TWI367926B - Method to improve high temperature cohesive strength with adhesive having multi-phase system - Google Patents

Method to improve high temperature cohesive strength with adhesive having multi-phase system

Info

Publication number
TWI367926B
TWI367926B TW094110162A TW94110162A TWI367926B TW I367926 B TWI367926 B TW I367926B TW 094110162 A TW094110162 A TW 094110162A TW 94110162 A TW94110162 A TW 94110162A TW I367926 B TWI367926 B TW I367926B
Authority
TW
Taiwan
Prior art keywords
adhesive
high temperature
phase system
cohesive strength
improve high
Prior art date
Application number
TW094110162A
Other languages
English (en)
Chinese (zh)
Other versions
TW200613501A (en
Inventor
Tadashi Takano
Original Assignee
Henkel Ag & Co Kgaa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel Ag & Co Kgaa filed Critical Henkel Ag & Co Kgaa
Publication of TW200613501A publication Critical patent/TW200613501A/zh
Application granted granted Critical
Publication of TWI367926B publication Critical patent/TWI367926B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00—Chemical modification by after-treatment
    • C08F8/34—Introducing sulfur atoms or sulfur-containing groups
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L1/00—Arrangements for detecting or preventing errors in the information received
    • H04L1/22—Arrangements for detecting or preventing errors in the information received using redundant apparatus to increase reliability
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00—Chemical modification by after-treatment
    • C08F8/30—Introducing nitrogen atoms or nitrogen-containing groups

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
TW094110162A 2004-04-01 2005-03-31 Method to improve high temperature cohesive strength with adhesive having multi-phase system TWI367926B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/815,442 US7160946B2 (en) 2004-04-01 2004-04-01 Method to improve high temperature cohesive strength with adhesive having multi-phase system

Publications (2)

Publication Number Publication Date
TW200613501A TW200613501A (en) 2006-05-01
TWI367926B true TWI367926B (en) 2012-07-11

Family

ID=34887744

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094110162A TWI367926B (en) 2004-04-01 2005-03-31 Method to improve high temperature cohesive strength with adhesive having multi-phase system

Country Status (8)

Country Link
US (1) US7160946B2 (enExample)
EP (1) EP1582574B1 (enExample)
JP (2) JP5654718B2 (enExample)
KR (1) KR101158348B1 (enExample)
CN (1) CN1676564A (enExample)
DE (1) DE602005000365T2 (enExample)
SG (1) SG115812A1 (enExample)
TW (1) TWI367926B (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1930263B (zh) * 2004-03-19 2012-02-29 住友电木株式会社 树脂组合物及采用该树脂组合物制作的半导体装置
TW200707468A (en) * 2005-04-06 2007-02-16 Toagosei Co Ltd Conductive paste, circuit board, circuit article and method for manufacturing such circuit article
US7422707B2 (en) * 2007-01-10 2008-09-09 National Starch And Chemical Investment Holding Corporation Highly conductive composition for wafer coating
US20080292801A1 (en) * 2007-05-23 2008-11-27 National Starch And Chemical Investment Holding Corporation Corrosion-Preventive Adhesive Compositions
CN102124068A (zh) * 2008-02-25 2011-07-13 汉高股份两合公司 自圆倒角化芯片粘接膏
US9018326B2 (en) 2012-04-06 2015-04-28 Ips Corporation Adhesive composition for bonding low surface energy polyolefin substrates
CN106471077B (zh) * 2014-08-29 2020-02-28 古河电气工业株式会社 粘接膜和使用了粘接膜的半导体封装体
CN104212365B (zh) * 2014-09-26 2015-12-02 烟台德邦科技有限公司 一种非流动底部填充材料及其制备方法
US10770508B2 (en) 2014-12-01 2020-09-08 Pi Ceramic Gmbh Actuator device
DE102014017746B4 (de) * 2014-12-01 2021-10-21 Pi Ceramic Gmbh Aktuatorvorrichtung
US20180023904A1 (en) * 2014-12-18 2018-01-25 Kaneka Corporation Graphite laminates, processes for producing graphite laminates, structural object for heat transport, and rod-shaped heat-transporting object
JP6623092B2 (ja) * 2016-03-22 2019-12-18 株式会社巴川製紙所 熱硬化性接着シートおよびその製造方法
CN108780247A (zh) * 2016-09-29 2018-11-09 积水化学工业株式会社 液晶显示元件用密封剂、上下导通材料和液晶显示元件
WO2018212215A1 (ja) 2017-05-16 2018-11-22 デクセリアルズ株式会社 アンダーフィル材、アンダーフィルフィルム、及びこれを用いた半導体装置の製造方法
WO2020152906A1 (ja) * 2019-01-24 2020-07-30 昭和電工株式会社 熱硬化性樹脂組成物
TWI783454B (zh) * 2021-04-21 2022-11-11 翌驊實業股份有限公司 黏著複合物及其使用方法
CN119306648A (zh) * 2024-12-17 2025-01-14 杭州之江有机硅化工有限公司 一种双马来酰亚胺树脂及其制备方法和应用

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US5747615A (en) * 1988-04-29 1998-05-05 Cytec Technology Corp. Slurry-mixed heat-curable resin systems having superior tack and drape
US5003018A (en) * 1988-04-29 1991-03-26 Basf Aktiengesellschaft Slurry mixing of bismaleimide resins
JP3290242B2 (ja) * 1993-05-13 2002-06-10 住友ベークライト株式会社 低誘電率熱硬化性樹脂組成物
US6852814B2 (en) * 1994-09-02 2005-02-08 Henkel Corporation Thermosetting resin compositions containing maleimide and/or vinyl compounds
DK0861281T3 (da) * 1995-11-13 2002-09-16 Cytec Tech Corp Varmehærdelig bismaleimidpolymer til anvendelse i kompositter og adhæsiver
US20030055121A1 (en) * 1996-09-10 2003-03-20 Dershem Stephen M. Thermosetting resin compositions containing maleimide and/or vinyl compounds
JP3599160B2 (ja) * 1997-05-16 2004-12-08 大日本インキ化学工業株式会社 マレイミド誘導体を含有する活性エネルギー線硬化性組成物及び該活性エネルギー線硬化性組成物の硬化方法
CA2679577C (en) * 1997-07-03 2013-08-13 Henkel Loctite Corporation High temperature, controlled strength anaerobic adhesive compositions curable under ambient environmental conditions
JPH11106455A (ja) * 1997-10-06 1999-04-20 Hitachi Chem Co Ltd 樹脂ペースト組成物及びこれを用いた半導体装置
JPH11106454A (ja) * 1997-10-06 1999-04-20 Hitachi Chem Co Ltd 樹脂ペースト組成物及びこれを用いた半導体装置
US6350840B1 (en) * 1998-07-02 2002-02-26 National Starch And Chemical Investment Holding Corporation Underfill encapsulants prepared from allylated amide compounds
US6265530B1 (en) * 1998-07-02 2001-07-24 National Starch And Chemical Investment Holding Corporation Die attach adhesives for use in microelectronic devices
JP3705530B2 (ja) * 1998-08-24 2005-10-12 住友ベークライト株式会社 絶縁性ダイアタッチペースト
ES2282127T3 (es) * 1999-07-08 2007-10-16 University Of North Carolina At Chapel Hill Nuevos profarmacos para amidinas anticrobianas.
US6441213B1 (en) 2000-05-18 2002-08-27 National Starch And Chemical Investment Holding Corporation Adhesion promoters containing silane, carbamate or urea, and donor or acceptor functionality
ATE292151T1 (de) * 2000-06-23 2005-04-15 Solutia Inc Verfahren zur herstellung von festen druckempfindlichen klebenden polymere-mikrokugeln
JP3599659B2 (ja) * 2000-10-26 2004-12-08 株式会社巴川製紙所 半導体装置用接着テープ
WO2003000205A1 (en) * 2001-06-22 2003-01-03 Unilever Plc Hair conditioning compositions
JP3989299B2 (ja) * 2002-05-23 2007-10-10 日本化薬株式会社 マレイミド化合物、これを含む樹脂組成物及びその硬化物
US6669929B1 (en) 2002-12-30 2003-12-30 Colgate Palmolive Company Dentifrice containing functional film flakes

Also Published As

Publication number Publication date
TW200613501A (en) 2006-05-01
JP5654718B2 (ja) 2015-01-14
JP2005290380A (ja) 2005-10-20
JP5676801B2 (ja) 2015-02-25
JP2014169450A (ja) 2014-09-18
US7160946B2 (en) 2007-01-09
KR20060044868A (ko) 2006-05-16
CN1676564A (zh) 2005-10-05
KR101158348B1 (ko) 2012-06-22
DE602005000365T2 (de) 2007-05-16
DE602005000365D1 (de) 2007-02-08
EP1582574A1 (en) 2005-10-05
SG115812A1 (en) 2005-10-28
EP1582574B1 (en) 2006-12-27
US20050222330A1 (en) 2005-10-06

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