TWI370149B - Radiation sensitive silicone resin composition - Google Patents
Radiation sensitive silicone resin compositionInfo
- Publication number
- TWI370149B TWI370149B TW094119695A TW94119695A TWI370149B TW I370149 B TWI370149 B TW I370149B TW 094119695 A TW094119695 A TW 094119695A TW 94119695 A TW94119695 A TW 94119695A TW I370149 B TWI370149 B TW I370149B
- Authority
- TW
- Taiwan
- Prior art keywords
- resin composition
- silicone resin
- radiation sensitive
- sensitive silicone
- radiation
- Prior art date
Links
- 230000005855 radiation Effects 0.000 title 1
- 239000011342 resin composition Substances 0.000 title 1
- 229920002050 silicone resin Polymers 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0025—Crosslinking or vulcanising agents; including accelerators
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
- C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Silicon Polymers (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Paints Or Removers (AREA)
- Materials For Photolithography (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polymerisation Methods In General (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US58844004P | 2004-07-16 | 2004-07-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200611923A TW200611923A (en) | 2006-04-16 |
TWI370149B true TWI370149B (en) | 2012-08-11 |
Family
ID=35427437
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094119695A TWI370149B (en) | 2004-07-16 | 2005-06-14 | Radiation sensitive silicone resin composition |
Country Status (8)
Country | Link |
---|---|
US (1) | US8377634B2 (zh) |
EP (1) | EP1769018B1 (zh) |
JP (1) | JP5264170B2 (zh) |
KR (1) | KR101275635B1 (zh) |
CN (1) | CN1968992B (zh) |
DE (1) | DE602005003475T2 (zh) |
TW (1) | TWI370149B (zh) |
WO (1) | WO2006019468A1 (zh) |
Families Citing this family (32)
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CA2575238C (en) | 2004-08-11 | 2015-04-21 | Dow Corning Corporation | Photopolymerizable silicone materials forming semipermeable membranes for sensor applications |
TWI434891B (zh) * | 2007-02-22 | 2014-04-21 | Silecs Oy | 積體電路用高矽含量矽氧烷聚合物 |
US20090029053A1 (en) * | 2007-07-25 | 2009-01-29 | United Solar Ovonic Llc | Method for stabilizing silicone material, stabilized silicone material, and devices incorporating that material |
US20110129689A2 (en) * | 2007-11-30 | 2011-06-02 | Showa Denko K.K. | Curable composition for transfer materials and method for forming micropattern using the curable composition |
WO2009088600A1 (en) * | 2008-01-08 | 2009-07-16 | Dow Corning Toray Co., Ltd. | Silsesquioxane resins |
US9023433B2 (en) | 2008-01-15 | 2015-05-05 | Dow Corning Corporation | Silsesquioxane resins and method of using them to form an antireflective coating |
KR101475780B1 (ko) * | 2008-02-13 | 2014-12-23 | 주식회사 동진쎄미켐 | 보호막으로서 유용한 유-무기 복합체 수지 조성물 |
JP2009229708A (ja) * | 2008-03-21 | 2009-10-08 | Jsr Corp | レジスト下層膜用組成物及びその製造方法 |
JP2009237363A (ja) * | 2008-03-27 | 2009-10-15 | Jsr Corp | レジスト下層膜用組成物及びその製造方法 |
EP2373722A4 (en) | 2008-12-10 | 2013-01-23 | Dow Corning | SILSESQUIOXAN RESINS |
TWI631538B (zh) * | 2009-01-28 | 2018-08-01 | 日商半導體能源研究所股份有限公司 | 顯示裝置 |
US8557877B2 (en) | 2009-06-10 | 2013-10-15 | Honeywell International Inc. | Anti-reflective coatings for optically transparent substrates |
SG177240A1 (en) | 2009-07-23 | 2012-02-28 | Dow Corning | Method and materials for reverse patterning |
US8648125B2 (en) | 2009-12-04 | 2014-02-11 | Dow Corning Corporation | Stabilization of silsesquioxane resins |
GB201000117D0 (en) | 2010-01-06 | 2010-02-17 | Dow Corning | Organopolysiloxanes containing an unsaturated group |
GB201000121D0 (en) | 2010-01-06 | 2010-02-17 | Dow Corning | Modified polyolefins |
GB201000120D0 (en) | 2010-01-06 | 2010-02-17 | Dow Corning | Process for forming crosslinked and branched polymers |
GB201000136D0 (en) | 2010-01-06 | 2010-02-24 | Dow Corning | Diene elastomers modified by silicones |
GB201000116D0 (en) | 2010-01-06 | 2010-02-17 | Dow Corning | Polyolefins modified by silicones |
CN102040619B (zh) * | 2010-11-19 | 2013-09-04 | 明基材料有限公司 | 光活性乙烯基氟基硅氧化物的寡聚物及含其的抗反射涂料组合物 |
CN103460135B (zh) * | 2011-03-29 | 2017-03-01 | 道康宁公司 | 用于设备制造的可曝光成像和可显影的倍半硅氧烷树脂 |
US8864898B2 (en) | 2011-05-31 | 2014-10-21 | Honeywell International Inc. | Coating formulations for optical elements |
CN102993440B (zh) * | 2011-09-16 | 2014-08-13 | 北京化工大学 | 光固化纳米杂化材料及其合成方法和用途 |
JP5900253B2 (ja) * | 2011-09-29 | 2016-04-06 | 信越化学工業株式会社 | (メタ)アクリル変性オルガノポリシロキサン、放射線硬化性シリコーン組成物及びシリコーン剥離紙並びにそれらの製造方法 |
CN102595771B (zh) * | 2012-01-11 | 2015-07-01 | 深圳创维数字技术有限公司 | 一种具有保护层的纸基印刷电路板及其制备方法 |
TWI567497B (zh) * | 2012-04-06 | 2017-01-21 | Az電子材料盧森堡有限公司 | 負型感光性矽氧烷組成物 |
US10544329B2 (en) | 2015-04-13 | 2020-01-28 | Honeywell International Inc. | Polysiloxane formulations and coatings for optoelectronic applications |
KR102395936B1 (ko) * | 2016-06-16 | 2022-05-11 | 다우 실리콘즈 코포레이션 | 규소-풍부 실세스퀴옥산 수지 |
CN110621724A (zh) * | 2017-05-16 | 2019-12-27 | 莫门蒂夫性能材料韩国株式会社 | 光学透明树脂和使用其形成的电子元件 |
JP2023524667A (ja) | 2020-05-07 | 2023-06-13 | ダウ シリコーンズ コーポレーション | シリコーンハイブリッド感圧接着剤、及びその調製方法、及び(光)電子デバイスを製作するための保護フィルムにおける使用 |
CN115485350A (zh) | 2020-05-07 | 2022-12-16 | 美国陶氏有机硅公司 | 有机硅混合压敏粘合剂及其制备方法和在不均匀表面上的用途 |
EP4217435A1 (en) | 2020-09-22 | 2023-08-02 | Dow Silicones Corporation | Curable silicone-(meth)acrylate composition and methods for its preparation and use |
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JPS56151731A (en) | 1980-04-25 | 1981-11-24 | Japan Synthetic Rubber Co Ltd | Preparation of silicone resin |
US4455205A (en) * | 1981-06-01 | 1984-06-19 | General Electric Company | UV Curable polysiloxane from colloidal silica, methacryloyl silane, diacrylate, resorcinol monobenzoate and photoinitiator |
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DE3760030D1 (en) * | 1986-02-07 | 1989-02-02 | Nippon Telegraph & Telephone | Photosensitive and high energy beam sensitive resin composition containing substituted polysiloxane |
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JP2904317B2 (ja) | 1991-10-11 | 1999-06-14 | 信越化学工業株式会社 | オルガノポリシロキサン樹脂の製造方法 |
FR2692274A1 (fr) * | 1992-06-10 | 1993-12-17 | Du Pont | Nouvelle laque à base de silicium, son emploi en tant que revêtement de substrat et les substrats ainsi obtenus. |
US5683501A (en) * | 1993-11-09 | 1997-11-04 | Nippon Shokubai Co., Ltd. | Compound fine particles and composition for forming film |
US5738976A (en) * | 1995-03-16 | 1998-04-14 | Shin-Etsu Chemical Co., Ltd. | Photo-curable organopolysiloxane composition and a method for producing a (meth) acryloyloxyl group-containing organopolysiloxane used therein |
JP3347936B2 (ja) * | 1995-03-16 | 2002-11-20 | 信越化学工業株式会社 | 光硬化性オルガノポリシロキサン組成物 |
EP1004936B1 (en) | 1997-08-14 | 2003-10-08 | Showa Denko K K | Resist resin, resist resin composition, and process for patterning therewith |
KR100551653B1 (ko) * | 1997-08-18 | 2006-05-25 | 제이에스알 가부시끼가이샤 | 감방사선성수지조성물 |
CA2361817A1 (en) | 1999-02-05 | 2000-08-10 | Steven B. Dawes | Optical fiber component with shaped optical element and method of making same |
AU6524400A (en) * | 1999-08-04 | 2001-03-05 | Hybrid Plastics | Process for the formation of polyhedral oligomeric silsesquioxanes |
US20020051932A1 (en) * | 2000-05-31 | 2002-05-02 | Shipley Company, L.L.C. | Photoresists for imaging with high energy radiation |
KR100343938B1 (en) * | 2000-11-29 | 2002-07-20 | Samsung Electronics Co Ltd | Preparation method of interlayer insulation membrane of semiconductor |
US6623711B2 (en) * | 2001-03-27 | 2003-09-23 | Samsung Electronics Co., Ltd. | Siloxane-based resin and method for forming insulating film between interconnect layers in semiconductor devices by using the same |
US6743563B2 (en) * | 2001-08-15 | 2004-06-01 | Shipley Company, L.L.C. | Photoresist compositions |
JP3952149B2 (ja) * | 2002-02-06 | 2007-08-01 | 信越化学工業株式会社 | 光導波路形成用材料及び光導波路の製造方法 |
JP4256756B2 (ja) * | 2002-09-30 | 2009-04-22 | 新日鐵化学株式会社 | 官能基を有するかご型シルセスキオキサン樹脂の製造方法 |
-
2005
- 2005-06-03 US US11/579,347 patent/US8377634B2/en active Active
- 2005-06-03 WO PCT/US2005/019575 patent/WO2006019468A1/en active Application Filing
- 2005-06-03 JP JP2007521470A patent/JP5264170B2/ja active Active
- 2005-06-03 EP EP05773125A patent/EP1769018B1/en active Active
- 2005-06-03 CN CN2005800195846A patent/CN1968992B/zh active Active
- 2005-06-03 KR KR1020077001110A patent/KR101275635B1/ko active IP Right Grant
- 2005-06-03 DE DE602005003475T patent/DE602005003475T2/de active Active
- 2005-06-14 TW TW094119695A patent/TWI370149B/zh active
Also Published As
Publication number | Publication date |
---|---|
JP5264170B2 (ja) | 2013-08-14 |
EP1769018B1 (en) | 2007-11-21 |
DE602005003475T2 (de) | 2008-09-25 |
JP2008506811A (ja) | 2008-03-06 |
WO2006019468A1 (en) | 2006-02-23 |
US20090004606A1 (en) | 2009-01-01 |
KR20070032333A (ko) | 2007-03-21 |
CN1968992A (zh) | 2007-05-23 |
TW200611923A (en) | 2006-04-16 |
EP1769018A1 (en) | 2007-04-04 |
CN1968992B (zh) | 2010-12-22 |
DE602005003475D1 (de) | 2008-01-03 |
KR101275635B1 (ko) | 2013-06-14 |
US8377634B2 (en) | 2013-02-19 |
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