KR101158348B1 - 다상 시스템을 갖는 접착제를 이용한 고온에서의 응집강도를 향상시키는 방법 - Google Patents

다상 시스템을 갖는 접착제를 이용한 고온에서의 응집강도를 향상시키는 방법 Download PDF

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Publication number
KR101158348B1
KR101158348B1 KR1020050025635A KR20050025635A KR101158348B1 KR 101158348 B1 KR101158348 B1 KR 101158348B1 KR 1020050025635 A KR1020050025635 A KR 1020050025635A KR 20050025635 A KR20050025635 A KR 20050025635A KR 101158348 B1 KR101158348 B1 KR 101158348B1
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KR
South Korea
Prior art keywords
adhesive
acrylate
poly
resin
cohesive strength
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KR1020050025635A
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English (en)
Korean (ko)
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KR20060044868A (ko
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다다시 다카노
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헨켈 아게 운트 코. 카게아아
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L1/00—Arrangements for detecting or preventing errors in the information received
    • H04L1/22—Arrangements for detecting or preventing errors in the information received using redundant apparatus to increase reliability
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00—Chemical modification by after-treatment
    • C08F8/34—Introducing sulfur atoms or sulfur-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00—Chemical modification by after-treatment
    • C08F8/30—Introducing nitrogen atoms or nitrogen-containing groups

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
KR1020050025635A 2004-04-01 2005-03-28 다상 시스템을 갖는 접착제를 이용한 고온에서의 응집강도를 향상시키는 방법 Expired - Lifetime KR101158348B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/815,442 2004-04-01
US10/815,442 US7160946B2 (en) 2004-04-01 2004-04-01 Method to improve high temperature cohesive strength with adhesive having multi-phase system

Publications (2)

Publication Number Publication Date
KR20060044868A KR20060044868A (ko) 2006-05-16
KR101158348B1 true KR101158348B1 (ko) 2012-06-22

Family

ID=34887744

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050025635A Expired - Lifetime KR101158348B1 (ko) 2004-04-01 2005-03-28 다상 시스템을 갖는 접착제를 이용한 고온에서의 응집강도를 향상시키는 방법

Country Status (8)

Country Link
US (1) US7160946B2 (enExample)
EP (1) EP1582574B1 (enExample)
JP (2) JP5654718B2 (enExample)
KR (1) KR101158348B1 (enExample)
CN (1) CN1676564A (enExample)
DE (1) DE602005000365T2 (enExample)
SG (1) SG115812A1 (enExample)
TW (1) TWI367926B (enExample)

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TWI359835B (en) 2004-03-19 2012-03-11 Sumitomo Bakelite Co Resin composition and semiconductor device produce
TW200707468A (en) * 2005-04-06 2007-02-16 Toagosei Co Ltd Conductive paste, circuit board, circuit article and method for manufacturing such circuit article
US7422707B2 (en) * 2007-01-10 2008-09-09 National Starch And Chemical Investment Holding Corporation Highly conductive composition for wafer coating
US20080292801A1 (en) * 2007-05-23 2008-11-27 National Starch And Chemical Investment Holding Corporation Corrosion-Preventive Adhesive Compositions
JP5250640B2 (ja) * 2008-02-25 2013-07-31 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン 自己フィレット化・ダイ取付けペースト
US9018326B2 (en) 2012-04-06 2015-04-28 Ips Corporation Adhesive composition for bonding low surface energy polyolefin substrates
JP6395730B2 (ja) * 2014-08-29 2018-09-26 古河電気工業株式会社 接着フィルム及び接着フィルムを用いた半導体パッケージ
CN104212365B (zh) * 2014-09-26 2015-12-02 烟台德邦科技有限公司 一种非流动底部填充材料及其制备方法
US10770508B2 (en) 2014-12-01 2020-09-08 Pi Ceramic Gmbh Actuator device
DE102014017746B4 (de) * 2014-12-01 2021-10-21 Pi Ceramic Gmbh Aktuatorvorrichtung
KR102087163B1 (ko) * 2014-12-18 2020-03-10 가부시키가이샤 가네카 그래파이트 적층체, 그래파이트 적층체의 제조 방법, 열 수송용 구조물 및 로드상의 열 수송체
JP6623092B2 (ja) * 2016-03-22 2019-12-18 株式会社巴川製紙所 熱硬化性接着シートおよびその製造方法
JP7007196B2 (ja) * 2016-09-29 2022-01-24 積水化学工業株式会社 液晶表示素子用シール剤、上下導通材料、及び、液晶表示素子
WO2018212215A1 (ja) 2017-05-16 2018-11-22 デクセリアルズ株式会社 アンダーフィル材、アンダーフィルフィルム、及びこれを用いた半導体装置の製造方法
JP7363821B2 (ja) * 2019-01-24 2023-10-18 株式会社レゾナック 熱硬化性樹脂組成物
TWI783454B (zh) * 2021-04-21 2022-11-11 翌驊實業股份有限公司 黏著複合物及其使用方法
CN119306648A (zh) * 2024-12-17 2025-01-14 杭州之江有机硅化工有限公司 一种双马来酰亚胺树脂及其制备方法和应用

Citations (4)

* Cited by examiner, † Cited by third party
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US5003018A (en) * 1988-04-29 1991-03-26 Basf Aktiengesellschaft Slurry mixing of bismaleimide resins
KR20000011449A (ko) * 1998-07-02 2000-02-25 쉬한 존 엠. 마이크로전자장치용다이부착접착제
KR20010020552A (ko) * 1997-07-03 2001-03-15 유진 에프. 밀러 주위 환경 조건하에서 경화가능한 고온의, 제어된 강도의혐기성 접착제 조성물
US6313248B1 (en) * 1995-11-13 2001-11-06 Cytec Technology Corp. Thermosetting polymers with improved thermal and oxidative stability for composite and adhesive applications

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US5747615A (en) * 1988-04-29 1998-05-05 Cytec Technology Corp. Slurry-mixed heat-curable resin systems having superior tack and drape
JP3290242B2 (ja) * 1993-05-13 2002-06-10 住友ベークライト株式会社 低誘電率熱硬化性樹脂組成物
US6852814B2 (en) * 1994-09-02 2005-02-08 Henkel Corporation Thermosetting resin compositions containing maleimide and/or vinyl compounds
US20030055121A1 (en) * 1996-09-10 2003-03-20 Dershem Stephen M. Thermosetting resin compositions containing maleimide and/or vinyl compounds
JP3599160B2 (ja) 1997-05-16 2004-12-08 大日本インキ化学工業株式会社 マレイミド誘導体を含有する活性エネルギー線硬化性組成物及び該活性エネルギー線硬化性組成物の硬化方法
JPH11106454A (ja) * 1997-10-06 1999-04-20 Hitachi Chem Co Ltd 樹脂ペースト組成物及びこれを用いた半導体装置
JPH11106455A (ja) * 1997-10-06 1999-04-20 Hitachi Chem Co Ltd 樹脂ペースト組成物及びこれを用いた半導体装置
US6350840B1 (en) 1998-07-02 2002-02-26 National Starch And Chemical Investment Holding Corporation Underfill encapsulants prepared from allylated amide compounds
JP3705530B2 (ja) * 1998-08-24 2005-10-12 住友ベークライト株式会社 絶縁性ダイアタッチペースト
ES2282127T3 (es) * 1999-07-08 2007-10-16 University Of North Carolina At Chapel Hill Nuevos profarmacos para amidinas anticrobianas.
US6441213B1 (en) 2000-05-18 2002-08-27 National Starch And Chemical Investment Holding Corporation Adhesion promoters containing silane, carbamate or urea, and donor or acceptor functionality
BR0111874A (pt) * 2000-06-23 2003-06-24 Solutia Inc Processo para formação de microesferas sólida de polìmero adesivo sensìveis à pressão
JP3599659B2 (ja) * 2000-10-26 2004-12-08 株式会社巴川製紙所 半導体装置用接着テープ
ES2249592T3 (es) * 2001-06-22 2006-04-01 Unilever N.V. Composiciones de acondicionamiento del cabello.
JP3989299B2 (ja) * 2002-05-23 2007-10-10 日本化薬株式会社 マレイミド化合物、これを含む樹脂組成物及びその硬化物
US6669929B1 (en) 2002-12-30 2003-12-30 Colgate Palmolive Company Dentifrice containing functional film flakes

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5003018A (en) * 1988-04-29 1991-03-26 Basf Aktiengesellschaft Slurry mixing of bismaleimide resins
US6313248B1 (en) * 1995-11-13 2001-11-06 Cytec Technology Corp. Thermosetting polymers with improved thermal and oxidative stability for composite and adhesive applications
KR20010020552A (ko) * 1997-07-03 2001-03-15 유진 에프. 밀러 주위 환경 조건하에서 경화가능한 고온의, 제어된 강도의혐기성 접착제 조성물
KR20000011449A (ko) * 1998-07-02 2000-02-25 쉬한 존 엠. 마이크로전자장치용다이부착접착제

Also Published As

Publication number Publication date
US20050222330A1 (en) 2005-10-06
KR20060044868A (ko) 2006-05-16
JP5676801B2 (ja) 2015-02-25
DE602005000365D1 (de) 2007-02-08
TW200613501A (en) 2006-05-01
TWI367926B (en) 2012-07-11
JP5654718B2 (ja) 2015-01-14
US7160946B2 (en) 2007-01-09
EP1582574A1 (en) 2005-10-05
JP2014169450A (ja) 2014-09-18
SG115812A1 (en) 2005-10-28
CN1676564A (zh) 2005-10-05
EP1582574B1 (en) 2006-12-27
DE602005000365T2 (de) 2007-05-16
JP2005290380A (ja) 2005-10-20

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