DE602007002246D1 - Plasmaanzeigevorrichtung - Google Patents

Plasmaanzeigevorrichtung

Info

Publication number
DE602007002246D1
DE602007002246D1 DE602007002246T DE602007002246T DE602007002246D1 DE 602007002246 D1 DE602007002246 D1 DE 602007002246D1 DE 602007002246 T DE602007002246 T DE 602007002246T DE 602007002246 T DE602007002246 T DE 602007002246T DE 602007002246 D1 DE602007002246 D1 DE 602007002246D1
Authority
DE
Germany
Prior art keywords
plasma display
plasma
display
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602007002246T
Other languages
English (en)
Inventor
Chul-Hong Kim
Jung-Keun Ahn
Hyun-Mi Jeong
Sung-Bae Kim
Bu-Kyeong Mo
Jeong-Rok Cha
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung SDI Co Ltd
Original Assignee
Samsung SDI Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung SDI Co Ltd filed Critical Samsung SDI Co Ltd
Publication of DE602007002246D1 publication Critical patent/DE602007002246D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/20—Constructional details
    • H01J11/48—Sealing, e.g. seals specially adapted for leading-in conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/20—Constructional details
    • H01J11/46—Connecting or feeding means, e.g. leading-in conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
    • H05K7/20963—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermal Sciences (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Gas-Filled Discharge Tubes (AREA)
DE602007002246T 2006-10-31 2007-10-31 Plasmaanzeigevorrichtung Active DE602007002246D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060106682A KR100814819B1 (ko) 2006-10-31 2006-10-31 플라즈마 디스플레이 장치

Publications (1)

Publication Number Publication Date
DE602007002246D1 true DE602007002246D1 (de) 2009-10-15

Family

ID=38984516

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602007002246T Active DE602007002246D1 (de) 2006-10-31 2007-10-31 Plasmaanzeigevorrichtung

Country Status (6)

Country Link
US (1) US8174822B2 (de)
EP (1) EP1919265B1 (de)
JP (2) JP4564039B2 (de)
KR (1) KR100814819B1 (de)
CN (1) CN101174373A (de)
DE (1) DE602007002246D1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080042282A (ko) * 2006-11-09 2008-05-15 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
KR20110055089A (ko) * 2009-11-19 2011-05-25 엘지전자 주식회사 플라즈마 디스플레이 장치 및 멀티 플라즈마 디스플레이 장치
KR20130121102A (ko) 2010-09-30 2013-11-05 다우 글로벌 테크놀로지스 엘엘씨 개선된 습윤 절연저항을 위한 개선된 커넥터 및 전자회로 조립체
WO2012154307A2 (en) 2011-03-22 2012-11-15 Dow Global Technologies Llc Improved photovoltaic sheathing element with a flexible connector assembly
KR102256308B1 (ko) * 2014-04-16 2021-05-27 삼성디스플레이 주식회사 표시장치
CN105572943A (zh) 2016-01-14 2016-05-11 友达光电股份有限公司 显示装置
US9978674B2 (en) 2016-04-05 2018-05-22 Samsung Electronics Co., Ltd. Chip-on-film semiconductor packages and display apparatus including the same
US10120411B2 (en) * 2016-08-22 2018-11-06 Apple Inc. Systems with low-friction matte flexible printed circuits
KR102562373B1 (ko) * 2018-05-31 2023-08-02 삼성디스플레이 주식회사 표시장치 및 이의 제조방법
KR101969507B1 (ko) * 2018-08-07 2019-04-16 엘지전자 주식회사 디스플레이 장치
KR102562291B1 (ko) * 2018-09-10 2023-08-02 삼성디스플레이 주식회사 표시장치 및 그 제조방법
TWI684812B (zh) 2018-11-26 2020-02-11 友達光電股份有限公司 顯示面板

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6141110Y2 (de) 1979-10-05 1986-11-22
JPS60154232A (ja) 1984-01-24 1985-08-13 Seiko Epson Corp 液晶表示装置
JP2847831B2 (ja) * 1989-12-13 1999-01-20 富士通株式会社 フラットディスプレイパルネルの電極端子部接続構造及び電極端子部接続方法
JPH0466041U (de) 1990-10-18 1992-06-10
JP3085484B2 (ja) * 1992-04-10 2000-09-11 東レ株式会社 離型フィルム
JPH08297286A (ja) * 1995-04-26 1996-11-12 Internatl Business Mach Corp <Ibm> 液晶表示装置
JPH0987612A (ja) 1995-09-20 1997-03-31 Nissan Motor Co Ltd １液室温硬化型シーリング剤組成物
JPH09208829A (ja) * 1996-01-31 1997-08-12 Toray Dow Corning Silicone Co Ltd 硬化性オルガノポリシロキサン組成物および該組成物を使用して基材と被着体を接着させる方法
US6738123B1 (en) * 1996-03-15 2004-05-18 Canon Kabushiki Kaisha Drive circuit connection structure including a substrate, circuit board, and semiconductor device, and display apparatus including the connection structure
US6086441A (en) * 1997-04-30 2000-07-11 Matsushita Electric Industrial Co., Ltd. Method for connecting electrodes of plasma display panel
JP3835891B2 (ja) 1997-05-23 2006-10-18 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物
JPH1167445A (ja) * 1997-08-27 1999-03-09 Hokuriku Electric Ind Co Ltd 表示素子
JP3353719B2 (ja) * 1998-09-16 2002-12-03 日本電気株式会社 プラズマディスプレイパネルの電極端子取出し構造
JP2000104047A (ja) * 1998-09-28 2000-04-11 Soft 99 Corporation:Kk 自動車用艶出し撥水剤組成物
JP2001015042A (ja) * 1999-06-29 2001-01-19 Nec Corp カラープラズマディスプレイパネル
JP4533489B2 (ja) 2000-01-28 2010-09-01 大日本印刷株式会社 画像表示媒体およびその製造方法
KR20020080500A (ko) * 2000-03-24 2002-10-23 마츠시타 덴끼 산교 가부시키가이샤 플라즈마 디스플레이 패널 및 그 제조방법
JP4229575B2 (ja) 2000-06-12 2009-02-25 横浜ゴム株式会社 シーリング材組成物およびそれを用いた複層ガラス
TW486721B (en) * 2000-08-30 2002-05-11 Acer Display Tech Inc Plasma display having auxiliary bonding pad
JP2002111154A (ja) * 2000-10-02 2002-04-12 Fujikura Ltd メンブレン回路
JP3983120B2 (ja) * 2001-07-30 2007-09-26 富士通日立プラズマディスプレイ株式会社 Ｉｃチップの実装構造及びディスプレイ装置
WO2003034513A1 (en) 2001-10-18 2003-04-24 Koninklijke Philips Electronics N.V. Electroluminescent device
JP2003195336A (ja) 2001-12-27 2003-07-09 Casio Comput Co Ltd 液晶表示装置及びその製造方法
JP2003295786A (ja) 2002-02-01 2003-10-15 Matsushita Electric Ind Co Ltd プラズマディスプレイ装置の製造方法
JP4062109B2 (ja) 2002-02-01 2008-03-19 松下電器産業株式会社 プラズマディスプレイ装置の製造方法
CN1311504C (zh) * 2002-02-01 2007-04-18 松下电器产业株式会社 等离子体显示装置的制造方法
JP4028756B2 (ja) 2002-05-09 2007-12-26 シャープ株式会社 表示パネル
DE10242418A1 (de) * 2002-09-12 2004-03-25 Wacker-Chemie Gmbh Verfahren zur Herstellung von Organopolysiloxanharz
JP4258299B2 (ja) * 2003-07-16 2009-04-30 パナソニック株式会社 プラズマディスプレイパネル及びその製造方法
CN100587998C (zh) 2003-11-12 2010-02-03 铼宝科技股份有限公司 具有疏水层的有机发光面板
JP4423970B2 (ja) 2003-12-26 2010-03-03 ソニーケミカル＆インフォメーションデバイス株式会社 回路の接続構造及び接続方法
JP2005353500A (ja) 2004-06-11 2005-12-22 Dainippon Printing Co Ltd 電子表示媒体用ガスバリア膜
JP3841306B2 (ja) * 2004-08-05 2006-11-01 日東電工株式会社 位相差フィルムの製造方法
KR100683704B1 (ko) * 2004-11-17 2007-02-20 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
KR100730124B1 (ko) * 2004-12-30 2007-06-19 삼성에스디아이 주식회사 플라즈마 표시 장치
JP2006235571A (ja) * 2005-01-28 2006-09-07 Victor Co Of Japan Ltd 投射型表示装置
KR100649216B1 (ko) * 2005-07-21 2006-11-24 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
JP2006049917A (ja) * 2005-08-05 2006-02-16 Matsushita Electric Ind Co Ltd プラズマディスプレイパネルの電極接合方法、及びプラズマディスプレイパネル
KR100839421B1 (ko) * 2007-02-07 2008-06-19 삼성에스디아이 주식회사 플라즈마 디스플레이 장치

Also Published As

Publication number Publication date
US8174822B2 (en) 2012-05-08
EP1919265A3 (de) 2008-09-03
KR100814819B1 (ko) 2008-03-20
EP1919265A2 (de) 2008-05-07
JP2008116956A (ja) 2008-05-22
EP1919265B1 (de) 2009-09-02
JP4564039B2 (ja) 2010-10-20
CN101174373A (zh) 2008-05-07
JP2010277108A (ja) 2010-12-09
US20080101002A1 (en) 2008-05-01

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Legal Events

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