DE60005412D1 - Verfahren sowie Vorrichtung zum Schneiden mittels Ultraschallschwingungen - Google Patents

Verfahren sowie Vorrichtung zum Schneiden mittels Ultraschallschwingungen

Info

Publication number
DE60005412D1
DE60005412D1 DE60005412T DE60005412T DE60005412D1 DE 60005412 D1 DE60005412 D1 DE 60005412D1 DE 60005412 T DE60005412 T DE 60005412T DE 60005412 T DE60005412 T DE 60005412T DE 60005412 D1 DE60005412 D1 DE 60005412D1
Authority
DE
Germany
Prior art keywords
cutting
ultrasonic vibration
rotation unit
vibration rotation
ultrasonic vibrations
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60005412T
Other languages
English (en)
Other versions
DE60005412T2 (de
Inventor
Shigeru Sato
Ryoichi Ishii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ultex Corp
Original Assignee
Ultex Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ultex Corp filed Critical Ultex Corp
Application granted granted Critical
Publication of DE60005412D1 publication Critical patent/DE60005412D1/de
Publication of DE60005412T2 publication Critical patent/DE60005412T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/08—Means for treating work or cutting member to facilitate cutting
    • B26D7/086—Means for treating work or cutting member to facilitate cutting by vibrating, e.g. ultrasonically
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S83/00—Cutting
    • Y10S83/956—Ultrasonic
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes
    • Y10T83/0505—With reorientation of work between cuts
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/364—By fluid blast and/or suction
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/525—Operation controlled by detector means responsive to work
    • Y10T83/536—Movement of work controlled
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/525—Operation controlled by detector means responsive to work
    • Y10T83/538—Positioning of tool controlled
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/768—Rotatable disc tool pair or tool and carrier
    • Y10T83/7793—Means to rotate or oscillate tool
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/929—Tool or tool with support
    • Y10T83/9372—Rotatable type
    • Y10T83/9377—Mounting of tool about rod-type shaft
    • Y10T83/9379—At end of shaft

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
  • Dicing (AREA)
  • Nonmetal Cutting Devices (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
DE60005412T 1999-01-21 2000-01-20 Verfahren sowie Vorrichtung zum Schneiden mittels Ultraschallschwingungen Expired - Fee Related DE60005412T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP01293099A JP3469488B2 (ja) 1999-01-21 1999-01-21 超音波振動切断装置
JP1293099 1999-01-21

Publications (2)

Publication Number Publication Date
DE60005412D1 true DE60005412D1 (de) 2003-10-30
DE60005412T2 DE60005412T2 (de) 2004-05-06

Family

ID=11819030

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60005412T Expired - Fee Related DE60005412T2 (de) 1999-01-21 2000-01-20 Verfahren sowie Vorrichtung zum Schneiden mittels Ultraschallschwingungen

Country Status (9)

Country Link
US (1) US6250188B1 (de)
EP (1) EP1022100B1 (de)
JP (1) JP3469488B2 (de)
KR (1) KR100390250B1 (de)
CN (1) CN1143762C (de)
AT (1) ATE250487T1 (de)
CA (1) CA2296621A1 (de)
DE (1) DE60005412T2 (de)
TW (1) TW440484B (de)

Families Citing this family (58)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3469516B2 (ja) * 1999-12-09 2003-11-25 株式会社アルテクス 超音波振動切断用ツール及びその製造方法
JP3892703B2 (ja) 2001-10-19 2007-03-14 富士通株式会社 半導体基板用治具及びこれを用いた半導体装置の製造方法
US20060032332A1 (en) * 2003-03-13 2006-02-16 Kazumasa Ohnishi Cutting tool and cutting machine
DE10316789A1 (de) * 2003-04-11 2004-10-28 Branson Ultraschall Niederlassung Der Emerson Technologies Gmbh & Co Schneidsonotrode für eine Ultraschall-Schneidmaschine
FR2857614B1 (fr) * 2003-07-17 2005-08-19 Saint Gobain Procede de decoupe d'un film fonctionnel en matiere plastique, applique sur un substrat, tel qu'une plaque de verre
DE102004022313B3 (de) * 2004-05-04 2005-10-20 Stapla Ultraschalltechnik Gmbh Vorrichtung und Verfahren zum fluiddichten Dichtschweißen eines Rohrabschnittes
JP4549818B2 (ja) * 2004-11-10 2010-09-22 株式会社ディスコ 振幅測定方法
JP4549822B2 (ja) * 2004-11-17 2010-09-22 株式会社ディスコ 超音波振動切削装置
JP2006156481A (ja) * 2004-11-25 2006-06-15 Disco Abrasive Syst Ltd 超音波振動切削装置
JP2006228831A (ja) * 2005-02-15 2006-08-31 Disco Abrasive Syst Ltd 超音波振動切削装置
JP2006318981A (ja) * 2005-05-10 2006-11-24 Disco Abrasive Syst Ltd 超音波振動切削装置
JP4754874B2 (ja) * 2005-05-13 2011-08-24 株式会社ディスコ 超音波振動切削装置
JP4693529B2 (ja) * 2005-07-11 2011-06-01 株式会社ディスコ 超音波振動切削装置および超音波振動切削装置に用いられる取付補助治具
JP4658730B2 (ja) * 2005-07-28 2011-03-23 株式会社ディスコ 切削装置
JP4847069B2 (ja) * 2005-08-19 2011-12-28 株式会社ディスコ 切削装置
JP4763389B2 (ja) * 2005-09-05 2011-08-31 株式会社ディスコ 切削工具
JP4740697B2 (ja) * 2005-09-05 2011-08-03 株式会社ディスコ 超音波振動切削装置
JP4750519B2 (ja) 2005-09-16 2011-08-17 株式会社ディスコ 切削方法および切削装置
KR101153196B1 (ko) * 2005-10-04 2012-06-18 니혼쇼료쿠키카이 가부시키가이샤 초음파 트림장치
JP4847093B2 (ja) * 2005-10-19 2011-12-28 株式会社ディスコ 切削工具
KR101440647B1 (ko) * 2006-10-05 2014-09-22 티에치케이 가부시끼가이샤 스크라이브 장치
JP5020963B2 (ja) * 2006-10-17 2012-09-05 一正 大西 円盤状の切削工具及び切削装置
JP5139720B2 (ja) * 2007-06-05 2013-02-06 株式会社ディスコ 切削装置
CN101767238B (zh) * 2009-09-22 2011-08-03 西安航空发动机（集团）有限公司 一种用于精密零件多余钎料的修抛装置
ITBO20100519A1 (it) * 2010-08-11 2012-02-12 Swisslog Italia Spa Dispositivo e procedimento per singolarizzare prodotti
CN102729102A (zh) * 2012-06-28 2012-10-17 昆山市兴保泰精工科技有限公司 一种六轴联动数控研磨机
DE102014206289A1 (de) * 2014-04-02 2015-10-08 Robert Bosch Gmbh Handwerkzeugsystem, Verfahren zum Betreiben
CN103934732B (zh) * 2014-05-13 2016-03-30 航天科工哈尔滨风华有限公司 氧化铝陶瓷材料带轴薄壁凸球面结构的旋转超声磨削加工方法
TWI523718B (zh) * 2014-08-21 2016-03-01 周振嘉 應用於超音波加工的工具單元
TW201632272A (zh) * 2015-03-04 2016-09-16 中原大學 超音波輔助加工感測及傳動系統
CN105234679A (zh) * 2015-10-30 2016-01-13 江苏苏中电信器材有限公司 一种自动走线架成型装置
US10549443B2 (en) * 2016-02-04 2020-02-04 The Boeing Company Ultrasonic cutting machine with automated blade cleaning system
CN105945657A (zh) * 2016-06-22 2016-09-21 河源市新天彩科技有限公司 一种多功能超声振动磨削机构
CN106346557B (zh) * 2016-08-30 2018-10-19 烟台正海合泰科技股份有限公司 带有前端包边结构的一步湿法天窗遮阳板的水切割方法
DE102016217251A1 (de) * 2016-09-09 2018-03-15 Sauer Gmbh Verfahren zum Bearbeiten eines Werkstücks aus Hartmetall für die Herstellung eines Werkzeuggrundkörpers an einer numerisch gesteuerten Werkzeugmaschine mit werkzeugtragender Arbeitsspindel
JP6937132B2 (ja) * 2017-02-10 2021-09-22 株式会社高田工業所 超音波振動回転切断装置
CN107309941A (zh) * 2017-07-13 2017-11-03 深圳市志凌伟业技术股份有限公司 塑胶壳体的孔槽加工方法
RU2661157C1 (ru) * 2017-11-07 2018-07-12 Александр Сергеевич Иванов Устройство для резки тонкостенных бумажных труб с использованием ультразвуковых колебаний ножа
TWI657869B (zh) * 2018-03-21 2019-05-01 賴振維 超音波加工裝置及其振動單元
CN108468541B (zh) * 2018-04-24 2024-03-26 中国石油天然气集团有限公司 一种钻井模拟装置及方法
CN108515708B (zh) * 2018-05-03 2024-05-24 厦门市中可医疗科技有限公司 一种双工位试纸剪裁且上料机构
CN108655956B (zh) * 2018-07-03 2023-12-29 浙江杭机铸造有限公司 一种金属铸件加工用冷却液循环利用装置
CN108857037B (zh) * 2018-08-03 2024-01-26 辽宁工业大学 一种兆赫级高频超声波焊接装置及其方法
CN109129145A (zh) * 2018-10-19 2019-01-04 南充市龙煌建材有限公司 建筑废旧木条水泥杂质去除机
CA3027620A1 (fr) * 2018-12-13 2020-06-13 Hydro-Quebec Coupe de metaux mous par assistance ultrasonore
CN111715992A (zh) * 2019-03-22 2020-09-29 必能信超声(上海)有限公司 线束切割方法、装置及超声波焊接机
CN110181155A (zh) * 2019-07-01 2019-08-30 厦门大学 等离子切割装置
JP6757837B1 (ja) 2019-08-30 2020-09-23 株式会社高田工業所 超音波共振体の支持構造及び超音波振動加工装置
CN110508920B (zh) * 2019-09-19 2024-04-26 东莞市新玛博创超声波科技有限公司 一种脉冲电流发热的超声焊接装置
CN115702069A (zh) * 2020-06-23 2023-02-14 株式会社荏原制作所 超声波加工装置和超声波切削装置
JP7497239B2 (ja) * 2020-06-23 2024-06-10 株式会社荏原製作所 超音波切削装置
KR20220051102A (ko) * 2020-10-16 2022-04-26 삼성디스플레이 주식회사 필름 절단 장치, 이를 이용한 필름 절단 방법, 및 이에 의해 절단된 회로 필름을 포함하는 표시 장치
CN112658818B (zh) * 2020-12-19 2022-04-08 华中科技大学 一种用于晶圆超精密加工的超声振动辅助磨削装置
TWI811863B (zh) * 2021-11-24 2023-08-11 蔡國志 加工機高解析監控系統及方法
CN114310546A (zh) * 2022-01-05 2022-04-12 苏州明志科技股份有限公司 一种柔性清理铸件毛坯的打磨轴
CN114770781B (zh) * 2022-06-22 2022-10-14 成都泰美克晶体技术有限公司 一种sc晶片改弦定位装置及其使用方法
CN117029357B (zh) * 2023-10-09 2023-12-29 托伦斯半导体设备启东有限公司 一种半导体等级真空多层冷盘
CN117283730A (zh) * 2023-11-27 2023-12-26 苏州特斯特半导体设备有限公司 一种超声波划切工艺

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5935743B2 (ja) * 1979-01-24 1984-08-30 株式会社井上ジャパックス研究所 超音波研削加工装置
US4401001A (en) * 1980-07-10 1983-08-30 Gerber Garment Technology, Inc. Apparatus for cutting sheet material with a cutting wheel
JPS63139649A (ja) * 1986-12-03 1988-06-11 Shibayama Kikai Kk 超音波スピンドル加工機
JPH02113907A (ja) * 1988-10-24 1990-04-26 Tokyo Seimitsu Co Ltd ダイシング方法及びその装置
US5177902A (en) * 1990-08-08 1993-01-12 Oki Electric Industry Co., Ltd. Ultrasonic grinder system for ceramic filter and trimming method therefor
DE59205467D1 (de) * 1991-10-30 1996-04-04 Gfm Fertigungstechnik Verfahren und Schneidaggregat zum Herstellen räumlicher Formstücke aus einem vorgefertigten Block eines grossporigen Materials
JPH0679689A (ja) * 1992-09-03 1994-03-22 Fujitsu Ltd プリント基板分割機
US5655956A (en) * 1995-05-23 1997-08-12 University Of Illinois At Urbana-Champaign Rotary ultrasonic grinding apparatus and process
FR2735412B1 (fr) * 1995-06-19 1997-08-22 Unir Ultra Propre Nutrition In Dispositif de decoupage par ultrasons
JPH09216201A (ja) * 1996-02-14 1997-08-19 Synx Kk 丸のこ切断装置

Also Published As

Publication number Publication date
CN1143762C (zh) 2004-03-31
JP2000210928A (ja) 2000-08-02
TW440484B (en) 2001-06-16
ATE250487T1 (de) 2003-10-15
CN1261568A (zh) 2000-08-02
DE60005412T2 (de) 2004-05-06
KR100390250B1 (ko) 2003-07-04
JP3469488B2 (ja) 2003-11-25
EP1022100B1 (de) 2003-09-24
CA2296621A1 (en) 2000-07-21
EP1022100A1 (de) 2000-07-26
KR20000057784A (ko) 2000-09-25
US6250188B1 (en) 2001-06-26

Similar Documents

Publication Publication Date Title
DE60005412D1 (de) Verfahren sowie Vorrichtung zum Schneiden mittels Ultraschallschwingungen
DE68900358D1 (de) Schneidgeraet.
ATE414974T1 (de) Verfahren und vorrichtung zur positionieren kleiner partikel in einer flüssigkeit
DE69102087D1 (de) Schnittiefeneinstellvorrichtung für tragbare Kreissägen.
DE60129458D1 (de) Verfahren und vorrichtung zur schwingungsdämpfung in einem schneidwerkzeug
DE59102099D1 (de) Sägeaggregat für vertikale Plattensäge.
DE69908467D1 (de) Flüssigkeitsgefüllte, aktive schwingungsdämpfende Vorrichtung mit einem oszillierenden, durch Impulssignale gesteuerten Bauteil
ATE396846T1 (de) Schneidvorrichtung mit elastisch deformierbarem stützring
DE50206836D1 (de) Vorrichtung zur dämpfung von drehschwingungen
ATE99214T1 (de) Schneidvorrichtung.
ATE450351T1 (de) Tragbares schneidwerkzeug
ATE523265T1 (de) Vorrichtung zum ultraschallbearbeiten eines werkstücks
ATE294677T1 (de) Vorrichtung zum aufschneiden von lebensmittelprodukten
DE69900166T2 (de) Vorrichtung zum Antrieb einer Schraubspindel durch Ultraschallschwingung
EP1080858A3 (de) Rüttelantrieb
FR2861004B1 (fr) Dispositif porte-piece
DE50202915D1 (de) Verfahren und Vorrichtung zum Abtrennen eines eingebauten Schachtrahmens
ATE295768T1 (de) Motorische schneidevorrichtung
CA2098013A1 (en) Sawdust removing device in sawing machine
DE502005000657D1 (de) Sägevorrichtung für Baumstämme mit einer Auflagefläche und einer verstellbaren Anschlagkonsole
DE60311601D1 (de) Vorrichtung zum Anfasen von Filz
DE502007000229D1 (de) Werkstückspanneinrichtung mit Werkzeugträger
ATE395582T1 (de) Gerät und verfahren zur exzentrischen verarbeitung
JPH11239913A (ja) 丸鋸用定規
EP0838296A3 (de) Sägemaschine mit Vorrichtung zur Entfernen von Sägespänen

Legal Events

Date Code Title Description
8339 Ceased/non-payment of the annual fee