DE60010969D1 - Scheibenbehälterkassette - Google Patents

Scheibenbehälterkassette

Info

Publication number
DE60010969D1
DE60010969D1 DE60010969T DE60010969T DE60010969D1 DE 60010969 D1 DE60010969 D1 DE 60010969D1 DE 60010969 T DE60010969 T DE 60010969T DE 60010969 T DE60010969 T DE 60010969T DE 60010969 D1 DE60010969 D1 DE 60010969D1
Authority
DE
Germany
Prior art keywords
disc cartridge
cartridge container
container
disc
cartridge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60010969T
Other languages
English (en)
Other versions
DE60010969T2 (de
Inventor
Yoshiaki Fujimori
Masato Takhashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Polymer Co Ltd, Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Polymer Co Ltd
Application granted granted Critical
Publication of DE60010969D1 publication Critical patent/DE60010969D1/de
Publication of DE60010969T2 publication Critical patent/DE60010969T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67373—Closed carriers characterised by locking systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67383—Closed carriers characterised by substrate supports
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S206/00—Special receptacle or package
    • Y10S206/832—Semiconductor wafer boat
DE60010969T 1999-04-20 2000-04-04 Scheibenbehälterkassette Expired - Lifetime DE60010969T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP11250999A JP3916342B2 (ja) 1999-04-20 1999-04-20 基板収納容器
JP11250999 1999-04-20

Publications (2)

Publication Number Publication Date
DE60010969D1 true DE60010969D1 (de) 2004-07-01
DE60010969T2 DE60010969T2 (de) 2005-06-02

Family

ID=14588441

Family Applications (2)

Application Number Title Priority Date Filing Date
DE60029021T Expired - Lifetime DE60029021T2 (de) 1999-04-20 2000-04-04 Scheibenbehälterkassette
DE60010969T Expired - Lifetime DE60010969T2 (de) 1999-04-20 2000-04-04 Scheibenbehälterkassette

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE60029021T Expired - Lifetime DE60029021T2 (de) 1999-04-20 2000-04-04 Scheibenbehälterkassette

Country Status (6)

Country Link
US (3) US6382419B1 (de)
EP (2) EP1047112B1 (de)
JP (1) JP3916342B2 (de)
KR (1) KR100593217B1 (de)
DE (2) DE60029021T2 (de)
TW (1) TW444360B (de)

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US5901336A (en) * 1996-08-30 1999-05-04 Brush Wellman Inc. Bonding beryllium to copper alloys using powder metallurgy compositional gradients
US6736268B2 (en) * 1997-07-11 2004-05-18 Entegris, Inc. Transport module
US6010008A (en) * 1997-07-11 2000-01-04 Fluoroware, Inc. Transport module
US6808668B2 (en) * 1998-05-28 2004-10-26 Entegris, Inc. Process for fabricating composite substrate carrier
US6871741B2 (en) 1998-05-28 2005-03-29 Entegris, Inc. Composite substrate carrier
US6581264B2 (en) * 2000-05-02 2003-06-24 Shin-Etsu Polymer Co., Ltd. Transportation container and method for opening and closing lid thereof
EP1339622A4 (de) * 2000-12-04 2006-03-08 Entegris Inc Waferträger mit stapeladapterplatte
US6789328B2 (en) * 2001-04-17 2004-09-14 Brooks Automation, Inc. Semiconductor load port alignment device
MY135391A (en) * 2001-08-27 2008-04-30 Entegris Inc Modular carrier for semiconductor wafer disks and similar inventory
US6615994B2 (en) * 2001-09-18 2003-09-09 Intel Corporation Wafer boat
US20030188990A1 (en) * 2001-11-14 2003-10-09 Bhatt Sanjiv M. Composite kinematic coupling
US6951284B2 (en) * 2001-11-14 2005-10-04 Entegris, Inc. Wafer carrier with wafer retaining system
CN1636275A (zh) * 2001-11-27 2005-07-06 诚实公司 具有特性薄膜的半导体元件搬运装置
KR100927923B1 (ko) * 2001-11-27 2009-11-19 엔테그리스, 아이엔씨. 도어에 의해 구현되는 접지 경로를 포함하는 전방 개방웨이퍼 캐리어
KR100876446B1 (ko) * 2001-11-28 2008-12-29 가부시키가이샤 라이트세이사쿠쇼 반송 용기의 덮개 착탈 장치
US7121414B2 (en) * 2001-12-28 2006-10-17 Brooks Automation, Inc. Semiconductor cassette reducer
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JP4133407B2 (ja) 2003-02-13 2008-08-13 ミライアル株式会社 薄板収納容器
TWI283038B (en) 2002-12-02 2007-06-21 Miraial Co Ltd Thin plate storage container
TWI286674B (en) * 2002-12-27 2007-09-11 Asml Netherlands Bv Container for a mask, method of transferring lithographic masks therein and method of scanning a mask in a container
JP4146718B2 (ja) * 2002-12-27 2008-09-10 ミライアル株式会社 薄板支持容器
TW581096U (en) * 2003-03-05 2004-03-21 Power Geode Technology Co Ltd Wafer carrier and grip lever apparatus thereof
US7347329B2 (en) 2003-10-24 2008-03-25 Entegris, Inc. Substrate carrier
US7316325B2 (en) * 2003-11-07 2008-01-08 Entegris, Inc. Substrate container
US7344030B2 (en) * 2003-11-07 2008-03-18 Entegris, Inc. Wafer carrier with apertured door for cleaning
US7201276B2 (en) * 2003-11-07 2007-04-10 Entegris, Inc. Front opening substrate container with bottom plate
JP4461778B2 (ja) * 2003-11-19 2010-05-12 日本電気株式会社 携帯端末機器
WO2005057649A1 (ja) * 2003-12-10 2005-06-23 Fuji Bakelite Co., Ltd. 半導体ウェーハキャリア容器
US7077270B2 (en) * 2004-03-10 2006-07-18 Miraial Co., Ltd. Thin plate storage container with seal and cover fixing means
TWI247974B (en) * 2004-03-11 2006-01-21 Gudeng Prec Ind Co Ltd Optical mask positioning device
JP2005256983A (ja) * 2004-03-12 2005-09-22 Shin Etsu Polymer Co Ltd 基板収納容器
CN100419988C (zh) * 2004-05-17 2008-09-17 信越聚合物株式会社 基板收纳容器及其定位方法
JP4667769B2 (ja) 2004-06-11 2011-04-13 信越ポリマー株式会社 基板収納容器
CN1313331C (zh) * 2004-08-30 2007-05-02 财团法人工业技术研究院 洁净容器结构
JP2006173331A (ja) * 2004-12-15 2006-06-29 Miraial Kk 収納容器
WO2006087894A1 (ja) * 2005-02-03 2006-08-24 Shin-Etsu Polymer Co., Ltd. 固定キャリア、固定キャリアの製造方法、固定キャリアの使用方法、及び基板収納容器
EP1883105B8 (de) * 2005-05-06 2013-03-27 Shin-Etsu Polymer Co., Ltd. Substrat-lagerbehälter und verfahren zu seiner herstellung
JP5123851B2 (ja) * 2005-07-08 2013-01-23 クロッシング オートメーション インコーポレイテッド 加工物を格納するための加工物容器
JP4539511B2 (ja) * 2005-09-26 2010-09-08 信越ポリマー株式会社 精密基板収納容器の付属部品取り付け取り外し冶具
US8365919B2 (en) 2005-12-29 2013-02-05 Shin-Etsu Polymer Co., Ltd. Substrate storage container
US20100310351A1 (en) * 2006-03-30 2010-12-09 Tokyo Electron Limited Method for handling and transferring a wafer case, and holding part used therefor
JP4681485B2 (ja) * 2006-03-30 2011-05-11 東京エレクトロン株式会社 ウエハケースの運用方法、ウエハケースの搬送方法及びウエハケース搬送用保持部品
US8292081B2 (en) * 2006-05-29 2012-10-23 Shin-Etsu Polymer Co., Ltd. Substrate storage container
KR100772845B1 (ko) * 2006-06-21 2007-11-02 삼성전자주식회사 반도체 디바이스 제조설비에서의 웨이퍼 수납장치
JP4668133B2 (ja) * 2006-06-28 2011-04-13 三甲株式会社 ウエハ容器の位置決め構造
US8178024B2 (en) * 2007-02-21 2012-05-15 Shin-Etsu Polymer Co., Ltd. Injection molding die and injection molding method
JP4842879B2 (ja) 2007-04-16 2011-12-21 信越ポリマー株式会社 基板収納容器及びそのハンドル
KR101613836B1 (ko) * 2007-05-17 2016-04-21 브룩스 오토메이션 인코퍼레이티드 측면 개방형 기판 캐리어 및 로드 포트
TWI475627B (zh) 2007-05-17 2015-03-01 Brooks Automation Inc 基板運送機、基板處理裝置和系統、於基板處理期間降低基板之微粒污染的方法，及使運送機與處理機結合之方法
TWM328438U (en) * 2007-06-08 2008-03-11 Gudeng Prec Industral Co Ltd Reticle pod and reticle transport pod
JP4911045B2 (ja) * 2008-01-21 2012-04-04 ムラテックオートメーション株式会社 被搬送物及び防振機構
DE102008007346A1 (de) * 2008-02-04 2009-08-06 Robert Bosch Gmbh Metallisches Gehäuseteil und Verfahren zur Herstellung des Gehäuseteiles
TWI466807B (zh) * 2008-03-13 2015-01-01 Entegris Inc 具有管狀環境控制元件之晶圓儲存盒
JP5118560B2 (ja) * 2008-06-13 2013-01-16 ラピスセミコンダクタ株式会社 ウエハ収納キャリア
JP4825241B2 (ja) * 2008-06-17 2011-11-30 信越ポリマー株式会社 基板収納容器
US8627959B2 (en) 2008-06-23 2014-01-14 Shin-Etsu Polymer Co., Ltd. Substrate storage container
US8623948B2 (en) * 2008-06-26 2014-01-07 Sabic Innovative Plastics Ip B.V. Polycarbonate compositions having antistatic enhancers, method of preparing, and articles comprising the same
JP4921429B2 (ja) * 2008-07-03 2012-04-25 信越ポリマー株式会社 基板収納容器
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JP5328627B2 (ja) * 2009-12-17 2013-10-30 信越ポリマー株式会社 基板収納容器
KR101150850B1 (ko) * 2010-01-22 2012-06-13 주식회사 엘지실트론 웨이퍼 세정장비용 카세트 지그 및 이를 구비한 카세트 어셈블리
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TW201422501A (zh) * 2012-12-04 2014-06-16 Tian-Sing Huang 晶圓承載裝置及其應用
KR102098722B1 (ko) * 2013-05-29 2020-04-09 미라이얼 가부시키가이샤 기판수납용기
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KR102325657B1 (ko) * 2017-08-09 2021-11-12 미라이얼 가부시키가이샤 기판 수납 용기
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Also Published As

Publication number Publication date
EP1047112A2 (de) 2000-10-25
EP1339097B1 (de) 2006-06-21
DE60010969T2 (de) 2005-06-02
DE60029021T2 (de) 2006-11-30
EP1339097A3 (de) 2004-04-28
EP1339097A2 (de) 2003-08-27
EP1047112A3 (de) 2002-02-20
KR20010006992A (ko) 2001-01-26
JP3916342B2 (ja) 2007-05-16
EP1047112B1 (de) 2004-05-26
TW444360B (en) 2001-07-01
US6382419B1 (en) 2002-05-07
KR100593217B1 (ko) 2006-06-28
DE60029021D1 (de) 2006-08-03
JP2000306988A (ja) 2000-11-02
US20020020650A1 (en) 2002-02-21
US20020038773A1 (en) 2002-04-04

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: HOESSLE PATENTANWAELTE PARTNERSCHAFT, 70173 STUTTG