 60200840T DE 60200840 T DE60200840 T DE 60200840T DE 60200840 D1 DE60200840 D1 DE 60200840D1
- Authority
- DE
- Germany
- Prior art keywords
- image pickup
- section
- pickup element
- contact
- peripheral surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000002093 peripheral effect Effects 0.000 abstract 4
- 230000003287 optical effect Effects 0.000 abstract 2
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/022—Mountings, adjusting means, or light-tight connections, for optical elements for lenses lens and mount having complementary engagement means, e.g. screw/thread
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
- G02B1/041—Lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
- G02B13/0015—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design
- G02B13/002—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface
- G02B13/0025—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface having one lens only
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
- G02B13/0015—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design
- G02B13/002—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface
- G02B13/003—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface having two lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
- G02B13/0055—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing a special optical element
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/003—Alignment of optical elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/021—Mountings, adjusting means, or light-tight connections, for optical elements for lenses for more than one lens
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/026—Mountings, adjusting means, or light-tight connections, for optical elements for lenses using retaining rings or springs
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B30/00—Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Studio Devices (AREA)
- Lens Barrels (AREA)
- Wire Bonding (AREA)
- Cameras In General (AREA)
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001004706 | 2001-01-12 | ||
JP2001004706 | 2001-01-12 | ||
JP2001033111 | 2001-02-09 | ||
JP2001033111 | 2001-02-09 | ||
JP2001148912 | 2001-05-18 | ||
JP2001148912 | 2001-05-18 | ||
JP2001155083 | 2001-05-24 | ||
JP2001155083 | 2001-05-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60200840D1 true DE60200840D1 (de) | 2004-09-09 |
DE60200840T2 DE60200840T2 (de) | 2005-08-04 |
Family
ID=27481967
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60200840T Expired - Lifetime DE60200840T2 (de) | 2001-01-12 | 2002-01-07 | Bildaufnahmevorrichtung und Bildaufnahmelinse |
DE60227275T Expired - Lifetime DE60227275D1 (de) | 2001-01-12 | 2002-01-07 | Bildaufnahmevorrichtung und Bildaufnahmelinse |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60227275T Expired - Lifetime DE60227275D1 (de) | 2001-01-12 | 2002-01-07 | Bildaufnahmevorrichtung und Bildaufnahmelinse |
Country Status (7)
Country | Link |
---|---|
US (2) | US7528880B2 (de) |
EP (2) | EP1223749B1 (de) |
KR (2) | KR100864557B1 (de) |
CN (1) | CN100473074C (de) |
AT (2) | ATE399437T1 (de) |
DE (2) | DE60200840T2 (de) |
TW (1) | TW523924B (de) |
Families Citing this family (99)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4698874B2 (ja) * | 2001-04-24 | 2011-06-08 | ローム株式会社 | イメージセンサモジュール、およびイメージセンサモジュールの製造方法 |
US7092174B2 (en) * | 2001-05-18 | 2006-08-15 | Konica Corporation | Image pickup lens, image pickup apparatus and method for forming image pickup lens |
TW540157B (en) * | 2001-05-31 | 2003-07-01 | Konishiroku Photo Ind | CMOS image sensor |
JP4061936B2 (ja) * | 2002-03-22 | 2008-03-19 | コニカミノルタホールディングス株式会社 | 撮像装置 |
EP1357606A1 (de) * | 2002-04-22 | 2003-10-29 | Scientek Corporation | Gehäuse für einen Halbleiter-Bildsensor |
US7127793B2 (en) * | 2002-04-24 | 2006-10-31 | Fuji Photo Film Co., Ltd. | Method of producing solid state pickup device |
JP2003318585A (ja) * | 2002-04-24 | 2003-11-07 | Toshiba Corp | 電子機器 |
WO2004003618A1 (ja) * | 2002-07-01 | 2004-01-08 | Rohm Co., Ltd. | イメージセンサモジュール |
EP2273555A3 (de) * | 2002-09-17 | 2012-09-12 | Anteryon B.V. | Kameragerät |
US20040061799A1 (en) | 2002-09-27 | 2004-04-01 | Konica Corporation | Image pickup device and portable terminal equipped therewith |
JP3915683B2 (ja) * | 2002-12-05 | 2007-05-16 | ソニー株式会社 | レンズ鏡筒および撮像装置 |
JP2004194223A (ja) * | 2002-12-13 | 2004-07-08 | Konica Minolta Holdings Inc | 撮像装置及び携帯端末 |
JP4300811B2 (ja) * | 2003-02-03 | 2009-07-22 | コニカミノルタホールディングス株式会社 | 撮像装置及び携帯端末 |
JP2004296453A (ja) * | 2003-02-06 | 2004-10-21 | Sharp Corp | 固体撮像装置、半導体ウエハ、光学装置用モジュール、固体撮像装置の製造方法及び光学装置用モジュールの製造方法 |
JP4204368B2 (ja) | 2003-03-28 | 2009-01-07 | シャープ株式会社 | 光学装置用モジュール及び光学装置用モジュールの製造方法 |
JP4223851B2 (ja) * | 2003-03-31 | 2009-02-12 | ミツミ電機株式会社 | 小型カメラモジュール |
FR2854496B1 (fr) * | 2003-04-29 | 2005-09-16 | St Microelectronics Sa | Boitier semi-conducteur |
US7453516B2 (en) * | 2003-06-04 | 2008-11-18 | Aptina Imaging Corporation | Flexible camera lens barrel |
US7656452B2 (en) * | 2003-07-08 | 2010-02-02 | Konica Minolta Opto, Inc. | Imaging device, portable terminal using the same, and image device producing method |
KR100532287B1 (ko) * | 2003-09-17 | 2005-11-29 | 삼성전자주식회사 | 휴대용 카메라 모듈의 미세 이물질 제거 장치 및 방법 |
JP3921467B2 (ja) * | 2003-12-11 | 2007-05-30 | シャープ株式会社 | カメラモジュール、カメラモジュールの製造方法、電子機器及び電子機器の製造方法 |
KR100617680B1 (ko) * | 2003-12-31 | 2006-08-28 | 삼성전자주식회사 | 카메라 렌즈 모듈의 렌즈 홀더 장치 |
KR100800705B1 (ko) * | 2004-03-26 | 2008-02-01 | 삼성전자주식회사 | 입사파에 의해 발생되는 반사파를 억제하는 카메라 렌즈장치 |
TWM271321U (en) * | 2004-09-10 | 2005-07-21 | Aiptek Int Inc | Flip-chip packaging device |
US7486240B2 (en) * | 2004-10-12 | 2009-02-03 | Qualcomm Incorporated | Devices and methods for retaining an antenna |
US7133222B2 (en) * | 2004-10-12 | 2006-11-07 | Qualcomm, Inc. | Devices and methods for retaining a lens in a mobile electronic device |
JP2006148710A (ja) * | 2004-11-22 | 2006-06-08 | Sharp Corp | 撮像モジュール及び撮像モジュールの製造方法 |
JP2006195331A (ja) * | 2005-01-17 | 2006-07-27 | Matsushita Electric Ind Co Ltd | 撮影レンズ |
CN100520472C (zh) * | 2005-01-25 | 2009-07-29 | 柯尼卡美能达精密光学株式会社 | 摄像装置以及具有该摄像装置的便携式终端 |
JP2006276463A (ja) * | 2005-03-29 | 2006-10-12 | Sharp Corp | 光学装置用モジュール及び光学装置用モジュールの製造方法 |
KR100691157B1 (ko) | 2005-04-07 | 2007-03-09 | 삼성전기주식회사 | 포커싱 무조정형 카메라 모듈 |
US8085318B2 (en) * | 2005-10-11 | 2011-12-27 | Apple Inc. | Real-time image capture and manipulation based on streaming data |
CN100470349C (zh) * | 2005-06-28 | 2009-03-18 | 华硕电脑股份有限公司 | 影像撷取模组 |
JP4382030B2 (ja) * | 2005-11-15 | 2009-12-09 | 富士通マイクロエレクトロニクス株式会社 | 半導体装置及びその製造方法 |
US7554599B2 (en) * | 2006-03-02 | 2009-06-30 | Kingpak Technology, Inc. | Image sensor module with air escape hole and a method for manufacturing the same |
KR101200573B1 (ko) * | 2006-06-28 | 2012-11-13 | 삼성전자주식회사 | 촬상 소자 장착 구조 및 촬상 소자 장착 방법 |
JP4189769B2 (ja) * | 2006-10-18 | 2008-12-03 | 進展産業株式会社 | 撮像装置 |
JP5060767B2 (ja) * | 2006-11-06 | 2012-10-31 | 富士フイルム株式会社 | レンズ装置 |
JP4923967B2 (ja) * | 2006-11-14 | 2012-04-25 | 凸版印刷株式会社 | 固体撮像装置及び電子機器 |
JP4339883B2 (ja) * | 2006-11-17 | 2009-10-07 | オリンパスメディカルシステムズ株式会社 | 撮像モジュール及び撮像モジュール用結像レンズ、並びに、撮像モジュールを用いた内視鏡 |
EP1944640A1 (de) | 2007-01-11 | 2008-07-16 | STMicroelectronics (Research & Development) Limited | Linsenanordnung |
JP2008175991A (ja) | 2007-01-17 | 2008-07-31 | Fujinon Corp | 光学素子および光学ユニット |
US8456560B2 (en) * | 2007-01-26 | 2013-06-04 | Digitaloptics Corporation | Wafer level camera module and method of manufacture |
KR100843300B1 (ko) * | 2007-04-12 | 2008-07-03 | 삼성전기주식회사 | 카메라 모듈 및 그 제조방법 |
CN101730863B (zh) * | 2007-04-24 | 2011-12-28 | 弗莱克斯电子有限责任公司 | 相机模块及其制造方法 |
JP5047679B2 (ja) * | 2007-04-26 | 2012-10-10 | オリンパスメディカルシステムズ株式会社 | 撮像ユニットおよび、この撮像ユニットの製造方法 |
CN101339282A (zh) | 2007-07-06 | 2009-01-07 | 鸿富锦精密工业(深圳)有限公司 | 相机模组 |
US7825985B2 (en) * | 2007-07-19 | 2010-11-02 | Flextronics Ap, Llc | Camera module back-focal length adjustment method and ultra compact components packaging |
JP2009069588A (ja) * | 2007-09-14 | 2009-04-02 | Konica Minolta Opto Inc | 光学ユニットおよび撮像装置 |
US20090206431A1 (en) * | 2008-02-20 | 2009-08-20 | Micron Technology, Inc. | Imager wafer level module and method of fabrication and use |
US9118825B2 (en) * | 2008-02-22 | 2015-08-25 | Nan Chang O-Film Optoelectronics Technology Ltd. | Attachment of wafer level optics |
EP2094000A3 (de) | 2008-02-22 | 2013-06-05 | Silicon Micro Sensors GmbH | Bilderfassungsvorrichtung einer Kamera |
JP5295875B2 (ja) * | 2008-11-06 | 2013-09-18 | シャープ株式会社 | カメラモジュールおよびそれを備えた電子機器、並びにカメラモジュールのレンズ位置決め方法 |
US8184195B2 (en) * | 2009-04-01 | 2012-05-22 | Aptina Imaging Corporation | Lens shielding structures for digital image sensors |
TW201104747A (en) * | 2009-07-29 | 2011-02-01 | Kingpak Tech Inc | Image sensor package structure |
US9419032B2 (en) * | 2009-08-14 | 2016-08-16 | Nanchang O-Film Optoelectronics Technology Ltd | Wafer level camera module with molded housing and method of manufacturing |
CN102025899B (zh) * | 2009-09-11 | 2013-11-06 | 鸿富锦精密工业(深圳)有限公司 | 相机模组及其组装方法 |
JP5299188B2 (ja) * | 2009-09-16 | 2013-09-25 | 富士通株式会社 | 撮像装置、それを備えた電子装置、及び撮像装置の製造方法 |
KR101051533B1 (ko) * | 2009-09-28 | 2011-07-22 | 삼성전기주식회사 | 카메라 모듈 |
CN102036004B (zh) * | 2009-09-30 | 2013-07-03 | 鸿富锦精密工业(深圳)有限公司 | 成像模组 |
US8576333B2 (en) * | 2009-10-30 | 2013-11-05 | Vivotek Inc. | Photographic device having light-blocking film |
DE202009014837U1 (de) | 2009-11-03 | 2010-02-18 | Basler Ag | Haltevorrichtung für ein optisches Filterelement einer Kamera |
JP5521649B2 (ja) | 2010-03-05 | 2014-06-18 | 株式会社リコー | 撮像装置及び車載カメラ |
TWI426311B (zh) * | 2010-04-13 | 2014-02-11 | Himax Tech Ltd | 晶圓級鏡頭模組、製造晶圓級鏡頭模組的方法與晶圓級攝影機 |
FR2965103B1 (fr) * | 2010-09-17 | 2013-06-28 | Commissariat Energie Atomique | Systeme optique d'imagerie a ftm amelioree |
US10009528B2 (en) | 2011-02-24 | 2018-06-26 | Nan Chang O-Film Optoelectronics Technology Ltd | Autofocus camera module packaging with circuitry-integrated actuator system |
US8545114B2 (en) | 2011-03-11 | 2013-10-01 | Digitaloptics Corporation | Auto focus-zoom actuator or camera module contamination reduction feature with integrated protective membrane |
JP5821242B2 (ja) * | 2011-03-31 | 2015-11-24 | ソニー株式会社 | 固体撮像装置及びその製造方法、並びに電子機器 |
WO2013015929A1 (en) * | 2011-07-22 | 2013-01-31 | Alex Ning | Lens mount |
TW201307980A (zh) * | 2011-08-10 | 2013-02-16 | Hon Hai Prec Ind Co Ltd | 相機模組 |
TW201307982A (zh) * | 2011-08-11 | 2013-02-16 | Hon Hai Prec Ind Co Ltd | 相機模組 |
TW201310075A (zh) * | 2011-08-18 | 2013-03-01 | Hon Hai Prec Ind Co Ltd | 鏡片及具有該鏡片的相機模組 |
WO2013088903A1 (ja) * | 2011-12-14 | 2013-06-20 | パナソニック株式会社 | 赤外線センサ |
JP5984378B2 (ja) * | 2011-12-22 | 2016-09-06 | キヤノン株式会社 | 撮像装置 |
KR20130083249A (ko) * | 2012-01-12 | 2013-07-22 | 삼성전자주식회사 | 반도체 장치 및 이를 이용한 이미지 센서 패키지 |
CN103293626A (zh) * | 2012-02-27 | 2013-09-11 | 鸿富锦精密工业(深圳)有限公司 | 镜头模组及其组装方法 |
US20130258474A1 (en) * | 2012-04-03 | 2013-10-03 | Cheng-Ta Chen | Optoelectronic device with improved lens cap |
US20130270426A1 (en) * | 2012-04-13 | 2013-10-17 | Global Microptics Company | Lens module |
EP2653917B1 (de) * | 2012-04-17 | 2017-02-08 | Basler AG | Objektivadapter für Kameras |
JP5962235B2 (ja) * | 2012-06-07 | 2016-08-03 | オムロン株式会社 | 物体の固定構造およびこの構造を用いた光学装置 |
US9307128B2 (en) | 2012-06-26 | 2016-04-05 | Alex Ning | Lens mount |
TWI534494B (zh) * | 2012-07-12 | 2016-05-21 | 鴻海精密工業股份有限公司 | 鏡頭模組組裝平臺、組裝裝置及組裝方法 |
CN103543534B (zh) * | 2012-07-17 | 2017-09-26 | 鸿富锦精密工业(深圳)有限公司 | 镜头模块组装平台、组装装置及组装方法 |
JP5998962B2 (ja) * | 2013-01-31 | 2016-09-28 | 三菱電機株式会社 | 半導体光装置 |
US20140132815A1 (en) * | 2014-01-27 | 2014-05-15 | Meizhou XiuYing Enterprise Company Limited | Digital camera structure capable of selectively mounting a camera lens |
KR20150116019A (ko) * | 2014-04-03 | 2015-10-15 | 삼성디스플레이 주식회사 | 광원 패키지 및 이를 포함하는 액정 표시 장치 |
WO2016084380A1 (ja) | 2014-11-26 | 2016-06-02 | パナソニックIpマネジメント株式会社 | 撮像装置 |
CN107525805A (zh) * | 2016-06-20 | 2017-12-29 | 亿观生物科技股份有限公司 | 样本检测装置及样本检测系统 |
TWI600928B (zh) * | 2016-09-30 | 2017-10-01 | 光寶電子(廣州)有限公司 | 濾光片總成及具有該濾光片總成的相機模組 |
US10306114B2 (en) * | 2017-02-10 | 2019-05-28 | Google Llc | Camera module mounting in an electronic device |
US20180315894A1 (en) * | 2017-04-26 | 2018-11-01 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package and a method of manufacturing the same |
CN111602245A (zh) * | 2017-11-07 | 2020-08-28 | ams传感器新加坡私人有限公司 | 具有锁定组件的光电模块及其制造方法 |
JP7129654B2 (ja) * | 2018-04-04 | 2022-09-02 | パナソニックIpマネジメント株式会社 | 赤外線検出装置 |
CN109348104B (zh) * | 2018-10-30 | 2021-01-08 | 维沃移动通信(杭州)有限公司 | 摄像头模组、电子设备及拍摄方法 |
WO2021009634A1 (en) * | 2019-07-16 | 2021-01-21 | Ricoh Company, Ltd. | Capturing unit and method of manufacturing capturing unit |
TWI702433B (zh) | 2019-07-25 | 2020-08-21 | 大立光電股份有限公司 | 成像鏡頭模組、相機模組及電子裝置 |
FR3103056B1 (fr) * | 2019-11-08 | 2022-07-08 | St Microelectronics Grenoble 2 | Dispositif électronique comprenant un substrat de support et un capot d’encapsulation monté sur le substrat de support, et procédé de montage correspondant |
TWI714518B (zh) | 2020-08-12 | 2020-12-21 | 大立光電股份有限公司 | 成像鏡頭、取像裝置及電子裝置 |
CN114501253B (zh) * | 2022-01-25 | 2023-10-03 | 青岛歌尔智能传感器有限公司 | 振动传感器及电子设备 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3140378A1 (de) * | 1981-10-10 | 1983-04-28 | Fa. Carl Zeiss, 7920 Heidenheim | Photographisches objektiv mit stetig veraenderbarer brennweite |
JPS59177506A (ja) * | 1983-03-28 | 1984-10-08 | Olympus Optical Co Ltd | レンズ保持装置 |
JPS61134187A (ja) * | 1984-12-04 | 1986-06-21 | Toshiba Corp | 固体撮像デバイス |
JPS63308375A (ja) * | 1987-06-10 | 1988-12-15 | Hitachi Ltd | 固体撮像装置 |
US5274456A (en) * | 1987-12-28 | 1993-12-28 | Hitachi, Ltd. | Semiconductor device and video camera unit using it and their manufacturing method |
US5400072A (en) * | 1988-12-23 | 1995-03-21 | Hitachi, Ltd. | Video camera unit having an airtight mounting arrangement for an image sensor chip |
US5040069A (en) * | 1989-06-16 | 1991-08-13 | Fuji Photo Optical Co., Ltd. | Electronic endoscope with a mask bump bonded to an image pick-up device |
US5302778A (en) * | 1992-08-28 | 1994-04-12 | Eastman Kodak Company | Semiconductor insulation for optical devices |
JP3498775B2 (ja) * | 1995-05-31 | 2004-02-16 | ソニー株式会社 | 撮像装置 |
EP1357741A1 (de) * | 1995-05-31 | 2003-10-29 | Sony Corporation | Bildaufnahmevorrichtung |
JPH09181287A (ja) * | 1995-10-24 | 1997-07-11 | Sony Corp | 受光装置とその製造方法 |
JP3380949B2 (ja) * | 1995-10-25 | 2003-02-24 | ソニー株式会社 | 半導体光学装置 |
JP3547869B2 (ja) * | 1995-11-07 | 2004-07-28 | コニカミノルタホールディングス株式会社 | 撮像装置 |
JPH09312809A (ja) * | 1996-05-24 | 1997-12-02 | Sony Corp | Ccdチップ及び該ccdチップの形成方法 |
JPH09312808A (ja) * | 1996-05-24 | 1997-12-02 | Sony Corp | Ccdカメラ及びそのccdチップとレンズの位置合わせ方法 |
JPH10321827A (ja) * | 1997-05-16 | 1998-12-04 | Sony Corp | 撮像装置及びカメラ |
KR100312495B1 (ko) * | 1998-07-04 | 2002-02-19 | 구자홍 | 초박형회절광학렌즈 |
EP1122945A4 (de) * | 1999-08-19 | 2004-06-23 | Mitsubishi Electric Corp | Bildaufnahmevorrichtung und kamera |
US7088397B1 (en) * | 2000-11-16 | 2006-08-08 | Avago Technologies General Ip Pte. Ltd | Image sensor packaging with imaging optics |
US6683298B1 (en) * | 2000-11-20 | 2004-01-27 | Agilent Technologies Inc. | Image sensor packaging with package cavity sealed by the imaging optics |
-
2002
- 2002-01-04 TW TW091100081A patent/TW523924B/zh not_active IP Right Cessation
- 2002-01-07 DE DE60200840T patent/DE60200840T2/de not_active Expired - Lifetime
- 2002-01-07 EP EP02250063A patent/EP1223749B1/de not_active Expired - Lifetime
- 2002-01-07 DE DE60227275T patent/DE60227275D1/de not_active Expired - Lifetime
- 2002-01-07 EP EP04010162A patent/EP1443755B1/de not_active Expired - Lifetime
- 2002-01-07 AT AT04010162T patent/ATE399437T1/de not_active IP Right Cessation
- 2002-01-07 AT AT02250063T patent/ATE272922T1/de not_active IP Right Cessation
- 2002-01-09 US US10/040,437 patent/US7528880B2/en not_active Expired - Fee Related
- 2002-01-11 KR KR1020020001622A patent/KR100864557B1/ko not_active IP Right Cessation
- 2002-01-11 CN CNB021018154A patent/CN100473074C/zh not_active Expired - Fee Related
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2007
- 2007-10-29 KR KR1020070108669A patent/KR100824125B1/ko not_active IP Right Cessation
- 2007-12-19 US US12/000,937 patent/US7880796B2/en not_active Expired - Fee Related
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KR100824125B1 (ko) | 2008-04-21 |
CN1365221A (zh) | 2002-08-21 |
KR20070110235A (ko) | 2007-11-16 |
KR20020061108A (ko) | 2002-07-22 |
US7880796B2 (en) | 2011-02-01 |
US7528880B2 (en) | 2009-05-05 |
EP1443755A3 (de) | 2005-11-16 |
CN100473074C (zh) | 2009-03-25 |
EP1443755B1 (de) | 2008-06-25 |
KR100864557B1 (ko) | 2008-10-20 |
EP1223749B1 (de) | 2004-08-04 |
US20020131782A1 (en) | 2002-09-19 |
EP1223749A1 (de) | 2002-07-17 |
ATE272922T1 (de) | 2004-08-15 |
EP1443755A2 (de) | 2004-08-04 |
US20080143864A1 (en) | 2008-06-19 |
ATE399437T1 (de) | 2008-07-15 |
DE60227275D1 (de) | 2008-08-07 |
DE60200840T2 (de) | 2005-08-04 |
TW523924B (en) | 2003-03-11 |
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