DE602006008455D1 - Verfahren zur herstellung einer polyimidfolie - Google Patents

Verfahren zur herstellung einer polyimidfolie

Info

Publication number
DE602006008455D1
DE602006008455D1 DE602006008455T DE602006008455T DE602006008455D1 DE 602006008455 D1 DE602006008455 D1 DE 602006008455D1 DE 602006008455 T DE602006008455 T DE 602006008455T DE 602006008455 T DE602006008455 T DE 602006008455T DE 602006008455 D1 DE602006008455 D1 DE 602006008455D1
Authority
DE
Germany
Prior art keywords
producing
polyimide foil
polyimide
foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006008455T
Other languages
English (en)
Inventor
Jitsuo Oishi
Takashi Makinoshima
Ko Kedo
Shuta Kihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Publication of DE602006008455D1 publication Critical patent/DE602006008455D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C55/00—Shaping by stretching, e.g. drawing through a die; Apparatus therefor
    • B29C55/02—Shaping by stretching, e.g. drawing through a die; Apparatus therefor of plates or sheets
    • B29C55/04—Shaping by stretching, e.g. drawing through a die; Apparatus therefor of plates or sheets uniaxial, e.g. oblique
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
    • B29C41/24—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of indefinite length
    • B29C41/28—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of indefinite length by depositing flowable material on an endless belt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C55/00—Shaping by stretching, e.g. drawing through a die; Apparatus therefor
    • B29C55/005—Shaping by stretching, e.g. drawing through a die; Apparatus therefor characterised by the choice of materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/1028—Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the process itself, e.g. steps, continuous
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2079/00—Use of polymers having nitrogen, with or without oxygen or carbon only, in the main chain, not provided for in groups B29K2061/00 - B29K2077/00, as moulding material
    • B29K2079/08—PI, i.e. polyimides or derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0271—Mechanical force other than pressure, e.g. shearing or pulling

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Shaping By String And By Release Of Stress In Plastics And The Like (AREA)
DE602006008455T 2005-04-14 2006-04-10 Verfahren zur herstellung einer polyimidfolie Active DE602006008455D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005117193 2005-04-14
PCT/JP2006/307546 WO2006112286A1 (ja) 2005-04-14 2006-04-10 ポリイミドフィルムの製造方法

Publications (1)

Publication Number Publication Date
DE602006008455D1 true DE602006008455D1 (de) 2009-09-24

Family

ID=37115011

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006008455T Active DE602006008455D1 (de) 2005-04-14 2006-04-10 Verfahren zur herstellung einer polyimidfolie

Country Status (8)

Country Link
US (1) US7871554B2 (de)
EP (1) EP1884345B1 (de)
JP (1) JP4826583B2 (de)
KR (1) KR101238967B1 (de)
CN (1) CN101160202B (de)
DE (1) DE602006008455D1 (de)
TW (1) TWI393734B (de)
WO (1) WO2006112286A1 (de)

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* Cited by examiner, † Cited by third party
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CN102112293B (zh) * 2008-06-02 2014-12-03 宇部兴产株式会社 宽度方向的线性膨胀系数比传送方向的线性膨胀系数小的芳族聚酰亚胺薄膜的制备方法
CN101684182B (zh) * 2008-09-25 2011-11-16 比亚迪股份有限公司 一种聚酰亚胺膜的制备方法
KR101368597B1 (ko) * 2009-03-31 2014-02-27 코오롱인더스트리 주식회사 투명전극, 전도성 적층체 및 전도성 수지막
JP5667392B2 (ja) * 2010-08-23 2015-02-12 株式会社カネカ 積層体、及びその利用
TWI439492B (zh) * 2011-09-14 2014-06-01 Mortech Corp 聚醯亞胺膜
US9073297B2 (en) 2011-11-11 2015-07-07 Mitsubishi Gas Chemical Company, Inc. Method for manufacturing transparent, heat-resistant gas-barrier film
JP5894811B2 (ja) * 2012-02-03 2016-03-30 東レ・デュポン株式会社 ポリイミドシートおよびその製造方法
CN103732655B (zh) * 2012-02-08 2015-05-13 三菱瓦斯化学株式会社 结晶性热塑聚酰亚胺树脂
JP5822352B2 (ja) * 2012-02-10 2015-11-24 新日鉄住金化学株式会社 透明可撓性積層体及び積層体ロール
US11497681B2 (en) 2012-02-28 2022-11-15 Corning Incorporated Glass articles with low-friction coatings
US10737973B2 (en) 2012-02-28 2020-08-11 Corning Incorporated Pharmaceutical glass coating for achieving particle reduction
CN107540242B (zh) 2012-02-28 2020-11-20 康宁股份有限公司 具有低摩擦涂层的玻璃制品
US10273048B2 (en) 2012-06-07 2019-04-30 Corning Incorporated Delamination resistant glass containers with heat-tolerant coatings
US9034442B2 (en) 2012-11-30 2015-05-19 Corning Incorporated Strengthened borosilicate glass containers with improved damage tolerance
JP5931672B2 (ja) * 2012-09-24 2016-06-08 新日鉄住金化学株式会社 ポリイミド積層体及びその製造方法
US10117806B2 (en) 2012-11-30 2018-11-06 Corning Incorporated Strengthened glass containers resistant to delamination and damage
JP6325265B2 (ja) * 2013-03-07 2018-05-16 東レ・デュポン株式会社 ポリイミドフィルム、および、その製造方法
CN103694475B (zh) * 2013-12-30 2016-03-23 桂林电器科学研究院有限公司 一种无色透明聚酰亚胺薄膜及其制备方法
TWI705946B (zh) 2014-09-05 2020-10-01 美商康寧公司 玻璃物品及改善玻璃物品可靠性的方法
CN107001102A (zh) 2014-11-26 2017-08-01 康宁股份有限公司 用于生产强化且耐用玻璃容器的方法
KR102327147B1 (ko) 2014-12-26 2021-11-16 삼성전자주식회사 표시장치용 윈도우 및 이를 포함하는 표시 장치
EP3150564B1 (de) 2015-09-30 2018-12-05 Corning Incorporated Halogenierte chemische polyimidsiloxanzusammensetzungen und glasgegenstände mit halogenierten polylmidsiloxanbeschichtungen mit geringer reibung
SG11201803373UA (en) 2015-10-30 2018-05-30 Corning Inc Glass articles with mixed polymer and metal oxide coatings
CN105384933B (zh) * 2015-12-25 2017-12-01 桂林电器科学研究院有限公司 一种低熔点热塑性聚酰亚胺树脂、含有该树脂的薄膜及制备方法
JP6806141B2 (ja) * 2016-03-30 2021-01-06 コニカミノルタ株式会社 ポリイミドフィルムの製造方法
JP2019090843A (ja) * 2016-03-31 2019-06-13 コニカミノルタ株式会社 光学フィルムの製造方法
CN109071811B (zh) * 2016-05-02 2021-06-25 三菱瓦斯化学株式会社 聚酰亚胺树脂、聚酰亚胺树脂组合物和聚酰亚胺薄膜
JP6862956B2 (ja) * 2017-03-17 2021-04-21 コニカミノルタ株式会社 フレキシブルディスプレイ前面板用の透明ポリイミドフィルム及びその製造方法、並びに有機エレクトロルミネッセンスディスプレイ
KR102645705B1 (ko) * 2018-11-06 2024-03-07 주식회사 엘지화학 폴리아미드-이미드 필름 및 이의 제조 방법

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JP4247448B2 (ja) * 2002-09-17 2009-04-02 三菱瓦斯化学株式会社 透明導電性フィルム
JP2003141936A (ja) * 2001-11-02 2003-05-16 Mitsubishi Gas Chem Co Inc 透明導電性フィルム
US6962756B2 (en) 2001-11-02 2005-11-08 Mitsubishi Gas Chemical Company, Inc. Transparent electrically-conductive film and its use
US6949296B2 (en) * 2002-12-31 2005-09-27 E. I. Du Pont De Nemours And Company Polyimide substrates having enhanced flatness, isotropy and thermal dimensional stability, and methods and compositions relating thereto
JP4373925B2 (ja) * 2003-01-08 2009-11-25 帝人株式会社 ポリイミドフィルムの製造法
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JP4872187B2 (ja) 2003-05-09 2012-02-08 三菱瓦斯化学株式会社 金属張積層体
KR101075771B1 (ko) 2003-05-09 2011-10-24 미츠비시 가스 가가쿠 가부시키가이샤 금속박 부착형 적층체
JP4678138B2 (ja) * 2003-05-09 2011-04-27 三菱瓦斯化学株式会社 接着剤および接着性フィルム

Also Published As

Publication number Publication date
CN101160202A (zh) 2008-04-09
WO2006112286A1 (ja) 2006-10-26
JP4826583B2 (ja) 2011-11-30
US20090160089A1 (en) 2009-06-25
JPWO2006112286A1 (ja) 2008-12-11
EP1884345B1 (de) 2009-08-12
TWI393734B (zh) 2013-04-21
KR101238967B1 (ko) 2013-03-04
EP1884345A4 (de) 2008-09-03
EP1884345A1 (de) 2008-02-06
KR20080012837A (ko) 2008-02-12
CN101160202B (zh) 2010-11-03
TW200643068A (en) 2006-12-16
US7871554B2 (en) 2011-01-18

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