DE602005024372D1 - Flexible leiterplattenanordnung - Google Patents

Flexible leiterplattenanordnung

Info

Publication number
DE602005024372D1
DE602005024372D1 DE602005024372T DE602005024372T DE602005024372D1 DE 602005024372 D1 DE602005024372 D1 DE 602005024372D1 DE 602005024372 T DE602005024372 T DE 602005024372T DE 602005024372 T DE602005024372 T DE 602005024372T DE 602005024372 D1 DE602005024372 D1 DE 602005024372D1
Authority
DE
Germany
Prior art keywords
flexible pcb
grooves
pcb assembly
circuit board
bending region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005024372T
Other languages
English (en)
Inventor
Thomas P Gall
Richard A Hawkins
Kevin D Moore
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of DE602005024372D1 publication Critical patent/DE602005024372D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24521—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness with component conforming to contour of nonplanar surface
    • Y10T428/24537—Parallel ribs and/or grooves

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Air Bags (AREA)
  • Pens And Brushes (AREA)
DE602005024372T 2004-02-27 2005-01-11 Flexible leiterplattenanordnung Active DE602005024372D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/789,522 US6927344B1 (en) 2004-02-27 2004-02-27 Flexible circuit board assembly
PCT/US2005/000861 WO2005094143A1 (en) 2004-02-27 2005-01-11 Flexible circuit board assembly

Publications (1)

Publication Number Publication Date
DE602005024372D1 true DE602005024372D1 (de) 2010-12-09

Family

ID=34808672

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005024372T Active DE602005024372D1 (de) 2004-02-27 2005-01-11 Flexible leiterplattenanordnung

Country Status (10)

Country Link
US (1) US6927344B1 (de)
EP (1) EP1726191B1 (de)
JP (1) JP2007525841A (de)
KR (1) KR20060123597A (de)
CN (1) CN1918951A (de)
AT (1) ATE486489T1 (de)
AU (1) AU2005226496B2 (de)
CA (1) CA2553559A1 (de)
DE (1) DE602005024372D1 (de)
WO (1) WO2005094143A1 (de)

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Also Published As

Publication number Publication date
US20050190531A1 (en) 2005-09-01
US6927344B1 (en) 2005-08-09
EP1726191A1 (de) 2006-11-29
EP1726191A4 (de) 2007-07-04
JP2007525841A (ja) 2007-09-06
AU2005226496A1 (en) 2005-10-06
AU2005226496B2 (en) 2009-04-02
CA2553559A1 (en) 2005-10-06
KR20060123597A (ko) 2006-12-01
EP1726191B1 (de) 2010-10-27
ATE486489T1 (de) 2010-11-15
CN1918951A (zh) 2007-02-21
WO2005094143A1 (en) 2005-10-06

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