DE602006009435D1 - Wärmeleitende Silikonzusammensetzung - Google Patents

Wärmeleitende Silikonzusammensetzung

Info

Publication number
DE602006009435D1
DE602006009435D1 DE602006009435T DE602006009435T DE602006009435D1 DE 602006009435 D1 DE602006009435 D1 DE 602006009435D1 DE 602006009435 T DE602006009435 T DE 602006009435T DE 602006009435 T DE602006009435 T DE 602006009435T DE 602006009435 D1 DE602006009435 D1 DE 602006009435D1
Authority
DE
Germany
Prior art keywords
thermally conductive
silicone composition
conductive silicone
composition
thermally
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006009435T
Other languages
English (en)
Inventor
Toshiyuki Ozai
Naoki Yamakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Publication of DE602006009435D1 publication Critical patent/DE602006009435D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE602006009435T 2005-05-25 2006-05-19 Wärmeleitende Silikonzusammensetzung Active DE602006009435D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005151799A JP2006328164A (ja) 2005-05-25 2005-05-25 熱伝導性シリコーン組成物

Publications (1)

Publication Number Publication Date
DE602006009435D1 true DE602006009435D1 (de) 2009-11-12

Family

ID=36954734

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006009435T Active DE602006009435D1 (de) 2005-05-25 2006-05-19 Wärmeleitende Silikonzusammensetzung

Country Status (6)

Country Link
US (1) US7737212B2 (de)
EP (1) EP1726622B1 (de)
JP (1) JP2006328164A (de)
KR (1) KR101235385B1 (de)
CN (1) CN1869125B (de)
DE (1) DE602006009435D1 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4993611B2 (ja) 2006-01-26 2012-08-08 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 放熱材及びそれを用いた半導体装置
KR100729412B1 (ko) * 2006-03-15 2007-06-15 대일소재(주) 자기점착형 열전도성 젤 조성물 및 그 성형체
JP4563977B2 (ja) * 2006-09-22 2010-10-20 信越化学工業株式会社 加熱硬化型シリコーン組成物及びそれを用いた発光ダイオード素子
JP4993135B2 (ja) * 2008-07-08 2012-08-08 信越化学工業株式会社 熱伝導性シリコーン組成物
JP5606104B2 (ja) * 2009-03-23 2014-10-15 株式会社アドマテックス 紫外線反射組成物及び紫外線反射成形品
JP5471868B2 (ja) * 2009-06-29 2014-04-16 信越化学工業株式会社 熱伝導性シリコーンゴム複合シート
JP5553006B2 (ja) * 2010-11-12 2014-07-16 信越化学工業株式会社 熱伝導性シリコーングリース組成物
CN102807755A (zh) * 2011-05-31 2012-12-05 北京中石伟业技术有限公司 导热流体材料、其制备方法及应用
CN102807754A (zh) * 2011-05-31 2012-12-05 北京中石伟业技术有限公司 导热填隙材料、其制备方法及应用
JP5664563B2 (ja) * 2012-01-23 2015-02-04 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
CN103827277B (zh) 2012-05-11 2016-07-06 信越化学工业株式会社 导热性硅脂组合物
CN103333494B (zh) * 2013-05-28 2015-08-05 东莞上海大学纳米技术研究院 一种导热绝缘硅橡胶热界面材料及其制备方法
DE102013217221A1 (de) * 2013-08-28 2015-03-05 Wacker Chemie Ag Vernetzbare Massen auf der Basis von Organosiliciumverbindungen und daraus hergestellte Formkörper
KR102348372B1 (ko) * 2014-04-09 2022-01-11 듀폰 도레이 스페셜티 머티리얼즈 가부시키가이샤 열전도성 실리콘 조성물 및 전기·전자 기기
JP6257436B2 (ja) * 2014-04-25 2018-01-10 住友理工株式会社 シリコーンゴム組成物およびシリコーンゴム架橋体
DE102014209670A1 (de) * 2014-05-21 2015-11-26 Wacker Chemie Ag Verfahren zum Betrieb einer Anlage mit Siloxan-Hochtemperaturflüssigkeit
CN109477673B (zh) * 2016-06-27 2021-07-06 联合工艺公司 电热传热系统
JP6654593B2 (ja) * 2017-03-15 2020-02-26 信越化学工業株式会社 ダイボンディング用シリコーン樹脂組成物及び硬化物
JP2019077843A (ja) * 2017-10-27 2019-05-23 信越化学工業株式会社 熱伝導性シリコーンポッティング組成物およびその硬化物
FI3868835T3 (fi) * 2018-10-15 2024-01-31 Denka Company Ltd Kaksipakkauksinen kovettuva koostumussarja, lämpöä johtava kovettunut tuote ja elektroninen laite
CN109627776A (zh) * 2018-11-14 2019-04-16 深圳市飞荣达科技股份有限公司 导热有机硅组合物及其固化制成的固化物
US20220049100A1 (en) * 2018-12-27 2022-02-17 Dow Toray Co., Ltd. Curable silicone composition for transfer molding, cured product thereof, and production method thereof
US20220220259A1 (en) * 2019-05-06 2022-07-14 Wacker Chemie Ag Polyorganosiloxane and thermally conductive silicone composition thereof
CN112646541A (zh) * 2020-12-18 2021-04-13 惠州市佳的利实业有限公司 双固化体系有机硅组合物及其制备方法
CN113897063A (zh) * 2021-09-26 2022-01-07 佛山市南海大田化学有限公司 一种可固化的单组份导热凝胶及其制备方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3138900A1 (de) * 1981-09-30 1983-04-14 Siemens AG, 1000 Berlin und 8000 München Direktgeheizte kathode mit heizungsregelung in elektronenstrahlgeraeten und verfahren zu ihrem betrieb
JP2704732B2 (ja) 1988-08-01 1998-01-26 東レ・ダウコーニング・シリコーン株式会社 硬化性液状オルガノポリシロキサン組成物
US4898910A (en) * 1988-09-26 1990-02-06 Dow Corning Corporation Modulus control in silicone sealant
TW334469B (en) * 1995-08-04 1998-06-21 Doconitele Silicon Kk Curable organosiloxane compositions and semiconductor devices
JP4015722B2 (ja) * 1997-06-20 2007-11-28 東レ・ダウコーニング株式会社 熱伝導性ポリマー組成物
JP3543663B2 (ja) 1999-03-11 2004-07-14 信越化学工業株式会社 熱伝導性シリコーンゴム組成物及びその製造方法
JP4727017B2 (ja) 1999-11-15 2011-07-20 東レ・ダウコーニング株式会社 熱伝導性シリコーンゴム組成物
US7329706B2 (en) 2001-05-14 2008-02-12 Dow Corning Toray Silicone Co., Ltd. Heat-conductive silicone composition
JP4588285B2 (ja) * 2002-01-25 2010-11-24 信越化学工業株式会社 熱伝導性シリコーンゴム組成物
JP2004352947A (ja) 2003-05-30 2004-12-16 Shin Etsu Chem Co Ltd 室温硬化型熱伝導性シリコーンゴム組成物

Also Published As

Publication number Publication date
US20060270788A1 (en) 2006-11-30
CN1869125A (zh) 2006-11-29
KR20060121740A (ko) 2006-11-29
EP1726622B1 (de) 2009-09-30
CN1869125B (zh) 2011-01-26
EP1726622A1 (de) 2006-11-29
US7737212B2 (en) 2010-06-15
KR101235385B1 (ko) 2013-02-20
JP2006328164A (ja) 2006-12-07

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