DE602005000365T2 - Verfahren zur Verbesserung der Kohäsion bei erhöhter Temperatur mittels Mehrphasenklebern - Google Patents
Verfahren zur Verbesserung der Kohäsion bei erhöhter Temperatur mittels Mehrphasenklebern Download PDFInfo
- Publication number
- DE602005000365T2 DE602005000365T2 DE602005000365T DE602005000365T DE602005000365T2 DE 602005000365 T2 DE602005000365 T2 DE 602005000365T2 DE 602005000365 T DE602005000365 T DE 602005000365T DE 602005000365 T DE602005000365 T DE 602005000365T DE 602005000365 T2 DE602005000365 T2 DE 602005000365T2
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- Germany
- Prior art keywords
- resin
- acrylate
- poly
- resins
- butadiene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000853 adhesive Substances 0.000 title claims description 19
- 230000001070 adhesive effect Effects 0.000 title claims description 19
- 238000000034 method Methods 0.000 title claims description 16
- 229920005989 resin Polymers 0.000 claims description 48
- 239000011347 resin Substances 0.000 claims description 48
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 claims description 34
- 239000000203 mixture Substances 0.000 claims description 26
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate group Chemical group C(C=C)(=O)[O-] NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 23
- 229920003192 poly(bis maleimide) Polymers 0.000 claims description 22
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims description 21
- 239000003999 initiator Substances 0.000 claims description 10
- 125000003118 aryl group Chemical group 0.000 claims description 9
- 239000000945 filler Substances 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 9
- 239000004643 cyanate ester Substances 0.000 claims description 8
- 238000009472 formulation Methods 0.000 claims description 8
- 239000000843 powder Substances 0.000 claims description 7
- IAXXETNIOYFMLW-COPLHBTASA-N [(1s,3s,4s)-4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl] 2-methylprop-2-enoate Chemical compound C1C[C@]2(C)[C@@H](OC(=O)C(=C)C)C[C@H]1C2(C)C IAXXETNIOYFMLW-COPLHBTASA-N 0.000 claims description 5
- 229940119545 isobornyl methacrylate Drugs 0.000 claims description 5
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 claims description 4
- 125000004432 carbon atom Chemical group C* 0.000 claims description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-M methacrylate group Chemical group C(C(=C)C)(=O)[O-] CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims description 3
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 claims description 2
- 125000004122 cyclic group Chemical group 0.000 claims description 2
- GMSCBRSQMRDRCD-UHFFFAOYSA-N dodecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCOC(=O)C(C)=C GMSCBRSQMRDRCD-UHFFFAOYSA-N 0.000 claims description 2
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 claims description 2
- 239000004925 Acrylic resin Substances 0.000 claims 2
- 239000000463 material Substances 0.000 description 12
- 239000000126 substance Substances 0.000 description 11
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 10
- 150000002430 hydrocarbons Chemical class 0.000 description 10
- 239000007787 solid Substances 0.000 description 10
- 239000000758 substrate Substances 0.000 description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- 229930195733 hydrocarbon Natural products 0.000 description 8
- -1 2-ethylhexyl Chemical group 0.000 description 7
- 239000003292 glue Substances 0.000 description 7
- 229920000728 polyester Polymers 0.000 description 7
- 150000003254 radicals Chemical class 0.000 description 7
- 125000001931 aliphatic group Chemical group 0.000 description 5
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 5
- 229920000570 polyether Polymers 0.000 description 5
- 229920002635 polyurethane Polymers 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- KXDHJXZQYSOELW-UHFFFAOYSA-M Carbamate Chemical compound NC([O-])=O KXDHJXZQYSOELW-UHFFFAOYSA-M 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 4
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 4
- 150000001408 amides Chemical class 0.000 description 4
- 239000004202 carbamide Substances 0.000 description 4
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 4
- 125000002091 cationic group Chemical group 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 229920002857 polybutadiene Polymers 0.000 description 4
- 229930185605 Bisphenol Natural products 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 239000005062 Polybutadiene Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 229920002472 Starch Polymers 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 230000000977 initiatory effect Effects 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000010926 purge Methods 0.000 description 3
- 229920002050 silicone resin Polymers 0.000 description 3
- 239000008107 starch Substances 0.000 description 3
- 235000019698 starch Nutrition 0.000 description 3
- 150000003923 2,5-pyrrolediones Chemical class 0.000 description 2
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 101100410148 Pinus taeda PT30 gene Proteins 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- 239000002318 adhesion promoter Substances 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000011231 conductive filler Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 239000003431 cross linking reagent Substances 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 150000002118 epoxides Chemical class 0.000 description 2
- JZMPIUODFXBXSC-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.CCOC(N)=O JZMPIUODFXBXSC-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229960000834 vinyl ether Drugs 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- IKACIMDLIGCJET-UHFFFAOYSA-N 1,1,1,3,3,3-hexafluoropropane (4-hydroxyphenyl) cyanate Chemical compound FC(CC(F)(F)F)(F)F.O(C#N)C1=CC=C(C=C1)O IKACIMDLIGCJET-UHFFFAOYSA-N 0.000 description 1
- MIZLGWKEZAPEFJ-UHFFFAOYSA-N 1,1,2-trifluoroethene Chemical group FC=C(F)F MIZLGWKEZAPEFJ-UHFFFAOYSA-N 0.000 description 1
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 description 1
- GPHWXFINOWXMDN-UHFFFAOYSA-N 1,1-bis(ethenoxy)hexane Chemical compound CCCCCC(OC=C)OC=C GPHWXFINOWXMDN-UHFFFAOYSA-N 0.000 description 1
- SKYXLDSRLNRAPS-UHFFFAOYSA-N 1,2,4-trifluoro-5-methoxybenzene Chemical compound COC1=CC(F)=C(F)C=C1F SKYXLDSRLNRAPS-UHFFFAOYSA-N 0.000 description 1
- MWZJGRDWJVHRDV-UHFFFAOYSA-N 1,4-bis(ethenoxy)butane Chemical compound C=COCCCCOC=C MWZJGRDWJVHRDV-UHFFFAOYSA-N 0.000 description 1
- ALVZNPYWJMLXKV-UHFFFAOYSA-N 1,9-Nonanediol Chemical compound OCCCCCCCCCO ALVZNPYWJMLXKV-UHFFFAOYSA-N 0.000 description 1
- RQJCIXUNHZZFMB-UHFFFAOYSA-N 1-ethenoxy-2-(2-ethenoxypropoxy)propane Chemical compound C=COCC(C)OCC(C)OC=C RQJCIXUNHZZFMB-UHFFFAOYSA-N 0.000 description 1
- LAYAKLSFVAPMEL-UHFFFAOYSA-N 1-ethenoxydodecane Chemical compound CCCCCCCCCCCCOC=C LAYAKLSFVAPMEL-UHFFFAOYSA-N 0.000 description 1
- QJJDJWUCRAPCOL-UHFFFAOYSA-N 1-ethenoxyoctadecane Chemical compound CCCCCCCCCCCCCCCCCCOC=C QJJDJWUCRAPCOL-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- AVTLBBWTUPQRAY-UHFFFAOYSA-N 2-(2-cyanobutan-2-yldiazenyl)-2-methylbutanenitrile Chemical compound CCC(C)(C#N)N=NC(C)(CC)C#N AVTLBBWTUPQRAY-UHFFFAOYSA-N 0.000 description 1
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- QIRNGVVZBINFMX-UHFFFAOYSA-N 2-allylphenol Chemical compound OC1=CC=CC=C1CC=C QIRNGVVZBINFMX-UHFFFAOYSA-N 0.000 description 1
- FEWFXBUNENSNBQ-UHFFFAOYSA-N 2-hydroxyacrylic acid Chemical compound OC(=C)C(O)=O FEWFXBUNENSNBQ-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- VMKYTRPNOVFCGZ-UHFFFAOYSA-N 2-sulfanylphenol Chemical compound OC1=CC=CC=C1S VMKYTRPNOVFCGZ-UHFFFAOYSA-N 0.000 description 1
- DSSAWHFZNWVJEC-UHFFFAOYSA-N 3-(ethenoxymethyl)heptane Chemical compound CCCCC(CC)COC=C DSSAWHFZNWVJEC-UHFFFAOYSA-N 0.000 description 1
- WOCGGVRGNIEDSZ-UHFFFAOYSA-N 4-[2-(4-hydroxy-3-prop-2-enylphenyl)propan-2-yl]-2-prop-2-enylphenol Chemical compound C=1C=C(O)C(CC=C)=CC=1C(C)(C)C1=CC=C(O)C(CC=C)=C1 WOCGGVRGNIEDSZ-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 229920003319 Araldite® Polymers 0.000 description 1
- 0 C*(C)(C(CCCCCN(C(C=C1)=O)C1=O)=O)OC(CCCCN(C(C=C1)=O)*1=O)=O Chemical compound C*(C)(C(CCCCCN(C(C=C1)=O)C1=O)=O)OC(CCCCN(C(C=C1)=O)*1=O)=O 0.000 description 1
- SKMJEIUOKAZCQN-UHFFFAOYSA-N COC(C=C1)=CC=C1O.N#CO Chemical compound COC(C=C1)=CC=C1O.N#CO SKMJEIUOKAZCQN-UHFFFAOYSA-N 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical group NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 description 1
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- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 229920013646 Hycar Polymers 0.000 description 1
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- 229920000459 Nitrile rubber Polymers 0.000 description 1
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 1
- 229920001890 Novodur Polymers 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- ORLQHILJRHBSAY-UHFFFAOYSA-N [1-(hydroxymethyl)cyclohexyl]methanol Chemical class OCC1(CO)CCCCC1 ORLQHILJRHBSAY-UHFFFAOYSA-N 0.000 description 1
- SUXGZGQKIFLKOR-UHFFFAOYSA-N [4-(2-phenylpropan-2-yl)phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(C)(C)C1=CC=CC=C1 SUXGZGQKIFLKOR-UHFFFAOYSA-N 0.000 description 1
- AWWJTNMLTCVUBS-UHFFFAOYSA-N [4-[1,1-bis(4-cyanatophenyl)ethyl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(C=1C=CC(OC#N)=CC=1)(C)C1=CC=C(OC#N)C=C1 AWWJTNMLTCVUBS-UHFFFAOYSA-N 0.000 description 1
- SIZDMAYTWUINIG-UHFFFAOYSA-N [4-[1-(4-cyanatophenyl)ethyl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(C)C1=CC=C(OC#N)C=C1 SIZDMAYTWUINIG-UHFFFAOYSA-N 0.000 description 1
- AHZMUXQJTGRNHT-UHFFFAOYSA-N [4-[2-(4-cyanatophenyl)propan-2-yl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(C)(C)C1=CC=C(OC#N)C=C1 AHZMUXQJTGRNHT-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical compound C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 1
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 1
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
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- 239000010949 copper Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- FOTKYAAJKYLFFN-UHFFFAOYSA-N decane-1,10-diol Chemical compound OCCCCCCCCCCO FOTKYAAJKYLFFN-UHFFFAOYSA-N 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- XUCNUKMRBVNAPB-UHFFFAOYSA-N fluoroethene Chemical compound FC=C XUCNUKMRBVNAPB-UHFFFAOYSA-N 0.000 description 1
- 239000013022 formulation composition Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 238000006459 hydrosilylation reaction Methods 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920001692 polycarbonate urethane Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000004071 soot Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- MUTNCGKQJGXKEM-UHFFFAOYSA-N tamibarotene Chemical compound C=1C=C2C(C)(C)CCC(C)(C)C2=CC=1NC(=O)C1=CC=C(C(O)=O)C=C1 MUTNCGKQJGXKEM-UHFFFAOYSA-N 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 238000005382 thermal cycling Methods 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- DSROZUMNVRXZNO-UHFFFAOYSA-K tris[(1-naphthalen-1-yl-3-phenylnaphthalen-2-yl)oxy]alumane Chemical class C=1C=CC=CC=1C=1C=C2C=CC=CC2=C(C=2C3=CC=CC=C3C=CC=2)C=1O[Al](OC=1C(=C2C=CC=CC2=CC=1C=1C=CC=CC=1)C=1C2=CC=CC=C2C=CC=1)OC(C(=C1C=CC=CC1=C1)C=2C3=CC=CC=C3C=CC=2)=C1C1=CC=CC=C1 DSROZUMNVRXZNO-UHFFFAOYSA-K 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L1/00—Arrangements for detecting or preventing errors in the information received
- H04L1/22—Arrangements for detecting or preventing errors in the information received using redundant apparatus to increase reliability
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F8/00—Chemical modification by after-treatment
- C08F8/34—Introducing sulfur atoms or sulfur-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F8/00—Chemical modification by after-treatment
- C08F8/30—Introducing nitrogen atoms or nitrogen-containing groups
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US815442 | 2004-04-01 | ||
| US10/815,442 US7160946B2 (en) | 2004-04-01 | 2004-04-01 | Method to improve high temperature cohesive strength with adhesive having multi-phase system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE602005000365D1 DE602005000365D1 (de) | 2007-02-08 |
| DE602005000365T2 true DE602005000365T2 (de) | 2007-05-16 |
Family
ID=34887744
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE602005000365T Expired - Fee Related DE602005000365T2 (de) | 2004-04-01 | 2005-03-30 | Verfahren zur Verbesserung der Kohäsion bei erhöhter Temperatur mittels Mehrphasenklebern |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US7160946B2 (enExample) |
| EP (1) | EP1582574B1 (enExample) |
| JP (2) | JP5654718B2 (enExample) |
| KR (1) | KR101158348B1 (enExample) |
| CN (1) | CN1676564A (enExample) |
| DE (1) | DE602005000365T2 (enExample) |
| SG (1) | SG115812A1 (enExample) |
| TW (1) | TWI367926B (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102014017746A1 (de) * | 2014-12-01 | 2016-06-02 | Pi Ceramic Gmbh Keramische Technologien Und Bauelemente | Aktuatorvorrichtung |
| JP2018500758A (ja) * | 2014-12-01 | 2018-01-11 | ピーアイ セラミック ゲーエムベーハーＰｉ Ｃｅｒａｍｉｃ Ｇｍｂｈ | アクチュエータ装置 |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1930263B (zh) | 2004-03-19 | 2012-02-29 | 住友电木株式会社 | 树脂组合物及采用该树脂组合物制作的半导体装置 |
| TW200707468A (en) * | 2005-04-06 | 2007-02-16 | Toagosei Co Ltd | Conductive paste, circuit board, circuit article and method for manufacturing such circuit article |
| US7422707B2 (en) * | 2007-01-10 | 2008-09-09 | National Starch And Chemical Investment Holding Corporation | Highly conductive composition for wafer coating |
| US20080292801A1 (en) * | 2007-05-23 | 2008-11-27 | National Starch And Chemical Investment Holding Corporation | Corrosion-Preventive Adhesive Compositions |
| CN102124068A (zh) * | 2008-02-25 | 2011-07-13 | 汉高股份两合公司 | 自圆倒角化芯片粘接膏 |
| EP2834314A1 (en) * | 2012-04-06 | 2015-02-11 | Ips Corporation | Adhesive composition for bonding low surface energy polyolefin substrates |
| PT3187557T (pt) * | 2014-08-29 | 2023-12-19 | Furukawa Electric Co Ltd | Película adesiva e encapsulamento de semicondutor com utilização de película adesiva |
| CN104212365B (zh) * | 2014-09-26 | 2015-12-02 | 烟台德邦科技有限公司 | 一种非流动底部填充材料及其制备方法 |
| WO2016098890A1 (ja) * | 2014-12-18 | 2016-06-23 | 株式会社カネカ | グラファイト積層体、グラファイト積層体の製造方法、熱輸送用構造物およびロッド状の熱輸送体 |
| JP6623092B2 (ja) * | 2016-03-22 | 2019-12-18 | 株式会社巴川製紙所 | 熱硬化性接着シートおよびその製造方法 |
| JP7007196B2 (ja) * | 2016-09-29 | 2022-01-24 | 積水化学工業株式会社 | 液晶表示素子用シール剤、上下導通材料、及び、液晶表示素子 |
| CN110582841B (zh) | 2017-05-16 | 2023-08-22 | 迪睿合株式会社 | 底部填充材料、底部填充薄膜及使用其的半导体装置的制备方法 |
| CN113316597A (zh) * | 2019-01-24 | 2021-08-27 | 昭和电工株式会社 | 热固性树脂组合物 |
| TWI783454B (zh) * | 2021-04-21 | 2022-11-11 | 翌驊實業股份有限公司 | 黏著複合物及其使用方法 |
| CN119306648A (zh) * | 2024-12-17 | 2025-01-14 | 杭州之江有机硅化工有限公司 | 一种双马来酰亚胺树脂及其制备方法和应用 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5003018A (en) * | 1988-04-29 | 1991-03-26 | Basf Aktiengesellschaft | Slurry mixing of bismaleimide resins |
| US5747615A (en) * | 1988-04-29 | 1998-05-05 | Cytec Technology Corp. | Slurry-mixed heat-curable resin systems having superior tack and drape |
| JP3290242B2 (ja) * | 1993-05-13 | 2002-06-10 | 住友ベークライト株式会社 | 低誘電率熱硬化性樹脂組成物 |
| US6852814B2 (en) | 1994-09-02 | 2005-02-08 | Henkel Corporation | Thermosetting resin compositions containing maleimide and/or vinyl compounds |
| CA2237359A1 (en) * | 1995-11-13 | 1997-05-22 | Cytec Technology Corp. | Thermosetting polymers for composite and adhesive applications |
| US20030055121A1 (en) | 1996-09-10 | 2003-03-20 | Dershem Stephen M. | Thermosetting resin compositions containing maleimide and/or vinyl compounds |
| JP3599160B2 (ja) | 1997-05-16 | 2004-12-08 | 大日本インキ化学工業株式会社 | マレイミド誘導体を含有する活性エネルギー線硬化性組成物及び該活性エネルギー線硬化性組成物の硬化方法 |
| ATE456588T1 (de) * | 1997-07-03 | 2010-02-15 | Henkel Loctite Corp | Anaerobe klebstoffzusammensetzungen kontrollierter stärke für hohe temperaturen welche bei umgebungsbedingungen härtbar sind |
| JPH11106455A (ja) * | 1997-10-06 | 1999-04-20 | Hitachi Chem Co Ltd | 樹脂ペースト組成物及びこれを用いた半導体装置 |
| JPH11106454A (ja) * | 1997-10-06 | 1999-04-20 | Hitachi Chem Co Ltd | 樹脂ペースト組成物及びこれを用いた半導体装置 |
| US6350840B1 (en) | 1998-07-02 | 2002-02-26 | National Starch And Chemical Investment Holding Corporation | Underfill encapsulants prepared from allylated amide compounds |
| US6265530B1 (en) * | 1998-07-02 | 2001-07-24 | National Starch And Chemical Investment Holding Corporation | Die attach adhesives for use in microelectronic devices |
| JP3705530B2 (ja) * | 1998-08-24 | 2005-10-12 | 住友ベークライト株式会社 | 絶縁性ダイアタッチペースト |
| ES2282127T3 (es) * | 1999-07-08 | 2007-10-16 | University Of North Carolina At Chapel Hill | Nuevos profarmacos para amidinas anticrobianas. |
| US6441213B1 (en) * | 2000-05-18 | 2002-08-27 | National Starch And Chemical Investment Holding Corporation | Adhesion promoters containing silane, carbamate or urea, and donor or acceptor functionality |
| MXPA02012842A (es) * | 2000-06-23 | 2003-05-15 | Solutia Inc | Procedimiento para formar microesferas solidas polimericas adhesivas sensibles a la presion. |
| JP3599659B2 (ja) * | 2000-10-26 | 2004-12-08 | 株式会社巴川製紙所 | 半導体装置用接着テープ |
| US6831046B2 (en) * | 2001-06-22 | 2004-12-14 | Unilever Home & Personal Care Usa, Division Of Conopco, Inc. | Hair conditioning compositions in stick or bar form containing cationic surfactant and fatty alcohol |
| JP3989299B2 (ja) * | 2002-05-23 | 2007-10-10 | 日本化薬株式会社 | マレイミド化合物、これを含む樹脂組成物及びその硬化物 |
| US6669929B1 (en) | 2002-12-30 | 2003-12-30 | Colgate Palmolive Company | Dentifrice containing functional film flakes |
-
2004
- 2004-04-01 US US10/815,442 patent/US7160946B2/en not_active Expired - Lifetime
-
2005
- 2005-03-28 KR KR1020050025635A patent/KR101158348B1/ko not_active Expired - Lifetime
- 2005-03-29 SG SG200501886A patent/SG115812A1/en unknown
- 2005-03-30 EP EP05006864A patent/EP1582574B1/en not_active Expired - Lifetime
- 2005-03-30 DE DE602005000365T patent/DE602005000365T2/de not_active Expired - Fee Related
- 2005-03-31 TW TW094110162A patent/TWI367926B/zh not_active IP Right Cessation
- 2005-03-31 JP JP2005100639A patent/JP5654718B2/ja not_active Expired - Lifetime
- 2005-04-01 CN CNA2005100655324A patent/CN1676564A/zh active Pending
-
2014
- 2014-05-08 JP JP2014097205A patent/JP5676801B2/ja not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102014017746A1 (de) * | 2014-12-01 | 2016-06-02 | Pi Ceramic Gmbh Keramische Technologien Und Bauelemente | Aktuatorvorrichtung |
| JP2018500758A (ja) * | 2014-12-01 | 2018-01-11 | ピーアイ セラミック ゲーエムベーハーＰｉ Ｃｅｒａｍｉｃ Ｇｍｂｈ | アクチュエータ装置 |
| DE102014017746B4 (de) | 2014-12-01 | 2021-10-21 | Pi Ceramic Gmbh | Aktuatorvorrichtung |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2005290380A (ja) | 2005-10-20 |
| JP5654718B2 (ja) | 2015-01-14 |
| US20050222330A1 (en) | 2005-10-06 |
| CN1676564A (zh) | 2005-10-05 |
| TW200613501A (en) | 2006-05-01 |
| KR101158348B1 (ko) | 2012-06-22 |
| US7160946B2 (en) | 2007-01-09 |
| DE602005000365D1 (de) | 2007-02-08 |
| KR20060044868A (ko) | 2006-05-16 |
| EP1582574B1 (en) | 2006-12-27 |
| EP1582574A1 (en) | 2005-10-05 |
| JP2014169450A (ja) | 2014-09-18 |
| JP5676801B2 (ja) | 2015-02-25 |
| SG115812A1 (en) | 2005-10-28 |
| TWI367926B (en) | 2012-07-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition | ||
| 8328 | Change in the person/name/address of the agent |
Representative=s name: MEISSNER, BOLTE & PARTNER GBR, 80538 MUENCHEN |
|
| 8327 | Change in the person/name/address of the patent owner |
Owner name: HENKEL AG & CO. KGAA, 40589 DUESSELDORF, DE |
|
| 8339 | Ceased/non-payment of the annual fee |