DE60030642D1 - Nassbehandlungsdüse, Düsevorrichtung und Nassbehanlungsvorrichtung - Google Patents

Nassbehandlungsdüse, Düsevorrichtung und Nassbehanlungsvorrichtung

Info

Publication number
DE60030642D1
DE60030642D1 DE60030642T DE60030642T DE60030642D1 DE 60030642 D1 DE60030642 D1 DE 60030642D1 DE 60030642 T DE60030642 T DE 60030642T DE 60030642 T DE60030642 T DE 60030642T DE 60030642 D1 DE60030642 D1 DE 60030642D1
Authority
DE
Germany
Prior art keywords
nozzle
wet treatment
wet
treatment device
nozzle device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60030642T
Other languages
English (en)
Other versions
DE60030642T2 (de
Inventor
Nobuaki Haga
Kenichi Mitsumori
Yasuhiko Kasama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaijo Corp
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Kaijo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd, Kaijo Corp filed Critical Alps Electric Co Ltd
Publication of DE60030642D1 publication Critical patent/DE60030642D1/de
Application granted granted Critical
Publication of DE60030642T2 publication Critical patent/DE60030642T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Weting (AREA)
DE60030642T 1999-08-13 2000-08-11 Nassbehandlungsdüse, Düsevorrichtung und Nassbehanlungsvorrichtung Expired - Lifetime DE60030642T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP22949799 1999-08-13
JP22949799A JP4215900B2 (ja) 1999-08-13 1999-08-13 ウェット処理用ノズル装置およびウェット処理装置

Publications (2)

Publication Number Publication Date
DE60030642D1 true DE60030642D1 (de) 2006-10-26
DE60030642T2 DE60030642T2 (de) 2007-09-13

Family

ID=16893107

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60030642T Expired - Lifetime DE60030642T2 (de) 1999-08-13 2000-08-11 Nassbehandlungsdüse, Düsevorrichtung und Nassbehanlungsvorrichtung

Country Status (5)

Country Link
EP (1) EP1076356B1 (de)
JP (1) JP4215900B2 (de)
KR (1) KR100385906B1 (de)
DE (1) DE60030642T2 (de)
TW (1) TW478973B (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3970567B2 (ja) * 2001-09-17 2007-09-05 アルプス電気株式会社 ウェット処理装置
US6988326B2 (en) * 2002-09-30 2006-01-24 Lam Research Corporation Phobic barrier meniscus separation and containment
KR20040029578A (ko) * 2002-10-01 2004-04-08 주식회사 실트론 초음파 세정기를 이용한 웨이퍼 세정 장치
US6867844B2 (en) 2003-06-19 2005-03-15 Asml Holding N.V. Immersion photolithography system and method using microchannel nozzles
DE102004053337A1 (de) * 2004-11-04 2006-05-11 Steag Hama Tech Ag Verfahren und Vorrichtung zum Behandeln von Substraten und Düseneinheit hierfür
JP4755573B2 (ja) 2006-11-30 2011-08-24 東京応化工業株式会社 処理装置および処理方法、ならびに表面処理治具
JP5038695B2 (ja) * 2006-11-30 2012-10-03 東京応化工業株式会社 処理装置および表面処理治具
JP4171039B2 (ja) 2006-12-22 2008-10-22 株式会社コナミデジタルエンタテインメント ゲーム装置、ゲーム装置の制御方法及びプログラム
US8141566B2 (en) * 2007-06-19 2012-03-27 Lam Research Corporation System, method and apparatus for maintaining separation of liquids in a controlled meniscus
JP5734705B2 (ja) * 2011-03-02 2015-06-17 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP5227441B2 (ja) * 2011-04-18 2013-07-03 東京応化工業株式会社 処理装置
US20130052360A1 (en) * 2011-08-30 2013-02-28 Tadashi Maegawa Substrate processing apparatus, substrate processing method, and nozzle
JP6558845B2 (ja) * 2014-10-10 2019-08-14 株式会社ホロン 被洗浄体の異物除去装置およびその異物除去方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE8703114U1 (de) * 1987-02-25 1987-04-09 Schering Ag, 1000 Berlin Und 4709 Bergkamen, De
JP3511442B2 (ja) * 1996-12-18 2004-03-29 忠弘 大見 洗浄やエッチング、現像、剥離等を含むウエット処理に用いる省液型の液体供給ノズル、省液型の液体供給ノズル装置及びウエット処理装置
JPH1133506A (ja) * 1997-07-24 1999-02-09 Tadahiro Omi 流体処理装置及び洗浄処理システム

Also Published As

Publication number Publication date
TW478973B (en) 2002-03-11
JP2001053046A (ja) 2001-02-23
EP1076356A2 (de) 2001-02-14
EP1076356A3 (de) 2003-01-29
EP1076356B1 (de) 2006-09-13
DE60030642T2 (de) 2007-09-13
KR100385906B1 (ko) 2003-06-02
KR20010039809A (ko) 2001-05-15
JP4215900B2 (ja) 2009-01-28

Similar Documents

Publication Publication Date Title
DE69924155D1 (de) Fluoren-copolymere und daraus hergestellte vorrichtungen
ATE325214T1 (de) Textilbehandlungsvorrichtung
DE60012680D1 (de) Düseneinrichtung
DE60033055D1 (de) Bandscheibenbehandlungsvorrichtung
DE69933706D1 (de) Kommunikations vorrichtung und steckeinheit
DE60113770D1 (de) Reinigungsdüse und Reinigungsgerät
NO20012170D0 (no) Selvstendig, transportabel blodbehandlingsinnretning
DE29908106U1 (de) Erotikgerät
FI20000863A (fi) Uusi hoitomenetelmä
DE50010609D1 (de) Sport-trainings-vorrichtung sowie sport-trainings-system
DE50008281D1 (de) Spinnvorrichtung
DE60017614D1 (de) Ultraschallreiniger und diesen enthaltende Nassbehandlungsdüse
DE60009402D1 (de) Spinnvorrichtung und Spinnverfahren
ATE269391T1 (de) Wäschebehandlung
DE60030642D1 (de) Nassbehandlungsdüse, Düsevorrichtung und Nassbehanlungsvorrichtung
NO20013337D0 (no) Ny behandling
DE60033602D1 (de) Druckverfahren und Druckgerät
DE60045809D1 (de) Druckvorrichtung und Druckverfahren
DE50005409D1 (de) Hör-behandlungsgerät
DE60003114D1 (de) Laserbehandlungsvorrichtung
IT1310962B1 (it) Apparecchio asciuga-capelli perfezionato.
DE60023003D1 (de) Haarbehandlungsmittel
DK1176991T3 (da) Keramisk sårbehandlingsanordning
DE69932577D1 (de) Stangenbehandlungsgerät und Stangenladegerät
ATE244992T1 (de) Sprühvorrichtung

Legal Events

Date Code Title Description
8381 Inventor (new situation)

Inventor name: MITSUMORI, KENICHI, SENDAI-SHI, MIYAGI-KEN, JP

Inventor name: HAGA, NOBUAKI, SENDAI-SHI, MIYAGI-KEN, JP

Inventor name: KASAMA, YASUHIKO, SENDAI-SHI, MIYAGI-KEN, JP

8364 No opposition during term of opposition