DE602005003475D1 - Strahlungsempfindliche silikonharzzusammensetzung - Google Patents

Strahlungsempfindliche silikonharzzusammensetzung

Info

Publication number
DE602005003475D1
DE602005003475D1 DE602005003475T DE602005003475T DE602005003475D1 DE 602005003475 D1 DE602005003475 D1 DE 602005003475D1 DE 602005003475 T DE602005003475 T DE 602005003475T DE 602005003475 T DE602005003475 T DE 602005003475T DE 602005003475 D1 DE602005003475 D1 DE 602005003475D1
Authority
DE
Germany
Prior art keywords
resin composition
silicone resin
radiation sensitive
sensitive silicone
radiation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005003475T
Other languages
English (en)
Other versions
DE602005003475T2 (de
Inventor
John Dean Albaugh
Gregory Scott Becker
Sina Maghsoodi
Eric Scott Moyer
Sheng Wang
Craig Rollin Yeakle
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Silicones Corp
Original Assignee
Dow Corning Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Corp filed Critical Dow Corning Corp
Publication of DE602005003475D1 publication Critical patent/DE602005003475D1/de
Application granted granted Critical
Publication of DE602005003475T2 publication Critical patent/DE602005003475T2/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Silicon Polymers (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Paints Or Removers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymerisation Methods In General (AREA)
  • Materials For Photolithography (AREA)
DE602005003475T 2004-07-16 2005-06-03 Strahlungsempfindliche silikonharzzusammensetzung Active DE602005003475T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US58844004P 2004-07-16 2004-07-16
US588440P 2004-07-16
PCT/US2005/019575 WO2006019468A1 (en) 2004-07-16 2005-06-03 Radiation sensitive silicone resin composition

Publications (2)

Publication Number Publication Date
DE602005003475D1 true DE602005003475D1 (de) 2008-01-03
DE602005003475T2 DE602005003475T2 (de) 2008-09-25

Family

ID=35427437

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005003475T Active DE602005003475T2 (de) 2004-07-16 2005-06-03 Strahlungsempfindliche silikonharzzusammensetzung

Country Status (8)

Country Link
US (1) US8377634B2 (de)
EP (1) EP1769018B1 (de)
JP (1) JP5264170B2 (de)
KR (1) KR101275635B1 (de)
CN (1) CN1968992B (de)
DE (1) DE602005003475T2 (de)
TW (1) TWI370149B (de)
WO (1) WO2006019468A1 (de)

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TWI434891B (zh) * 2007-02-22 2014-04-21 Silecs Oy 積體電路用高矽含量矽氧烷聚合物
US20090029053A1 (en) * 2007-07-25 2009-01-29 United Solar Ovonic Llc Method for stabilizing silicone material, stabilized silicone material, and devices incorporating that material
JP5258788B2 (ja) * 2007-11-30 2013-08-07 昭和電工株式会社 転写材料用硬化性組成物および該組成物を用いた微細パターン形成方法
JP5587791B2 (ja) * 2008-01-08 2014-09-10 東レ・ダウコーニング株式会社 シルセスキオキサン樹脂
US9023433B2 (en) 2008-01-15 2015-05-05 Dow Corning Corporation Silsesquioxane resins and method of using them to form an antireflective coating
KR101475780B1 (ko) * 2008-02-13 2014-12-23 주식회사 동진쎄미켐 보호막으로서 유용한 유-무기 복합체 수지 조성물
JP2009229708A (ja) * 2008-03-21 2009-10-08 Jsr Corp レジスト下層膜用組成物及びその製造方法
JP2009237363A (ja) * 2008-03-27 2009-10-15 Jsr Corp レジスト下層膜用組成物及びその製造方法
EP2373722A4 (de) 2008-12-10 2013-01-23 Dow Corning Silsesquioxanharze
TWI552123B (zh) * 2009-01-28 2016-10-01 半導體能源研究所股份有限公司 顯示裝置
US8557877B2 (en) 2009-06-10 2013-10-15 Honeywell International Inc. Anti-reflective coatings for optically transparent substrates
SG177240A1 (en) 2009-07-23 2012-02-28 Dow Corning Method and materials for reverse patterning
JP2013512994A (ja) * 2009-12-04 2013-04-18 ダウ コーニング コーポレーション シルセスキオキサン樹脂の安定化
GB201000120D0 (en) 2010-01-06 2010-02-17 Dow Corning Process for forming crosslinked and branched polymers
GB201000117D0 (en) 2010-01-06 2010-02-17 Dow Corning Organopolysiloxanes containing an unsaturated group
GB201000136D0 (en) 2010-01-06 2010-02-24 Dow Corning Diene elastomers modified by silicones
GB201000116D0 (en) 2010-01-06 2010-02-17 Dow Corning Polyolefins modified by silicones
GB201000121D0 (en) 2010-01-06 2010-02-17 Dow Corning Modified polyolefins
CN102040619B (zh) * 2010-11-19 2013-09-04 明基材料有限公司 光活性乙烯基氟基硅氧化物的寡聚物及含其的抗反射涂料组合物
KR101957746B1 (ko) * 2011-03-29 2019-03-15 다우 실리콘즈 코포레이션 디바이스 제조에 사용하기 위한 광-패턴화가능하고 현상가능한 실세스퀴옥산 수지
US8864898B2 (en) 2011-05-31 2014-10-21 Honeywell International Inc. Coating formulations for optical elements
CN102993440B (zh) * 2011-09-16 2014-08-13 北京化工大学 光固化纳米杂化材料及其合成方法和用途
JP5900253B2 (ja) * 2011-09-29 2016-04-06 信越化学工業株式会社 （メタ）アクリル変性オルガノポリシロキサン、放射線硬化性シリコーン組成物及びシリコーン剥離紙並びにそれらの製造方法
CN102595771B (zh) * 2012-01-11 2015-07-01 深圳创维数字技术有限公司 一种具有保护层的纸基印刷电路板及其制备方法
TWI567497B (zh) * 2012-04-06 2017-01-21 Ａｚ電子材料盧森堡有限公司 負型感光性矽氧烷組成物
US10544329B2 (en) 2015-04-13 2020-01-28 Honeywell International Inc. Polysiloxane formulations and coatings for optoelectronic applications
JP6989532B2 (ja) * 2016-06-16 2022-01-05 ダウ シリコーンズ コーポレーション ケイ素豊富なシルセスキオキサン樹脂
KR20180125880A (ko) * 2017-05-16 2018-11-26 모멘티브퍼포먼스머티리얼스코리아 주식회사 광학 투명 레진 및 이를 이용하여 형성된 전자 소자
JP2023524667A (ja) 2020-05-07 2023-06-13 ダウ シリコーンズ コーポレーション シリコーンハイブリッド感圧接着剤、及びその調製方法、及び（光）電子デバイスを製作するための保護フィルムにおける使用
US20240141210A1 (en) 2020-05-07 2024-05-02 Dow Silicones Corporation Silicone hybrid pressure sensitive adhesive and methods for its preparation and use on uneven surfaces
US20230227700A1 (en) 2020-09-22 2023-07-20 Dow Silicones Corporation Curable silicone-(meth)acrylate composition and methods for its preparation and use

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JPS56151731A (en) * 1980-04-25 1981-11-24 Japan Synthetic Rubber Co Ltd Preparation of silicone resin
US4455205A (en) 1981-06-01 1984-06-19 General Electric Company UV Curable polysiloxane from colloidal silica, methacryloyl silane, diacrylate, resorcinol monobenzoate and photoinitiator
JPS5888741A (ja) * 1981-11-20 1983-05-26 Hitachi Chem Co Ltd 感光性樹脂組成物及び感光性樹脂組成物積層体
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JP2904317B2 (ja) * 1991-10-11 1999-06-14 信越化学工業株式会社 オルガノポリシロキサン樹脂の製造方法
FR2692274A1 (fr) * 1992-06-10 1993-12-17 Du Pont Nouvelle laque à base de silicium, son emploi en tant que revêtement de substrat et les substrats ainsi obtenus.
US5683501A (en) * 1993-11-09 1997-11-04 Nippon Shokubai Co., Ltd. Compound fine particles and composition for forming film
JP3347936B2 (ja) * 1995-03-16 2002-11-20 信越化学工業株式会社 光硬化性オルガノポリシロキサン組成物
US5738976A (en) 1995-03-16 1998-04-14 Shin-Etsu Chemical Co., Ltd. Photo-curable organopolysiloxane composition and a method for producing a (meth) acryloyloxyl group-containing organopolysiloxane used therein
WO1999009457A1 (fr) * 1997-08-14 1999-02-25 Showa Denko K.K. Resine de reserve sa composition et procede de creation de motifs l'utilisant
KR100551653B1 (ko) * 1997-08-18 2006-05-25 제이에스알 가부시끼가이샤 감방사선성수지조성물
CN1341224A (zh) * 1999-02-05 2002-03-20 康宁股份有限公司 带有形状的光学元件的光纤组件及其制造方法
EP1208105B1 (de) * 1999-08-04 2006-10-04 Hybrid Plastics Verfahren zur herstellung polyhedrischer oligomerer silsesquioxane
US20020051932A1 (en) * 2000-05-31 2002-05-02 Shipley Company, L.L.C. Photoresists for imaging with high energy radiation
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JP3952149B2 (ja) * 2002-02-06 2007-08-01 信越化学工業株式会社 光導波路形成用材料及び光導波路の製造方法
JP4256756B2 (ja) * 2002-09-30 2009-04-22 新日鐵化学株式会社 官能基を有するかご型シルセスキオキサン樹脂の製造方法

Also Published As

Publication number Publication date
EP1769018A1 (de) 2007-04-04
CN1968992B (zh) 2010-12-22
DE602005003475T2 (de) 2008-09-25
KR20070032333A (ko) 2007-03-21
JP5264170B2 (ja) 2013-08-14
US8377634B2 (en) 2013-02-19
TWI370149B (en) 2012-08-11
KR101275635B1 (ko) 2013-06-14
WO2006019468A1 (en) 2006-02-23
CN1968992A (zh) 2007-05-23
EP1769018B1 (de) 2007-11-21
TW200611923A (en) 2006-04-16
US20090004606A1 (en) 2009-01-01
JP2008506811A (ja) 2008-03-06

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