DE60006014D1 - Ultraschallreiniger und diesen enthaltende Nassbehandlungsdüse - Google Patents

Ultraschallreiniger und diesen enthaltende Nassbehandlungsdüse

Info

Publication number
DE60006014D1
DE60006014D1 DE60006014T DE60006014T DE60006014D1 DE 60006014 D1 DE60006014 D1 DE 60006014D1 DE 60006014 T DE60006014 T DE 60006014T DE 60006014 T DE60006014 T DE 60006014T DE 60006014 D1 DE60006014 D1 DE 60006014D1
Authority
DE
Germany
Prior art keywords
ultrasonic cleaner
wet treatment
nozzle containing
treatment nozzle
wet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60006014T
Other languages
English (en)
Other versions
DE60006014T2 (de
Inventor
Shoichi Ono
Kenichi Mitsumori
Yasuhiko Kasama
Nobuaki Haga
Junichiro Soejima
Norihisa Takahashi
Akio Fujie
Mineo Iwasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Application granted granted Critical
Publication of DE60006014D1 publication Critical patent/DE60006014D1/de
Publication of DE60006014T2 publication Critical patent/DE60006014T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Liquid Crystal (AREA)
DE60006014T 1999-03-10 2000-03-07 Ultraschallreiniger und diesen enthaltende Nassbehandlungsdüse Expired - Lifetime DE60006014T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP6310299 1999-03-10
JP06310299A JP3806537B2 (ja) 1999-03-10 1999-03-10 超音波洗浄機及びそれを具備するウエット処理ノズル

Publications (2)

Publication Number Publication Date
DE60006014D1 true DE60006014D1 (de) 2003-11-27
DE60006014T2 DE60006014T2 (de) 2004-06-24

Family

ID=13219605

Family Applications (2)

Application Number Title Priority Date Filing Date
DE60006014T Expired - Lifetime DE60006014T2 (de) 1999-03-10 2000-03-07 Ultraschallreiniger und diesen enthaltende Nassbehandlungsdüse
DE60017614T Expired - Lifetime DE60017614T2 (de) 1999-03-10 2000-03-07 Ultraschallreiniger und diesen enthaltende Nassbehandlungsdüse

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE60017614T Expired - Lifetime DE60017614T2 (de) 1999-03-10 2000-03-07 Ultraschallreiniger und diesen enthaltende Nassbehandlungsdüse

Country Status (7)

Country Link
US (2) US6644327B1 (de)
EP (2) EP1321198B1 (de)
JP (1) JP3806537B2 (de)
KR (1) KR100375184B1 (de)
CN (2) CN1165972C (de)
DE (2) DE60006014T2 (de)
TW (1) TW449821B (de)

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US6729339B1 (en) * 2002-06-28 2004-05-04 Lam Research Corporation Method and apparatus for cooling a resonator of a megasonic transducer
JP2006095461A (ja) * 2004-09-30 2006-04-13 Honda Electronic Co Ltd 超音波洗浄装置
DE102004053337A1 (de) * 2004-11-04 2006-05-11 Steag Hama Tech Ag Verfahren und Vorrichtung zum Behandeln von Substraten und Düseneinheit hierfür
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US20070034227A1 (en) * 2005-08-15 2007-02-15 Harris Corporation Ultrasonic device for cleaning connectors
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US20070157791A1 (en) * 2005-12-21 2007-07-12 Kenneth Mazursky Methods for infusing matter with vibration
US8327861B2 (en) * 2006-12-19 2012-12-11 Lam Research Corporation Megasonic precision cleaning of semiconductor process equipment components and parts
GB201003750D0 (en) * 2010-03-08 2010-04-21 Hoover Ltd Vacuum cleaner
CN102151671A (zh) * 2011-02-15 2011-08-17 济南巴克超声波科技有限公司 超声波清洗机
KR101575001B1 (ko) 2014-04-04 2015-12-07 (주) 경일메가소닉 패널 세정용 수막 구조형 초음파 샤워 노즐 장치
CN105405792B (zh) * 2015-11-24 2018-08-03 如皋市大昌电子有限公司 一种二极管清洗槽
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US11910815B2 (en) * 2019-12-02 2024-02-27 Pepsico, Inc. Device and method for nucleation of a supercooled beverage
CN111166267A (zh) * 2019-12-30 2020-05-19 华帝股份有限公司 一种洗碗机的洗涤控制方法及洗碗机
JP2022068575A (ja) * 2020-10-22 2022-05-10 株式会社ディスコ 洗浄装置
CN112676254B (zh) * 2020-12-09 2022-03-18 深圳市富吉真空技术有限公司 一种用于铣刀的超声波清洗装置

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Also Published As

Publication number Publication date
US7523524B2 (en) 2009-04-28
US6644327B1 (en) 2003-11-11
KR100375184B1 (ko) 2003-03-08
DE60017614T2 (de) 2005-12-22
CN1165972C (zh) 2004-09-08
EP1321198A2 (de) 2003-06-25
EP1034850A2 (de) 2000-09-13
EP1034850B1 (de) 2003-10-22
DE60006014T2 (de) 2004-06-24
CN1522801A (zh) 2004-08-25
CN1267084A (zh) 2000-09-20
JP2000254606A (ja) 2000-09-19
JP3806537B2 (ja) 2006-08-09
EP1034850A3 (de) 2000-09-20
CN1235686C (zh) 2006-01-11
DE60017614D1 (de) 2005-02-24
US20040035451A1 (en) 2004-02-26
EP1321198A3 (de) 2003-07-02
EP1321198B1 (de) 2005-01-19
KR20010014555A (ko) 2001-02-26
TW449821B (en) 2001-08-11

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition