DE60135628D1 - Herstellungsverfahren für ein halbleiter-bipolartransistor-bauelement - Google Patents

Herstellungsverfahren für ein halbleiter-bipolartransistor-bauelement

Info

Publication number
DE60135628D1
DE60135628D1 DE60135628T DE60135628T DE60135628D1 DE 60135628 D1 DE60135628 D1 DE 60135628D1 DE 60135628 T DE60135628 T DE 60135628T DE 60135628 T DE60135628 T DE 60135628T DE 60135628 D1 DE60135628 D1 DE 60135628D1
Authority
DE
Germany
Prior art keywords
active area
type doped
base
collector
poly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60135628T
Other languages
English (en)
Inventor
Doede Terpstra
Catharina H Emons
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NXP BV
Original Assignee
NXP BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NXP BV filed Critical NXP BV
Application granted granted Critical
Publication of DE60135628D1 publication Critical patent/DE60135628D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/70Bipolar devices
    • H01L29/72Transistor-type devices, i.e. able to continuously respond to applied control signals
    • H01L29/73Bipolar junction transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66234Bipolar junction transistors [BJT]
    • H01L29/66272Silicon vertical transistors
    • H01L29/66287Silicon vertical transistors with a single crystalline emitter, collector or base including extrinsic, link or graft base formed on the silicon substrate, e.g. by epitaxy, recrystallisation, after insulating device isolation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/70Bipolar devices
    • H01L29/72Transistor-type devices, i.e. able to continuously respond to applied control signals
    • H01L29/73Bipolar junction transistors
    • H01L29/732Vertical transistors
    • H01L29/7322Vertical transistors having emitter-base and base-collector junctions leaving at the same surface of the body, e.g. planar transistor
DE60135628T 2000-07-03 2001-06-28 Herstellungsverfahren für ein halbleiter-bipolartransistor-bauelement Expired - Lifetime DE60135628D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP00202342 2000-07-03
PCT/EP2001/007407 WO2002003470A1 (en) 2000-07-03 2001-06-28 Method of manufacturing a bipolar transistor semiconductor device

Publications (1)

Publication Number Publication Date
DE60135628D1 true DE60135628D1 (de) 2008-10-16

Family

ID=8171743

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60135628T Expired - Lifetime DE60135628D1 (de) 2000-07-03 2001-06-28 Herstellungsverfahren für ein halbleiter-bipolartransistor-bauelement

Country Status (7)

Country Link
US (1) US6780724B2 (de)
EP (1) EP1228533B1 (de)
JP (1) JP2004503091A (de)
KR (1) KR100761561B1 (de)
AT (1) ATE407453T1 (de)
DE (1) DE60135628D1 (de)
WO (1) WO2002003470A1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6803289B1 (en) * 2002-06-28 2004-10-12 Cypress Semiconductor Corp. Bipolar transistor and method for making the same
US7074628B2 (en) * 2004-09-22 2006-07-11 Agere Systems, Inc. Test structure and method for yield improvement of double poly bipolar device
CN101908485B (zh) * 2010-06-11 2016-03-02 上海华虹宏力半导体制造有限公司 利用三块掩模板制作垂直双极型晶体管的方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60186059A (ja) * 1984-03-05 1985-09-21 Sony Corp 半導体装置及びその製造方法
JPS63261746A (ja) * 1987-04-20 1988-10-28 Oki Electric Ind Co Ltd バイポ−ラ型半導体集積回路装置の製造方法
JP2615646B2 (ja) * 1987-08-11 1997-06-04 ソニー株式会社 バイポーラトランジスタの製造方法
US5204274A (en) 1988-11-04 1993-04-20 Matsushita Electric Industrial Co., Ltd. Method of fabricating semiconductor device
US5101256A (en) * 1989-02-13 1992-03-31 International Business Machines Corporation Bipolar transistor with ultra-thin epitaxial base and method of fabricating same
JPH03138946A (ja) * 1989-10-24 1991-06-13 Sony Corp 半導体装置
JPH06260489A (ja) * 1993-03-02 1994-09-16 Oki Electric Ind Co Ltd 半導体装置の製造方法

Also Published As

Publication number Publication date
US20020123199A1 (en) 2002-09-05
EP1228533B1 (de) 2008-09-03
KR20020064279A (ko) 2002-08-07
KR100761561B1 (ko) 2007-09-27
WO2002003470A1 (en) 2002-01-10
EP1228533A1 (de) 2002-08-07
ATE407453T1 (de) 2008-09-15
JP2004503091A (ja) 2004-01-29
US6780724B2 (en) 2004-08-24

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