ATE250487T1 - Verfahren sowie vorrichtung zum schneiden mittels ultraschallschwingungen - Google Patents

Verfahren sowie vorrichtung zum schneiden mittels ultraschallschwingungen

Info

Publication number
ATE250487T1
ATE250487T1 AT00101114T AT00101114T ATE250487T1 AT E250487 T1 ATE250487 T1 AT E250487T1 AT 00101114 T AT00101114 T AT 00101114T AT 00101114 T AT00101114 T AT 00101114T AT E250487 T1 ATE250487 T1 AT E250487T1
Authority
AT
Austria
Prior art keywords
cutting
ultrasonic vibration
rotation unit
vibration rotation
ultrasonic vibrations
Prior art date
Application number
AT00101114T
Other languages
English (en)
Inventor
Shigeru C O Ultex Corpora Sato
Ryoichi C O Ultex Corpor Ishii
Hakata-Ku
Original Assignee
Ultex Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ultex Corp filed Critical Ultex Corp
Application granted granted Critical
Publication of ATE250487T1 publication Critical patent/ATE250487T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/08—Means for treating work or cutting member to facilitate cutting
    • B26D7/086—Means for treating work or cutting member to facilitate cutting by vibrating, e.g. ultrasonically
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S83/00—Cutting
    • Y10S83/956—Ultrasonic
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes
    • Y10T83/0505—With reorientation of work between cuts
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/364—By fluid blast and/or suction
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/525—Operation controlled by detector means responsive to work
    • Y10T83/536—Movement of work controlled
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/525—Operation controlled by detector means responsive to work
    • Y10T83/538—Positioning of tool controlled
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/768—Rotatable disc tool pair or tool and carrier
    • Y10T83/7793—Means to rotate or oscillate tool
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/929—Tool or tool with support
    • Y10T83/9372—Rotatable type
    • Y10T83/9377—Mounting of tool about rod-type shaft
    • Y10T83/9379—At end of shaft

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
  • Dicing (AREA)
  • Nonmetal Cutting Devices (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
AT00101114T 1999-01-21 2000-01-20 Verfahren sowie vorrichtung zum schneiden mittels ultraschallschwingungen ATE250487T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP01293099A JP3469488B2 (ja) 1999-01-21 1999-01-21 超音波振動切断装置

Publications (1)

Publication Number Publication Date
ATE250487T1 true ATE250487T1 (de) 2003-10-15

Family

ID=11819030

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00101114T ATE250487T1 (de) 1999-01-21 2000-01-20 Verfahren sowie vorrichtung zum schneiden mittels ultraschallschwingungen

Country Status (9)

Country Link
US (1) US6250188B1 (de)
EP (1) EP1022100B1 (de)
JP (1) JP3469488B2 (de)
KR (1) KR100390250B1 (de)
CN (1) CN1143762C (de)
AT (1) ATE250487T1 (de)
CA (1) CA2296621A1 (de)
DE (1) DE60005412T2 (de)
TW (1) TW440484B (de)

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JP3469516B2 (ja) * 1999-12-09 2003-11-25 株式会社アルテクス 超音波振動切断用ツール及びその製造方法
JP3892703B2 (ja) 2001-10-19 2007-03-14 富士通株式会社 半導体基板用治具及びこれを用いた半導体装置の製造方法
US20060032332A1 (en) * 2003-03-13 2006-02-16 Kazumasa Ohnishi Cutting tool and cutting machine
DE10316789A1 (de) * 2003-04-11 2004-10-28 Branson Ultraschall Niederlassung Der Emerson Technologies Gmbh & Co Schneidsonotrode für eine Ultraschall-Schneidmaschine
FR2857614B1 (fr) * 2003-07-17 2005-08-19 Saint Gobain Procede de decoupe d'un film fonctionnel en matiere plastique, applique sur un substrat, tel qu'une plaque de verre
DE102004022313B3 (de) * 2004-05-04 2005-10-20 Stapla Ultraschalltechnik Gmbh Vorrichtung und Verfahren zum fluiddichten Dichtschweißen eines Rohrabschnittes
JP4549818B2 (ja) * 2004-11-10 2010-09-22 株式会社ディスコ 振幅測定方法
JP4549822B2 (ja) * 2004-11-17 2010-09-22 株式会社ディスコ 超音波振動切削装置
JP2006156481A (ja) * 2004-11-25 2006-06-15 Disco Abrasive Syst Ltd 超音波振動切削装置
JP2006228831A (ja) * 2005-02-15 2006-08-31 Disco Abrasive Syst Ltd 超音波振動切削装置
JP2006318981A (ja) * 2005-05-10 2006-11-24 Disco Abrasive Syst Ltd 超音波振動切削装置
JP4754874B2 (ja) * 2005-05-13 2011-08-24 株式会社ディスコ 超音波振動切削装置
JP4693529B2 (ja) * 2005-07-11 2011-06-01 株式会社ディスコ 超音波振動切削装置および超音波振動切削装置に用いられる取付補助治具
JP4658730B2 (ja) * 2005-07-28 2011-03-23 株式会社ディスコ 切削装置
JP4847069B2 (ja) * 2005-08-19 2011-12-28 株式会社ディスコ 切削装置
JP4763389B2 (ja) * 2005-09-05 2011-08-31 株式会社ディスコ 切削工具
JP4740697B2 (ja) * 2005-09-05 2011-08-03 株式会社ディスコ 超音波振動切削装置
JP4750519B2 (ja) * 2005-09-16 2011-08-17 株式会社ディスコ 切削方法および切削装置
US8277282B2 (en) * 2005-10-04 2012-10-02 Nihon Shoryoku Kikai Co., Ltd. Ultrasonic trimming apparatus and ultrasonic trimming method
JP4847093B2 (ja) * 2005-10-19 2011-12-28 株式会社ディスコ 切削工具
CN101522383B (zh) * 2006-10-05 2013-01-30 Thk株式会社 划线装置及划线方法
WO2008047790A1 (en) * 2006-10-17 2008-04-24 Kazumasa Ohnishi Disklike cutting tool and cutting device
JP5139720B2 (ja) * 2007-06-05 2013-02-06 株式会社ディスコ 切削装置
CN101767238B (zh) * 2009-09-22 2011-08-03 西安航空发动机（集团）有限公司 一种用于精密零件多余钎料的修抛装置
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CN103934732B (zh) * 2014-05-13 2016-03-30 航天科工哈尔滨风华有限公司 氧化铝陶瓷材料带轴薄壁凸球面结构的旋转超声磨削加工方法
TWI523718B (zh) * 2014-08-21 2016-03-01 周振嘉 應用於超音波加工的工具單元
TW201632272A (zh) * 2015-03-04 2016-09-16 中原大學 超音波輔助加工感測及傳動系統
CN105234679A (zh) * 2015-10-30 2016-01-13 江苏苏中电信器材有限公司 一种自动走线架成型装置
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CN105945657A (zh) * 2016-06-22 2016-09-21 河源市新天彩科技有限公司 一种多功能超声振动磨削机构
CN106346557B (zh) * 2016-08-30 2018-10-19 烟台正海合泰科技股份有限公司 带有前端包边结构的一步湿法天窗遮阳板的水切割方法
DE102016217251A1 (de) * 2016-09-09 2018-03-15 Sauer Gmbh Verfahren zum Bearbeiten eines Werkstücks aus Hartmetall für die Herstellung eines Werkzeuggrundkörpers an einer numerisch gesteuerten Werkzeugmaschine mit werkzeugtragender Arbeitsspindel
JP6937132B2 (ja) * 2017-02-10 2021-09-22 株式会社高田工業所 超音波振動回転切断装置
CN107309941A (zh) * 2017-07-13 2017-11-03 深圳市志凌伟业技术股份有限公司 塑胶壳体的孔槽加工方法
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TWI657869B (zh) * 2018-03-21 2019-05-01 賴振維 超音波加工裝置及其振動單元
CN108468541B (zh) * 2018-04-24 2024-03-26 中国石油天然气集团有限公司 一种钻井模拟装置及方法
CN108515708B (zh) * 2018-05-03 2024-05-24 厦门市中可医疗科技有限公司 一种双工位试纸剪裁且上料机构
CN108655956B (zh) * 2018-07-03 2023-12-29 浙江杭机铸造有限公司 一种金属铸件加工用冷却液循环利用装置
CN108857037B (zh) * 2018-08-03 2024-01-26 辽宁工业大学 一种兆赫级高频超声波焊接装置及其方法
CN109129145A (zh) * 2018-10-19 2019-01-04 南充市龙煌建材有限公司 建筑废旧木条水泥杂质去除机
CA3027620A1 (fr) * 2018-12-13 2020-06-13 Hydro-Quebec Coupe de metaux mous par assistance ultrasonore
CN111715992A (zh) * 2019-03-22 2020-09-29 必能信超声(上海)有限公司 线束切割方法、装置及超声波焊接机
CN110181155B (zh) * 2019-07-01 2024-07-23 厦门大学 等离子切割装置
JP6757837B1 (ja) 2019-08-30 2020-09-23 株式会社高田工業所 超音波共振体の支持構造及び超音波振動加工装置
CN110508920B (zh) * 2019-09-19 2024-04-26 东莞市新玛博创超声波科技有限公司 一种脉冲电流发热的超声焊接装置
JP7497239B2 (ja) * 2020-06-23 2024-06-10 株式会社荏原製作所 超音波切削装置
WO2021261291A1 (ja) * 2020-06-23 2021-12-30 株式会社荏原製作所 超音波加工装置及び超音波切削装置
JP2022034487A (ja) * 2020-08-18 2022-03-03 株式会社荏原製作所 超音波切削装置
JP7536399B2 (ja) * 2020-08-21 2024-08-20 株式会社ディスコ 切削方法
KR102846515B1 (ko) 2020-09-14 2025-08-18 주식회사 엘지에너지솔루션 초음파 절삭기를 포함하는 전극조립체 제조장치 및 이를 이용한 전극조립체 제조방법
KR20220051102A (ko) * 2020-10-16 2022-04-26 삼성디스플레이 주식회사 필름 절단 장치, 이를 이용한 필름 절단 방법, 및 이에 의해 절단된 회로 필름을 포함하는 표시 장치
CN112658818B (zh) * 2020-12-19 2022-04-08 华中科技大学 一种用于晶圆超精密加工的超声振动辅助磨削装置
CN113957697B (zh) * 2021-11-04 2025-01-21 长沙市雄晟机械科技有限公司 无纺布超声波切割设备
TWI811863B (zh) * 2021-11-24 2023-08-11 蔡國志 加工機高解析監控系統及方法
CN114310546A (zh) * 2022-01-05 2022-04-12 苏州明志科技股份有限公司 一种柔性清理铸件毛坯的打磨轴
KR102742840B1 (ko) * 2022-02-14 2024-12-16 주식회사 저스템 신속진단기의 조립장치 및 조립방법
CN114770781B (zh) * 2022-06-22 2022-10-14 成都泰美克晶体技术有限公司 一种sc晶片改弦定位装置及其使用方法
CN115139359B (zh) * 2022-07-18 2024-07-16 浙江交工集团股份有限公司 一种离心式刀头管内行进切割器
DE102023109769B3 (de) 2023-04-18 2024-09-26 Contexo Gmbh Vorrichtung zum Einbringen eines Schlitzes in ein Werkstück
CN117029357B (zh) * 2023-10-09 2023-12-29 托伦斯半导体设备启东有限公司 一种半导体等级真空多层冷盘
CN117283730A (zh) * 2023-11-27 2023-12-26 苏州特斯特半导体设备有限公司 一种超声波划切工艺
CN117564788B (zh) * 2024-01-03 2026-02-03 广东天恒液压机械有限公司 一种连铸钢坯液压剪切机
CN118893721B (zh) * 2024-10-09 2024-12-13 广东科卓半导体设备有限公司 一种防崩边超声波晶圆切割系统及晶圆切割方法
CN119958911B (zh) * 2025-04-10 2025-07-01 成都市计量检定测试院 一种腐蚀性液体的计量设备
CN120245233B (zh) * 2025-06-05 2025-12-23 厦门银科启瑞半导体科技有限公司 一种晶圆透切装置及其使用方法

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Also Published As

Publication number Publication date
EP1022100A1 (de) 2000-07-26
DE60005412T2 (de) 2004-05-06
CA2296621A1 (en) 2000-07-21
CN1261568A (zh) 2000-08-02
KR20000057784A (ko) 2000-09-25
DE60005412D1 (de) 2003-10-30
CN1143762C (zh) 2004-03-31
TW440484B (en) 2001-06-16
JP3469488B2 (ja) 2003-11-25
JP2000210928A (ja) 2000-08-02
EP1022100B1 (de) 2003-09-24
KR100390250B1 (ko) 2003-07-04
US6250188B1 (en) 2001-06-26

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