JP4681485B2 - ウエハケースの運用方法、ウエハケースの搬送方法及びウエハケース搬送用保持部品 - Google Patents
ウエハケースの運用方法、ウエハケースの搬送方法及びウエハケース搬送用保持部品 Download PDFInfo
- Publication number
- JP4681485B2 JP4681485B2 JP2006095821A JP2006095821A JP4681485B2 JP 4681485 B2 JP4681485 B2 JP 4681485B2 JP 2006095821 A JP2006095821 A JP 2006095821A JP 2006095821 A JP2006095821 A JP 2006095821A JP 4681485 B2 JP4681485 B2 JP 4681485B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer case
- wafer
- case
- handle
- holding part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
- B65D85/38—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
Description
Opening Unified Pot)等がある。FOSBは、ウエハメーカーがデバイスメーカーへウエハを出荷、搬送する時に使用され、FOUPは、デバイスメーカーが半導体製造工場内で半導体ウエハを搬送する時に使用される。これらのウエハケースは、いずれも内部を密閉し、半導体ウエハを外気に曝すことなくパーティクルによる汚染から防ぐことができる密閉可能な容器として形成されている。
11 ケース本体
11A 側面
12、13 突出部(被連結部)
12A、13A 溝(被連結部)
20 保持部品()
21 操作部
22 支持体
23 連結部
24 、25 係合用突出部(連結部)
26 締結部材
Claims (9)
- ウエハケースに取っ手が着脱可能に設けられたウエハケースにおいて、自動搬送ラインでは、上記ウエハケースから上記取っ手を取り外し、上記取っ手を取り外した部分に自動搬送装置によって上記ウエハケースを保持可能にする保持部品を取り付けて、上記ウエハケースを運用することを特徴とするウエハケースの運用方法。
- 上記自動搬送ライン以外では、上記ウエハケースから上記保持部品を取り外し、上記ウエハケースに上記取っ手を取り付けて、上記ウエハケースを運用することを特徴とする請求項1に記載のウエハケースの運用方法。
- 上記取っ手が上記ウエハケースの両側面それぞれ着脱可能に取り付けられていることを特徴とする請求項1または請求項2に記載のウエハケースの運用方法。
- ウエハケースに取っ手が着脱可能に設けられたウエハケースにおいて、上記ウエハケースから上記取っ手を取り外し、上記取っ手を取り外した部分に自動搬送装置によって上記ウエハケースを保持可能にする保持部品を取り付けて、上記保持部品を介して上記自動搬送装置が上記ウエハケースを保持して搬送することを特徴とするウエハケースの搬送方法。
- 上記取っ手が上記ウエハケースの両側面それぞれ着脱可能に取り付けられていることを特徴とする請求項4に記載のウエハケースの搬送方法。
- 請求項1〜請求項3のいずれか1項に記載のウエハケースの運用方法または請求項4若しくは請求項5に記載のウエハケース搬送方法に使用される保持部品であって、上記保持部品は、上記自動搬送装置が使用する操作部と、上記操作部を一方の面で支持する支持体と、上記支持体の他方の面に形成され且つ上記ウエハケースの側面に形成された被連結部と連結するための連結部と、を有することを特徴とするウエハケース搬送用保持部品。
- 上記被連結部は、上記ウエハケースの側面から突出する少なくとも一対の突出部と上記側面との間にそれぞれ形成する少なくとも一対の溝によって形成され、上記連結部は、上記各溝それぞれと係合する少なくとも一対の係合部によって形成されていることを特徴とする請求項6に記載のウエハケース搬送用保持部品。
- 上記一対の溝は、上記側面から逆向きに突出する突出部によって形成され、上記一対の係合部は、上記溝の上記突出部の突出方向とは逆向きに突出した係合突出部として形成されていることを特徴とする請求項7に記載のウエハケース搬送用保持部品。
- 上記被連結部と上記連結部とを密着させて上記ウエハケースに対して上記保持部品を上記側面に固定する締結部材を上記支持体に設けたことを特徴とする請求項8に記載のウエハケース搬送用保持部品。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006095821A JP4681485B2 (ja) | 2006-03-30 | 2006-03-30 | ウエハケースの運用方法、ウエハケースの搬送方法及びウエハケース搬送用保持部品 |
TW096111081A TWI401759B (zh) | 2006-03-30 | 2007-03-29 | How to use the wafer box, the handling method of the wafer box, and the holding part for the wafer box handling |
KR1020070031000A KR100847465B1 (ko) | 2006-03-30 | 2007-03-29 | 웨이퍼 케이스의 운용 방법, 웨이퍼 케이스의 반송 방법 및웨이퍼 케이스 반송용 유지 부품 |
US11/694,325 US20070231110A1 (en) | 2006-03-30 | 2007-03-30 | Method for handling and transferring a wafer case, and holding part used therefor |
CNA2007100913471A CN101047139A (zh) | 2006-03-30 | 2007-03-30 | 晶片盒的运用方法和搬送方法、晶片盒搬送用保持部件 |
US12/856,244 US20100310351A1 (en) | 2006-03-30 | 2010-08-13 | Method for handling and transferring a wafer case, and holding part used therefor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006095821A JP4681485B2 (ja) | 2006-03-30 | 2006-03-30 | ウエハケースの運用方法、ウエハケースの搬送方法及びウエハケース搬送用保持部品 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2007273630A JP2007273630A (ja) | 2007-10-18 |
JP2007273630A5 JP2007273630A5 (ja) | 2009-05-14 |
JP4681485B2 true JP4681485B2 (ja) | 2011-05-11 |
Family
ID=38559183
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006095821A Expired - Fee Related JP4681485B2 (ja) | 2006-03-30 | 2006-03-30 | ウエハケースの運用方法、ウエハケースの搬送方法及びウエハケース搬送用保持部品 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20070231110A1 (ja) |
JP (1) | JP4681485B2 (ja) |
KR (1) | KR100847465B1 (ja) |
CN (1) | CN101047139A (ja) |
TW (1) | TWI401759B (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI363030B (en) * | 2009-07-10 | 2012-05-01 | Gudeng Prec Industral Co Ltd | Wafer container with top flange structure |
JP5522477B2 (ja) * | 2010-12-17 | 2014-06-18 | 株式会社ダイフク | 搬送設備 |
CN102339779B (zh) * | 2011-09-28 | 2016-02-03 | 上海华虹宏力半导体制造有限公司 | 晶圆盒的传送系统和方法 |
KR102098722B1 (ko) * | 2013-05-29 | 2020-04-09 | 미라이얼 가부시키가이샤 | 기판수납용기 |
US10278501B2 (en) | 2014-04-25 | 2019-05-07 | Applied Materials, Inc. | Load lock door assembly, load lock apparatus, electronic device processing systems, and methods |
US10361108B2 (en) * | 2015-12-14 | 2019-07-23 | Solarcity Corporation | Ambidextrous cassette and methods of using same |
US10242897B2 (en) * | 2015-12-14 | 2019-03-26 | Solarcity Corporation | Micro-environment container for photovoltaic cells |
JP7422577B2 (ja) * | 2020-03-23 | 2024-01-26 | 平田機工株式会社 | ロードポート及び制御方法 |
USD954769S1 (en) * | 2020-06-02 | 2022-06-14 | Applied Materials, Inc. | Enclosure system shelf |
CN116721956B (zh) * | 2023-08-10 | 2023-11-03 | 江苏京创先进电子科技有限公司 | 料盒更换方法、料盒更换小车及晶圆供料系统 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1191864A (ja) * | 1997-07-11 | 1999-04-06 | Fluoroware Inc | ウェハー搬送モジュール |
JP2000306988A (ja) * | 1999-04-20 | 2000-11-02 | Shin Etsu Polymer Co Ltd | 基板収納容器 |
JP2002252278A (ja) * | 2001-02-27 | 2002-09-06 | Sumitomo Metal Ind Ltd | 半導体ウェーハの収納出荷容器 |
JP2005500954A (ja) * | 2001-08-27 | 2005-01-13 | エンテグリス・インコーポレーテッド | 半導体ウエハディスクおよび同様物品のモジュールキャリア |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5029922A (en) * | 1990-02-20 | 1991-07-09 | Advanced Micro Devices, Inc. | Wafer processing cassette handle |
US5246218A (en) * | 1992-09-25 | 1993-09-21 | Intel Corporation | Apparatus for securing an automatically loaded wafer cassette on a wafer processing equipment |
US5570990A (en) * | 1993-11-05 | 1996-11-05 | Asyst Technologies, Inc. | Human guided mobile loader stocker |
US6533101B2 (en) * | 1998-06-24 | 2003-03-18 | Asyst Technologies, Inc. | Integrated transport carrier and conveyor system |
US6581264B2 (en) * | 2000-05-02 | 2003-06-24 | Shin-Etsu Polymer Co., Ltd. | Transportation container and method for opening and closing lid thereof |
TW437723U (en) * | 2000-06-16 | 2001-05-28 | Ind Tech Res Inst | Wafer box with foldable handle |
JP4433585B2 (ja) * | 2000-08-09 | 2010-03-17 | 豊田合成株式会社 | アシストグリップの取付構造 |
US6875282B2 (en) * | 2001-05-17 | 2005-04-05 | Ebara Corporation | Substrate transport container |
JP3697478B2 (ja) * | 2001-08-20 | 2005-09-21 | ソニー株式会社 | 基板の移送方法及びロードポート装置並びに基板移送システム |
JP2003077880A (ja) | 2001-09-03 | 2003-03-14 | Sumitomo Electric Ind Ltd | ウエハの洗浄搬送方法とウエハ洗浄搬送用治具 |
US6726429B2 (en) * | 2002-02-19 | 2004-04-27 | Vertical Solutions, Inc. | Local store for a wafer processing station |
JP4282369B2 (ja) | 2003-05-15 | 2009-06-17 | 信越ポリマー株式会社 | 精密基板収納容器 |
US7455181B2 (en) * | 2003-05-19 | 2008-11-25 | Miraial Co., Ltd. | Lid unit for thin plate supporting container |
WO2006087894A1 (ja) * | 2005-02-03 | 2006-08-24 | Shin-Etsu Polymer Co., Ltd. | 固定キャリア、固定キャリアの製造方法、固定キャリアの使用方法、及び基板収納容器 |
US7520286B2 (en) * | 2005-12-05 | 2009-04-21 | Semitool, Inc. | Apparatus and method for cleaning and drying a container for semiconductor workpieces |
-
2006
- 2006-03-30 JP JP2006095821A patent/JP4681485B2/ja not_active Expired - Fee Related
-
2007
- 2007-03-29 TW TW096111081A patent/TWI401759B/zh not_active IP Right Cessation
- 2007-03-29 KR KR1020070031000A patent/KR100847465B1/ko not_active IP Right Cessation
- 2007-03-30 US US11/694,325 patent/US20070231110A1/en not_active Abandoned
- 2007-03-30 CN CNA2007100913471A patent/CN101047139A/zh active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1191864A (ja) * | 1997-07-11 | 1999-04-06 | Fluoroware Inc | ウェハー搬送モジュール |
JP2000306988A (ja) * | 1999-04-20 | 2000-11-02 | Shin Etsu Polymer Co Ltd | 基板収納容器 |
JP2002252278A (ja) * | 2001-02-27 | 2002-09-06 | Sumitomo Metal Ind Ltd | 半導体ウェーハの収納出荷容器 |
JP2005500954A (ja) * | 2001-08-27 | 2005-01-13 | エンテグリス・インコーポレーテッド | 半導体ウエハディスクおよび同様物品のモジュールキャリア |
Also Published As
Publication number | Publication date |
---|---|
TW200805545A (en) | 2008-01-16 |
US20070231110A1 (en) | 2007-10-04 |
JP2007273630A (ja) | 2007-10-18 |
TWI401759B (zh) | 2013-07-11 |
CN101047139A (zh) | 2007-10-03 |
KR20070098677A (ko) | 2007-10-05 |
KR100847465B1 (ko) | 2008-07-21 |
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