JP5654718B2 - 多相系を有する接着剤を使用する高温結合力を改善する方法 - Google Patents

多相系を有する接着剤を使用する高温結合力を改善する方法 Download PDF

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Publication number
JP5654718B2
JP5654718B2 JP2005100639A JP2005100639A JP5654718B2 JP 5654718 B2 JP5654718 B2 JP 5654718B2 JP 2005100639 A JP2005100639 A JP 2005100639A JP 2005100639 A JP2005100639 A JP 2005100639A JP 5654718 B2 JP5654718 B2 JP 5654718B2
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resin
acrylate
poly
resins
group
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JP2005290380A (ja
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タダシ・タカノ
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ヘンケル・アーゲー・アンド・カンパニー・カーゲーアーアー
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L1/00—Arrangements for detecting or preventing errors in the information received
    • H04L1/22—Arrangements for detecting or preventing errors in the information received using redundant apparatus to increase reliability
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00—Chemical modification by after-treatment
    • C08F8/34—Introducing sulfur atoms or sulfur-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00—Chemical modification by after-treatment
    • C08F8/30—Introducing nitrogen atoms or nitrogen-containing groups

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
JP2005100639A 2004-04-01 2005-03-31 多相系を有する接着剤を使用する高温結合力を改善する方法 Expired - Lifetime JP5654718B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/815442 2004-04-01
US10/815,442 US7160946B2 (en) 2004-04-01 2004-04-01 Method to improve high temperature cohesive strength with adhesive having multi-phase system

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014097205A Division JP5676801B2 (ja) 2004-04-01 2014-05-08 多相系を有する接着剤を使用する高温結合力を改善する方法

Publications (2)

Publication Number Publication Date
JP2005290380A JP2005290380A (ja) 2005-10-20
JP5654718B2 true JP5654718B2 (ja) 2015-01-14

Family

ID=34887744

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2005100639A Expired - Lifetime JP5654718B2 (ja) 2004-04-01 2005-03-31 多相系を有する接着剤を使用する高温結合力を改善する方法
JP2014097205A Expired - Lifetime JP5676801B2 (ja) 2004-04-01 2014-05-08 多相系を有する接着剤を使用する高温結合力を改善する方法

Family Applications After (1)

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JP2014097205A Expired - Lifetime JP5676801B2 (ja) 2004-04-01 2014-05-08 多相系を有する接着剤を使用する高温結合力を改善する方法

Country Status (8)

Country Link
US (1) US7160946B2 (enExample)
EP (1) EP1582574B1 (enExample)
JP (2) JP5654718B2 (enExample)
KR (1) KR101158348B1 (enExample)
CN (1) CN1676564A (enExample)
DE (1) DE602005000365T2 (enExample)
SG (1) SG115812A1 (enExample)
TW (1) TWI367926B (enExample)

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TWI359835B (en) 2004-03-19 2012-03-11 Sumitomo Bakelite Co Resin composition and semiconductor device produce
TW200707468A (en) * 2005-04-06 2007-02-16 Toagosei Co Ltd Conductive paste, circuit board, circuit article and method for manufacturing such circuit article
US7422707B2 (en) * 2007-01-10 2008-09-09 National Starch And Chemical Investment Holding Corporation Highly conductive composition for wafer coating
US20080292801A1 (en) * 2007-05-23 2008-11-27 National Starch And Chemical Investment Holding Corporation Corrosion-Preventive Adhesive Compositions
JP5250640B2 (ja) * 2008-02-25 2013-07-31 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン 自己フィレット化・ダイ取付けペースト
US9018326B2 (en) 2012-04-06 2015-04-28 Ips Corporation Adhesive composition for bonding low surface energy polyolefin substrates
JP6395730B2 (ja) * 2014-08-29 2018-09-26 古河電気工業株式会社 接着フィルム及び接着フィルムを用いた半導体パッケージ
CN104212365B (zh) * 2014-09-26 2015-12-02 烟台德邦科技有限公司 一种非流动底部填充材料及其制备方法
US10770508B2 (en) 2014-12-01 2020-09-08 Pi Ceramic Gmbh Actuator device
DE102014017746B4 (de) * 2014-12-01 2021-10-21 Pi Ceramic Gmbh Aktuatorvorrichtung
KR102087163B1 (ko) * 2014-12-18 2020-03-10 가부시키가이샤 가네카 그래파이트 적층체, 그래파이트 적층체의 제조 방법, 열 수송용 구조물 및 로드상의 열 수송체
JP6623092B2 (ja) * 2016-03-22 2019-12-18 株式会社巴川製紙所 熱硬化性接着シートおよびその製造方法
JP7007196B2 (ja) * 2016-09-29 2022-01-24 積水化学工業株式会社 液晶表示素子用シール剤、上下導通材料、及び、液晶表示素子
WO2018212215A1 (ja) 2017-05-16 2018-11-22 デクセリアルズ株式会社 アンダーフィル材、アンダーフィルフィルム、及びこれを用いた半導体装置の製造方法
JP7363821B2 (ja) * 2019-01-24 2023-10-18 株式会社レゾナック 熱硬化性樹脂組成物
TWI783454B (zh) * 2021-04-21 2022-11-11 翌驊實業股份有限公司 黏著複合物及其使用方法
CN119306648A (zh) * 2024-12-17 2025-01-14 杭州之江有机硅化工有限公司 一种双马来酰亚胺树脂及其制备方法和应用

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US5003018A (en) * 1988-04-29 1991-03-26 Basf Aktiengesellschaft Slurry mixing of bismaleimide resins
US5747615A (en) * 1988-04-29 1998-05-05 Cytec Technology Corp. Slurry-mixed heat-curable resin systems having superior tack and drape
JP3290242B2 (ja) * 1993-05-13 2002-06-10 住友ベークライト株式会社 低誘電率熱硬化性樹脂組成物
US6852814B2 (en) * 1994-09-02 2005-02-08 Henkel Corporation Thermosetting resin compositions containing maleimide and/or vinyl compounds
DK0861281T3 (da) * 1995-11-13 2002-09-16 Cytec Tech Corp Varmehærdelig bismaleimidpolymer til anvendelse i kompositter og adhæsiver
US20030055121A1 (en) * 1996-09-10 2003-03-20 Dershem Stephen M. Thermosetting resin compositions containing maleimide and/or vinyl compounds
JP3599160B2 (ja) 1997-05-16 2004-12-08 大日本インキ化学工業株式会社 マレイミド誘導体を含有する活性エネルギー線硬化性組成物及び該活性エネルギー線硬化性組成物の硬化方法
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JPH11106455A (ja) * 1997-10-06 1999-04-20 Hitachi Chem Co Ltd 樹脂ペースト組成物及びこれを用いた半導体装置
US6265530B1 (en) * 1998-07-02 2001-07-24 National Starch And Chemical Investment Holding Corporation Die attach adhesives for use in microelectronic devices
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JP3705530B2 (ja) * 1998-08-24 2005-10-12 住友ベークライト株式会社 絶縁性ダイアタッチペースト
ES2282127T3 (es) * 1999-07-08 2007-10-16 University Of North Carolina At Chapel Hill Nuevos profarmacos para amidinas anticrobianas.
US6441213B1 (en) 2000-05-18 2002-08-27 National Starch And Chemical Investment Holding Corporation Adhesion promoters containing silane, carbamate or urea, and donor or acceptor functionality
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JP3599659B2 (ja) * 2000-10-26 2004-12-08 株式会社巴川製紙所 半導体装置用接着テープ
ES2249592T3 (es) * 2001-06-22 2006-04-01 Unilever N.V. Composiciones de acondicionamiento del cabello.
JP3989299B2 (ja) * 2002-05-23 2007-10-10 日本化薬株式会社 マレイミド化合物、これを含む樹脂組成物及びその硬化物
US6669929B1 (en) 2002-12-30 2003-12-30 Colgate Palmolive Company Dentifrice containing functional film flakes

Also Published As

Publication number Publication date
US20050222330A1 (en) 2005-10-06
KR20060044868A (ko) 2006-05-16
JP5676801B2 (ja) 2015-02-25
DE602005000365D1 (de) 2007-02-08
TW200613501A (en) 2006-05-01
KR101158348B1 (ko) 2012-06-22
TWI367926B (en) 2012-07-11
US7160946B2 (en) 2007-01-09
EP1582574A1 (en) 2005-10-05
JP2014169450A (ja) 2014-09-18
SG115812A1 (en) 2005-10-28
CN1676564A (zh) 2005-10-05
EP1582574B1 (en) 2006-12-27
DE602005000365T2 (de) 2007-05-16
JP2005290380A (ja) 2005-10-20

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