WO2011043318A1 - 回路基板 - Google Patents
回路基板 Download PDFInfo
- Publication number
- WO2011043318A1 WO2011043318A1 PCT/JP2010/067415 JP2010067415W WO2011043318A1 WO 2011043318 A1 WO2011043318 A1 WO 2011043318A1 JP 2010067415 W JP2010067415 W JP 2010067415W WO 2011043318 A1 WO2011043318 A1 WO 2011043318A1
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- WIPO (PCT)
- Prior art keywords
- circuit board
- region
- sheet
- flexible
- conductor
- Prior art date
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4632—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets
Definitions
- the present invention relates to a circuit board, and more particularly to a circuit board having a rigid region and a flexible region.
- FIG. 14 is a cross-sectional structure diagram of a printed wiring board 500 described in Patent Document 1.
- the printed wiring board 500 includes a first layer 510, a second layer 520, a flexible sheet 530, and conductor patterns 532a and 532b.
- the first layer 510 and the second layer 520 are stacked on each other. A portion of the second layer 520 is cut away.
- the flexible sheet 530 is bonded to the first layer 510 at a portion where the second layer 520 is cut out.
- a region composed of the first layer 510 and the flexible sheet 530 (hereinafter referred to as a flexible region R503) is a region where the first layer 510 and the second layer 520 are provided (hereinafter referred to as a rigid region).
- R501 and R502 Therefore, the printed wiring board 500 can be bent in the flexible region R503.
- a metal film such as silver or copper is used for the conductor patterns 532a and 532b.
- the conductor patterns 532a and 532b made of a metal film have high rigidity but are plastically deformed when bent with a small radius.
- the plastically deformed conductor patterns 532a and 532b no longer function sufficiently as reinforcing members. As a result, damage may occur at the boundary between the rigid regions R501 and R502 and the flexible region R503.
- an object of the present invention is to provide a circuit board that can suppress the occurrence of breakage at the boundary between the rigid region and the flexible region.
- a circuit board includes a plurality of insulator layers stacked and includes a first region and a second region having higher flexibility than the first region. And a circuit made of a conductor provided on the main body, and the second region of the main surface of the main body has a boundary between the first region and the second region. And a first groove extending along the boundary is provided.
- FIG. 1 is an external perspective view of a circuit board according to an embodiment of the present invention. It is a disassembled perspective view of the circuit board of FIG. It is a perspective view in the manufacture process of the flexible sheet
- FIG. 2 is a cross-sectional structural view taken along line AA of the circuit board of FIG.
- FIG. 5A is a cross-sectional structure diagram of a circuit board according to a comparative example
- FIG. 5B is a cross-sectional structure diagram of a circuit board according to the present embodiment. It is a sectional structure figure of a circuit board concerning the 1st modification. It is a sectional structure figure of a circuit board concerning the 1st modification. It is a sectional structure figure of a circuit board concerning the 2nd modification.
- FIG. 1 is a cross-sectional structure diagram of a printed wiring board described in Patent Document 1.
- FIG. 2 is a cross-sectional structure diagram of a printed wiring board described in Patent Document 1.
- FIG. 1 is an external perspective view of a circuit board 10 according to an embodiment of the present invention.
- FIG. 2 is an exploded perspective view of the circuit board 10 of FIG.
- FIG. 3 is a perspective view in the process of manufacturing the flexible sheet 26 a of the circuit board 10.
- 3A shows the back surface of the flexible sheet 26a
- FIG. 3B shows the surface of the flexible sheet 26a in a state where the resist films 20 and 24 are not formed.
- the stacking direction of the circuit board 10 is defined as the z-axis direction
- the longitudinal direction of the line portion 16 of the circuit board 10 is defined as the x-axis direction.
- a direction orthogonal to the x-axis direction and the z-axis direction is defined as the y-axis direction.
- the surface of the circuit board 10 and the flexible sheet 26 refers to a surface located on the positive direction side in the z-axis direction, and the back surface of the circuit board 10 and the flexible sheet 26 is located on the negative direction side in the z-axis direction. Point to the surface.
- the circuit board 10 includes a main body 11 having board portions 12 and 14 and a line portion 16, and a circuit C (see FIG. 1) configured by a conductor provided in the main body 11. (Not shown).
- the main body 11 includes a flexible sheet (insulator layer) 26 (26a to 26d) made of a plurality of (four in FIG. 2) flexible materials (for example, a thermoplastic resin such as a liquid crystal polymer). Are laminated.
- the substrate portion 12 has a rectangular shape, and has a mounting surface on which a plurality of chip components 50 and an integrated circuit 52 are mounted.
- the board part 14 has a rectangular shape smaller than the board part 12, and has a mounting surface on which the connector 54 is mounted.
- the substrate portions 12 and 14 have a configuration that is difficult to be deformed (not easily bent) so that the chip component 50, the integrated circuit 52, and the connector 54 can be stably mounted.
- the substrate portions 12 and 14 are also referred to as rigid regions R1 and R2, respectively.
- the line portion 16 connects the substrate portion 12 and the substrate portion 14.
- the circuit board 10 is used with the line portion 16 curved in a U shape. Therefore, the line portion 16 has higher flexibility (a configuration that is easily deformed (easily bent)) than the substrate portions 12 and 14. Therefore, hereinafter, the line portion 16 is also referred to as a flexible region F1.
- the substrate unit 12 (rigid region R1) will be described.
- the substrate unit 12 is configured by stacking substrate unit sheets 27a to 27d of flexible sheets 26a to 26d.
- the substrate unit 12 includes a resist film 20, lands 28, wiring conductors 30 (30b and 30c), a ground conductor 37, and via-hole conductors b1 to b3 and b21 to b26.
- the lands 28, the wiring conductors 30 and the via-hole conductors b1 to b3 are provided with reference numerals only for representative ones in order to prevent the drawings from becoming complicated.
- the land 28 is a conductor provided on the surface of the board portion sheet 27a, as shown in FIG. As shown in FIG. 1, a chip component 50 and an integrated circuit 52 are mounted on the land 28 by soldering.
- each via-hole conductor b1 is provided so as to penetrate the substrate part sheet 27a in the z-axis direction.
- the via-hole conductor b1 is connected to the land 28.
- the wiring conductor 30b is a conductor provided on the surface of the board portion sheet 27b, specifically, as shown in FIG. As shown in FIG. 2, the via-hole conductor b ⁇ b> 2 is provided so as to penetrate the substrate part sheet 27 b in the z-axis direction. The via hole conductor b2 is connected to the via hole conductor b1. As shown in FIG. 2, the via-hole conductors b21 to b23 are provided so as to penetrate the substrate portion sheet 27b in the z-axis direction. The via hole conductors b21 to b23 are connected to the wiring conductor 30b.
- the wiring conductor 30c is a conductor provided on the surface of the board portion sheet 27c, specifically, as shown in FIG.
- the via-hole conductor b ⁇ b> 3 is provided so as to penetrate the substrate part sheet 27 c in the z-axis direction.
- the via hole conductor b3 is connected to one of the via hole conductors b2.
- the via-hole conductors b24 to b26 are provided so as to penetrate the substrate portion sheet 27c in the z-axis direction.
- the via hole conductors b24 to b26 are connected to the via hole conductors b21 to b23, respectively.
- the ground conductor 37 is a single rectangular film-like electrode provided in the main body 11 and specifically provided so as to cover the surface of the substrate portion sheet 27d. However, as shown in FIG. 2, the ground conductor 37 does not cover the entire surface of the substrate portion sheet 27d, and is not provided near the outer periphery of the substrate portion sheet 27d. The ground conductor 37 is kept at the ground potential by being grounded. The ground conductor 37 is connected to the via-hole conductors b3, b24 to b26. As described above, the wiring conductors 30b and 30c, the ground conductor 37, and the via-hole conductors b1 to b3 and b21 to b26 are connected to each other by laminating the board portion sheets 27a to 27d to form a circuit.
- the resist film (insulating film) 20 is an insulating film that is provided so as to cover the surface of the substrate portion sheet 27a and protects the substrate portion sheet 27a. However, the resist film 20 is not provided on the land 28.
- the resist film 20 is made of a material having low wettability with respect to solder, and is produced, for example, by applying a thermosetting resin (for example, epoxy resin).
- the substrate unit 14 (rigid region R2) will be described.
- the substrate section 14 is configured by stacking substrate section sheets 29a to 29d of flexible sheets 26a to 26d.
- the substrate portion 14 includes a resist film 24, lands 35, wiring conductors 36 (36b, 36c), a ground conductor 40, and via-hole conductors b11, b12, b31 to b36.
- the lands 35, the wiring conductors 36, and the via-hole conductors b11 and b12 are provided with reference numerals only for representative ones in order to prevent the drawings from becoming complicated.
- the land 35 is a conductor provided on the surface of the substrate portion sheet 29a, as shown in FIG. As shown in FIG. 1, a connector 54 is mounted on the land 35 by soldering.
- Each of the via-hole conductors b11 is provided so as to penetrate the substrate part sheet 29a in the z-axis direction, as shown in FIG.
- the via hole conductor b11 is connected to the land 35.
- the wiring conductor 36b is provided on the main body 11, and specifically, as shown in FIG. 2, is a conductor provided on the surface of the substrate section sheet 29b.
- the via-hole conductor b12 is provided so as to penetrate the substrate portion sheet 29b in the z-axis direction.
- the via hole conductor b12 is connected to the via hole conductor b11.
- the via-hole conductors b31 to b33 are provided so as to penetrate the substrate portion sheet 29b in the z-axis direction.
- the via-hole conductors b31 to b33 are connected to the wiring conductor 36b.
- the wiring conductor 36c is provided on the main body 11, and specifically is a conductor provided on the surface of the substrate section sheet 29c as shown in FIG.
- the wiring conductor 36c is connected to the via hole conductor b12.
- the via-hole conductors b34 to b36 are provided so as to penetrate the substrate portion sheet 29c in the z-axis direction.
- the via hole conductors b34 to b36 are connected to the via hole conductors b31 to b33.
- the ground conductor 40 is provided on the main body 11, and specifically, is a single rectangular film electrode provided so as to cover the surface of the substrate portion sheet 29d. However, as shown in FIG. 2, the ground conductor 40 does not cover the entire surface of the substrate portion sheet 29d and is not provided in the vicinity of the outer periphery of the substrate portion sheet 29d. The ground conductor 40 is kept at the ground potential by being grounded. The ground conductor 40 is connected to the via-hole conductors b34 to b36. As described above, the wiring conductors 36b and 36c, the ground conductor 40, and the via-hole conductors b11, b12, and b31 to b36 are connected to each other by laminating the substrate portion sheets 29a to 29d to form a circuit.
- the resist film (insulating film) 24 is an insulating film provided so as to cover the surface of the substrate part sheet 29a and protecting the substrate part sheet 29a. However, the resist film 24 is not provided on the land 35.
- the resist film 24 is made of a material having low wettability with respect to solder, and is produced, for example, by applying a thermosetting resin (for example, epoxy resin).
- the line portion 16 (flexible region F1) will be described.
- the line portion 16 is configured by overlapping line portion sheets 31a to 31d of flexible sheets 26a to 26d. Further, as shown in FIGS. 1 and 2, the line portion 16 includes ground lines 32 (32b, 32d), 33 (33b, 33d), 34 (34b, 34d) and signal lines 42c, 43c, 44c. Yes.
- the signal lines 42c, 43c, and 44c are each provided in the main body 11, and more specifically, are provided in the line portion 16 and extend between the substrate portions 12 and 14. As shown in FIG. 2, the signal lines 42c, 43c, and 44c are linear conductors provided on the surface of the line portion sheet 31c. High-frequency signals (for example, 800 MHz to 900 MHz) are transmitted to the signal lines 42c, 43c, and 44c.
- the signal lines 42c, 43c, and 44c connect the wiring conductor 30c and the wiring conductor 36c as shown in FIG. That is, the conductor composed of the wiring conductors 30c, 36c and the signal lines 42c, 43c, 44c is provided across the rigid regions R1, R2 and the flexible region F1.
- Each of the ground lines 32b, 33b, and 34b is provided in the main body 11, and more specifically, provided in the line portion 16, and closer to the positive side in the z-axis direction than the signal lines 42c, 43c, and 44c. Is provided.
- the ground lines 32b, 33b, and 34b are provided on the surface of the line portion sheet 31b, respectively, and connect the wiring conductor 30b and the wiring conductor 36b. That is, the conductor composed of the wiring conductors 30b and 36b and the ground lines 32b, 33b, and 34b is provided across the rigid regions R1 and R2 and the flexible region F1. Furthermore, the wiring conductor 30b is connected to the ground conductor 37 via via-hole conductors b21 to b26.
- the wiring conductor 36b is connected to the ground conductor 40 via via-hole conductors b31 to b36. Therefore, the ground lines 32b, 33b, and 34b are electrically connected to the ground conductor 37, respectively. The ground lines 32b, 33b, and 34b are electrically connected to the ground conductor 40, respectively.
- the ground lines 32b, 33b, and 34b have line widths larger than those of the signal lines 42c, 43c, and 44c, respectively. Accordingly, the signal lines 42c, 43c, and 44c overlap the ground lines 32b, 33b, and 34b without protruding from the ground lines 32b, 33b, and 34b, respectively, when viewed in plan from the z-axis direction.
- the ground lines 32d, 33d, and 34d are respectively provided in the line portion 16, and are provided on the negative side in the z-axis direction with respect to the signal lines 42c, 43c, and 44c. Specifically, as shown in FIG. 2, the ground lines 32 d, 33 d, and 34 d are provided on the surface of the line portion sheet 31 d and connect the ground conductor 37 and the ground conductor 40. That is, the conductor composed of the ground conductors 37 and 40 and the ground lines 32d, 33d, and 34d is provided across the rigid regions R1 and R2 and the flexible region F1.
- the ground lines 32d, 33d, and 34d each have a larger line width than the signal lines 42c, 43c, and 44c. Accordingly, the signal lines 42c, 43c, and 44c overlap the ground lines 32d, 33d, and 34d without protruding from the ground lines 32d, 33d, and 34d when viewed in plan from the z-axis direction.
- the ground lines 32b, 33b, 34b, the signal lines 42c, 43c, 44c, and the ground lines 32d, 33d, 34d overlap each other.
- the ground line 32b, the signal line 42c, and the ground line 32d constitute a strip line.
- the ground line 33b, the signal line 43c, and the ground line 33d constitute a strip line.
- the ground line 34b, the signal line 44c, and the ground line 34d constitute a strip line.
- the proportion of the area occupied by the conductor in the rigid regions R1 and R2 is made larger than the proportion of the area occupied by the conductor in the flexible region F1. More specifically, as shown in FIG. 2, when viewed in plan from the z-axis direction, the rigid regions R1 and R2 are provided with ground conductors 37 and 40 that cover substantially the entire surface of the rigid regions R1 and R2. . On the other hand, the conductor that covers substantially the entire surface of the flexible region F1 is not provided in the flexible region F1, and the ground lines 32b, 32d, 33b, 33d, 34b, and 34d extending in the x-axis direction in the flexible region F1.
- the ground conductors 37 and 40 are harder than the flexible sheet 26. Therefore, by making the proportion of the area occupied by the conductor in the rigid regions R1 and R2 larger than the proportion of the area occupied by the conductor in the flexible region F1 when viewed in plan from the z-axis direction, it is more than that of the rigid regions R1 and R2.
- the flexible region F1 can be easily deformed.
- the circuit board 10 has a configuration capable of suppressing the occurrence of breakage at the boundaries B1 and B2 between the rigid regions R1 and R2 and the flexible region F1.
- Such a configuration will be described below with reference to FIG. 4 is a cross-sectional structural view taken along the line AA of the circuit board 10 of FIG.
- the circuit board 10 has rigid regions R1, R2 and a flexible region F1. Between the rigid regions R1, R2 and the flexible region F1, there are boundaries B1, B2 extending in the y-axis direction, respectively. As shown in FIG. 4, the flexible region F1 on the main surface of the main body 11 is in contact with the boundaries B1, B2 between the rigid regions R1, R2 and the flexible region F1, and extends along the boundaries B1, B2. Grooves G1 and G2 are provided. More specifically, as shown in FIG. 2 and FIG. 4, the grooves G1 and G2 are respectively x of the line portion sheet 31a located on the most positive side in the z-axis direction among the line portion sheets 31a to 31d.
- the circuit board 10 has a structure in which the thickness in the z-axis direction is thinner in the portion adjacent to the boundaries B1 and B2 of the flexible region F1 than in other portions of the flexible region F1.
- the flexible region F1 is curved in a U-shape so that the line portion sheet 31a is located on the outer peripheral side and the line portion sheet 31d is located on the inner peripheral side. Used in the state.
- circuit board manufacturing method below, the manufacturing method of the circuit board 10 is demonstrated, referring drawings.
- a case where one circuit board 10 is manufactured will be described as an example, but actually, a plurality of circuit boards 10 are simultaneously manufactured by laminating and cutting large-sized flexible sheets.
- a plurality of flexible sheets 26 having a copper foil having a thickness of 5 ⁇ m to 50 ⁇ m formed on the entire surface are prepared.
- grooves G1 and G2 are formed in the flexible sheet 26a.
- the grooves G1 and G2 may be formed when the flexible sheet 26a is formed, or may be formed by compressing a part of the flexible sheet 26a after the flexible sheet 26a is formed.
- the laser is applied from the back side to the positions where the via-hole conductors b1 to b3, b11, b12, b21 to b26, b31 to b36 of the flexible sheets 26a to 26c are formed (see FIGS. 2 and 3A).
- a via hole is formed by irradiating a beam.
- lands 28 and 35 shown in FIG. 3B are formed on the surface of the flexible sheet 26a by a photolithography process. Specifically, a resist having the same shape as the lands 28 and 35 shown in FIG. 3B is printed on the copper foil of the flexible sheet 26a. And the copper foil of the part which is not covered with the resist is removed by performing an etching process with respect to copper foil. Thereafter, the resist is removed. Thereby, lands 28 and 35 as shown in FIG. 3B are formed on the surface of the flexible sheet 26a. Further, the resist films 20 and 24 shown in FIGS. 1 and 2 are formed by applying a resin to the surface of the flexible sheet 26a.
- wiring conductors 30b, 36b and ground lines 32b, 33b, 34b shown in FIG. 2 are formed on the surface of the flexible sheet 26b by a photolithography process. Further, the wiring conductors 30c and 36c and the signal lines 42c, 43c and 44c shown in FIG. 2 are formed on the surface of the flexible sheet 26c by a photolithography process. Further, the ground lines 32d, 33d, 34d and the ground conductors 37, 40 shown in FIG. 2 are formed on the surface of the flexible sheet 26d by a photolithography process. Note that these photolithography processes are the same as the photolithography processes for forming the lands 28 and 35, and thus description thereof is omitted.
- the via holes formed in the flexible sheets 26a to 26c are filled with a conductive paste mainly composed of copper, and the via hole conductors b1 to b3, b11, b12, b21 shown in FIG. 2 and FIG. To b26 and b31 to b36 are formed.
- flexible sheets 26a to 26d made of a flexible material and having the circuit C formed thereon are prepared.
- the circuit C includes wiring conductors 30b, 30c, 36b, and 36c, ground conductors 37 and 40, and via-hole conductors b1 to b3, b11, b12, b21 to b26, b31 to b36, and ground lines 32b, 33b, 34b, 32d, and 33d. , 34d and signal lines 42c, 43c, 44c.
- the flexible sheets 26a to 26d are stacked in this order. Then, a force is applied to both the flexible sheets 26a to 26d from both sides in the z-axis direction and heated. As a result, the flexible sheets 26a to 26d are pressure-bonded.
- the circuit board 10 shown in FIG. 1 is obtained through the above steps.
- FIG. 5A is a cross-sectional structure diagram of a circuit board 10 ′ according to a comparative example
- FIG. 5B is a cross-sectional structure diagram of the circuit board 10 according to the present embodiment.
- the same components as those of the circuit board 10 are indicated by adding “′” to the reference numerals used in the circuit board 10.
- the circuit board 10 ′ is different from the circuit board 10 in that the grooves G1 and G2 are not provided.
- a tensile stress acts on the line portion sheets 31′a and 31′b located on the outer peripheral side, and the line portion sheets 31′c and 31b located on the inner peripheral side.
- a compressive stress acts on 31'd. Therefore, the line section sheets 31′a and 31′b are extended, and the line section sheets 31′c and 31′d are contracted.
- the line section sheet 31′a is stretched greatly due to a greater tensile stress than the line section sheet 31′b.
- the hardness of the main body 11 changes abruptly. Therefore, the vicinity of the boundary B1 of the flexible region F1 is curved with a small radius. As a result, particularly large tensile stress acts near the boundary B1 of the line portion sheet 31′a, and there is a possibility that the vicinity of the boundary B1 of the line portion sheet 31′a breaks. Note that, due to the same principle, the line section sheet 31′a may be broken in the vicinity of the boundary B2.
- the grooves are in contact with the boundaries B1, B2 between the rigid regions R1, R2 and the flexible region F1 and extend along the boundaries B1, B2.
- G1 and G2 are provided.
- the grooves G ⁇ b> 1 and G ⁇ b> 2 are particularly provided in the line portion sheet 31 a located on the outermost peripheral side.
- the number of layers of the flexible sheet 26 in the rigid regions R1 and R2 (four layers in FIG. 6) is larger than the number of layers of the flexible sheet 26 in the flexible region F1 (two layers in FIG. 6). Then, there are steps on the boundaries B1, B2 between the rigid regions R1, R2 and the flexible region F1.
- grooves G1 and G2 are provided at both ends in the x-axis direction of the line portion sheet 31b, and grooves G3 and G4 are provided at both ends in the x-axis direction of the line portion sheet 31c.
- circuit board 10a as described above is provided with the grooves G1 and G2, it is possible to suppress the occurrence of breakage at the boundary between the rigid regions R1 and R2 and the flexible region F1 similarly to the circuit substrate 10.
- the circuit board 10a can suppress that the line part sheet
- grooves G3 and G4 are provided in the vicinity of the boundaries B1 and B2 of the line portion sheet 31b located on the inner peripheral side.
- transforms so that the width
- the compressive stress applied to the line section sheet 31b is reduced, and the line section sheet 31c is suppressed from peeling from the line section sheet 31b. That is, also from this viewpoint, the circuit board 10a can suppress the occurrence of breakage at the boundary between the rigid regions R1, R2 and the flexible region F1.
- the circuit board 10a can suppress that the board
- the substrate portion sheets 27a and 29a cannot follow the deformation of the substrate portion sheets 27b and 29b. As a result, the substrate portion sheets 27a and 29a try to peel from the substrate portion sheets 27b and 29b.
- the circuit board 10a can suppress the occurrence of breakage at the boundary between the rigid regions R1, R2 and the flexible region F1.
- FIG. 8 is a cross-sectional structure diagram of a circuit board 10b according to a second modification.
- the circuit board 10b is further provided with grooves G5 to G12 with respect to the circuit board 10a. More specifically, the groove G5 is adjacent to the groove G1 on the negative side in the x-axis direction and extends in parallel with the groove G1.
- the groove G6 is adjacent to the groove G5 on the negative side in the x-axis direction and extends in parallel with the groove G1.
- the groove G7 is adjacent to the groove G2 on the positive side in the x-axis direction and extends in parallel with the groove G2.
- the groove G8 is adjacent to the groove G7 on the positive side in the x-axis direction and extends in parallel with the groove G2.
- the groove G9 is adjacent to the negative side of the groove G3 in the x-axis direction and extends in parallel with the groove G3.
- the groove G10 is adjacent to the negative side of the groove G9 in the x-axis direction and extends in parallel with the groove G3.
- the groove G11 is adjacent to the groove G4 on the positive side in the x-axis direction and extends in parallel with the groove G4.
- the groove G12 is adjacent to the groove G11 on the positive side in the x-axis direction and extends in parallel with the groove G4.
- the circuit board 10b since the grooves G5 to G12 are provided in addition to the grooves G1 to G4, the occurrence of damage to the line section sheet 31b can be more effectively suppressed, and the line section sheet 31c can be It can suppress more effectively peeling from the part sheet
- FIG. 9 is a cross-sectional structure diagram of a circuit board 10c according to a third modification.
- the flexible region F1 is curved with a small radius in the vicinity of the boundaries B1 and B2. For this reason, it is desirable to make the portions near the boundaries B1 and B2 of the flexible region F1 easier to deform. Therefore, in the circuit board 10c, the grooves G1 to G4 in contact with the boundaries B1 and B2 are deeper than the grooves G5 to G12. The grooves G5 to G12 become shallower as the distance from the boundaries B1 and B2 increases. Thereby, the flexible area
- the circuit board 10c can more effectively suppress the occurrence of breakage of the line portion sheets 31b and 31c, and more effectively suppress the line portion sheet 31c from peeling from the line portion sheet 31b. Furthermore, the circuit board 10c can suppress more effectively that the board
- FIG. 10 is a cross-sectional structure diagram of a circuit board 10d according to a fourth modification.
- circuit boards 10a to 10c steps were provided on both main surfaces of the main body 11.
- the step is provided only on the main surface of the main body 11 on the positive side in the z-axis direction. That is, the circuit board 10a to 10c is not provided with the line portion sheet 31d, whereas the circuit board 10d is provided with the line portion sheet 31d.
- channels G1 and G2 are provided in the track
- the circuit board 10d as described above can also more effectively suppress the occurrence of breakage of the line section sheet 31b and more effectively suppress the separation of the board section sheets 27a and 29a from the board section sheets 27b and 29b. . That is, the circuit board 10d can suppress the occurrence of breakage at the boundary between the rigid regions R1, R2 and the flexible region F1.
- FIG. 11 is a cross-sectional structure diagram of a circuit board 10e according to a fifth modification.
- the grooves G1 and G2 are provided in the line portion sheet 31b.
- the grooves G3 and G4 are provided in the line portion sheet 31d.
- the circuit board 10e as described above can also more effectively suppress the line portion sheet 31d from being separated from the line portion sheet 31c. That is, the circuit board 10a can suppress the occurrence of breakage at the boundary between the rigid regions R1, R2 and the flexible region F1.
- FIG. 12 is a cross-sectional structure diagram of a circuit board 10f according to a sixth modification.
- the grooves G1 and G2 of the circuit board 10f are wider in the x-axis direction than the grooves G1 and G2 of the circuit board 10d.
- the circuit board 10f having such a configuration can also more effectively suppress the occurrence of breakage of the line portion sheet 31b and more effectively suppress the line portion sheet 31d from peeling from the line portion sheet 31c.
- the circuit board 10f can more effectively suppress the board part sheets 27a and 29a from being separated from the board part sheets 27b and 29b. That is, the circuit board 10f can suppress the occurrence of breakage at the boundary between the rigid regions R1, R2 and the flexible region F1.
- FIG. 13 is a cross-sectional structure diagram of a circuit board 10g according to a seventh modification.
- the circuit board 10g is further provided with grooves G3 to G12 with respect to the circuit board 10d. More specifically, the grooves G3 and G4 are provided at both ends in the x-axis direction of the line portion sheet 31d. And the groove
- channel G5 is adjacent in the negative direction side of the x-axis direction of the groove
- the groove G6 is adjacent to the groove G5 on the negative side in the x-axis direction and extends in parallel with the groove G1.
- the groove G7 is adjacent to the groove G2 on the positive side in the x-axis direction and extends in parallel with the groove G2.
- the groove G8 is adjacent to the groove G7 on the positive side in the x-axis direction and extends in parallel with the groove G2.
- the groove G9 is adjacent to the negative side of the groove G3 in the x-axis direction and extends in parallel with the groove G3.
- the groove G10 is adjacent to the negative side of the groove G9 in the x-axis direction and extends in parallel with the groove G3.
- the groove G11 is adjacent to the groove G4 on the positive side in the x-axis direction and extends in parallel with the groove G4.
- the groove G12 is adjacent to the groove G11 on the positive side in the x-axis direction and extends in parallel with the groove G4.
- the grooves G1 to G12 are not adjacent to each other. That is, there is a gap between the grooves G1 to G12.
- the circuit board 10g having such a configuration can also more effectively suppress the occurrence of breakage of the line portion sheet 31b and more effectively suppress the line portion sheet 31d from peeling from the line portion sheet 31c. Furthermore, the circuit board 10g can suppress more effectively that the board
- circuit boards 10, 10a to 10g all the flexible sheets 26a to 26d have flexibility. However, in the circuit boards 10, 10a to 10g, part or all of the board portion sheets 27, 29 may be formed of an insulating layer having no flexibility.
- the present invention is useful for a circuit board, and is particularly excellent in that the occurrence of breakage at the boundary between the rigid region and the flexible region can be suppressed.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
以下に、本発明の一実施形態に係る回路基板の構成について図面を参照しながら説明する。図1は、本発明の一実施形態に係る回路基板10の外観斜視図である。図2は、図1の回路基板10の分解斜視図である。図3は、回路基板10のフレキシブルシート26aの製造過程における斜視図である。図3(a)は、フレキシブルシート26aの裏面を示し、図3(b)は、レジスト膜20,24が形成されていない状態でのフレキシブルシート26aの表面を示している。図1ないし図3において、回路基板10の積層方向をz軸方向と定義し、回路基板10の線路部16の長手方向をx軸方向と定義する。そして、x軸方向及びz軸方向に直交する方向をy軸方向と定義する。なお、回路基板10及びフレキシブルシート26の表面とは、z軸方向の正方向側に位置する面を指し、回路基板10及びフレキシブルシート26の裏面とは、z軸方向の負方向側に位置する面を指す。
以下に、回路基板10の製造方法について図面を参照しながら説明する。以下では、一つの回路基板10が作製される場合を例にとって説明するが、実際には、大判のフレキシブルシートが積層及びカットされることにより、同時に複数の回路基板10が作製される。
回路基板10は、以下に説明するように、リジッド領域R1,R2とフレキシブル領域F1との境界において破損が発生することを抑制できる。図5(a)は、比較例に係る回路基板10'の断面構造図であり、図5(b)は、本実施形態に係る回路基板10の断面構造図である。なお、回路基板10'において、回路基板10と同じ構成については、回路基板10において用いた参照符号に「'」を付して表記してある。
以下に、第1の変形例に係る回路基板について図面を参照しながら説明する。図6及び図7は、第1の変形例に係る回路基板10aの断面構造図である。
以下に、第2の変形例に係る回路基板について図面を参照しながら説明する。図8は、第2の変形例に係る回路基板10bの断面構造図である。
以下に、第3の変形例に係る回路基板について図面を参照しながら説明する。図9は、第3の変形例に係る回路基板10cの断面構造図である。
以下に、第4の変形例に係る回路基板について図面を参照しながら説明する。図10は、第4の変形例に係る回路基板10dの断面構造図である。
以下に、第5の変形例に係る回路基板について図面を参照しながら説明する。図11は、第5の変形例に係る回路基板10eの断面構造図である。
以下に、第6の変形例に係る回路基板について図面を参照しながら説明する。図12は、第6の変形例に係る回路基板10fの断面構造図である。
以下に、第7の変形例に係る回路基板について図面を参照しながら説明する。図13は、第7の変形例に係る回路基板10gの断面構造図である。
F1 フレキシブル領域
G1~G12 溝
C 回路
R1,R2 リジッド領域
10,10a~10g 回路基板
11 本体
12,14 基板部
16 線路部
20,24 レジスト膜
26a~26d フレキシブルシート
27a~27d,29a~29d 基板部シート
30b,30c,36b,36c 配線導体
31a~31d 線路部シート
32b,32d,33b,33d,34b,34d グランド線
37,40 グランド導体
42c,43c,44c 信号線
Claims (6)
- 複数の絶縁体層が積層されて構成され、かつ、第1の領域及び該第1の領域よりも高い可撓性を有する第2の領域を含んでいる本体と、
前記本体に設けられている導体からなる回路と、
を備えており、
前記本体の主面の前記第2の領域には、前記第1の領域と該第2の領域との境界に接し、かつ、該境界に沿って延在する第1の溝が設けられていること、
を特徴とする回路基板。 - 前記第1の領域における前記絶縁体層の層数は、前記第2の領域における前記絶縁体層の層数よりも多く、
前記第1の領域と前記第2の領域との境界には、段差が存在していること、
を特徴とする請求項1に記載の回路基板。 - 前記本体の主面の前記第2の領域には、前記第1の溝に平行な少なくとも1以上の第2の溝が設けられていること、
を特徴とする請求項1又は請求項2のいずれかに記載の回路基板。 - 前記第1の溝は、複数の前記第2の溝よりも深く、
前記複数の第2の溝は、前記境界から離れるにしたがって浅くなっていること、
を特徴とする請求項3に記載の回路基板。 - 前記本体を構成している前記複数の絶縁体層は、全て可撓性を有していること、
を特徴とする請求項1ないし請求項4のいずれかに記載の回路基板。 - 積層方向から平面視したときに、前記第1の領域において前記導体が占める面積の割合は、前記第2の領域において前記導体が占める面積の割合よりも大きいこと、
を特徴とする請求項1ないし請求項5のいずれかに記載の回路基板。
Priority Applications (3)
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CN201080045003.7A CN102577647B (zh) | 2009-10-05 | 2010-10-05 | 电路基板 |
JP2011535394A JP5360223B2 (ja) | 2009-10-05 | 2010-10-05 | 回路基板 |
US13/437,033 US8975527B2 (en) | 2009-10-05 | 2012-04-02 | Circuit board |
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JP2009231425 | 2009-10-05 | ||
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US13/437,033 Continuation US8975527B2 (en) | 2009-10-05 | 2012-04-02 | Circuit board |
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WO2011043318A1 true WO2011043318A1 (ja) | 2011-04-14 |
Family
ID=43856771
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JP6439636B2 (ja) * | 2015-09-10 | 2018-12-19 | 株式会社デンソー | プリント基板の製造方法 |
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CN106332446B (zh) * | 2016-11-02 | 2019-02-15 | 江苏弘信华印电路科技有限公司 | 耐高挠折的刚挠结合板 |
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US20120186860A1 (en) | 2012-07-26 |
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CN102577647A (zh) | 2012-07-11 |
JP5360223B2 (ja) | 2013-12-04 |
US8975527B2 (en) | 2015-03-10 |
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