DE4422216A1 - Mehrlagige metallische Leiterplatte und gegossener Baustein - Google Patents

Mehrlagige metallische Leiterplatte und gegossener Baustein

Info

Publication number
DE4422216A1
DE4422216A1 DE4422216A DE4422216A DE4422216A1 DE 4422216 A1 DE4422216 A1 DE 4422216A1 DE 4422216 A DE4422216 A DE 4422216A DE 4422216 A DE4422216 A DE 4422216A DE 4422216 A1 DE4422216 A1 DE 4422216A1
Authority
DE
Germany
Prior art keywords
circuit board
metallic
layer
metallic circuit
multilayer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE4422216A
Other languages
German (de)
English (en)
Inventor
Kenji Okamoto
Yukio Nakajima
Kazuhiko Imamura
Takao Ichihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Publication of DE4422216A1 publication Critical patent/DE4422216A1/de
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00—Products made by additive manufacturing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/045—Hierarchy auxiliary PCB, i.e. more than two levels of hierarchy for daughter PCBs are important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
DE4422216A 1993-06-25 1994-06-24 Mehrlagige metallische Leiterplatte und gegossener Baustein Ceased DE4422216A1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP18083693 1993-06-25
JP7440294 1994-03-18
JP09598594A JP3198796B2 (ja) 1993-06-25 1994-05-10 モールドモジュール

Publications (1)

Publication Number Publication Date
DE4422216A1 true DE4422216A1 (de) 1995-01-05

Family

ID=27301486

Family Applications (1)

Application Number Title Priority Date Filing Date
DE4422216A Ceased DE4422216A1 (de) 1993-06-25 1994-06-24 Mehrlagige metallische Leiterplatte und gegossener Baustein

Country Status (6)

Country Link
US (2) US5672414A (cg-RX-API-DMAC7.html)
JP (1) JP3198796B2 (cg-RX-API-DMAC7.html)
KR (1) KR950002544A (cg-RX-API-DMAC7.html)
CN (2) CN1057659C (cg-RX-API-DMAC7.html)
DE (1) DE4422216A1 (cg-RX-API-DMAC7.html)
TW (1) TW241438B (cg-RX-API-DMAC7.html)

Cited By (4)

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FR2747876A1 (fr) * 1996-04-18 1997-10-24 Int Rectifier Corp Repartition des composants d'un systeme de commande de moteur
EP0738007A3 (en) * 1995-04-12 1998-04-29 Denki Kagaku Kogyo Kabushiki Kaisha Metal-base multilayer circuit substrate
EP1715525A3 (en) * 1996-05-17 2008-01-23 Sony Corporation Solid-state imaging apparatus
DE102010043788B4 (de) 2010-11-11 2023-12-07 Siteco Gmbh Schaltungsanordnung zum Betreiben mindestens einer Lichtquelle und Verfahren zum Herstellen einer derartigen Schaltungsanordnung

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JPH09214097A (ja) * 1996-02-06 1997-08-15 Toshiba Corp プリント回路基板
DE19648205C1 (de) * 1996-11-21 1998-04-02 Hermann Stahl Gmbh Trägerplatte für eine Platine mit elektronischen Bauelementen
US6064286A (en) * 1998-07-31 2000-05-16 The Whitaker Corporation Millimeter wave module with an interconnect from an interior cavity
CN101232776B (zh) 1999-09-02 2011-04-20 揖斐电株式会社 印刷布线板
EP2081419B1 (en) 1999-09-02 2013-08-07 Ibiden Co., Ltd. Printed circuit board and method of manufacturing printed circuit board
AU767276B2 (en) * 1999-09-29 2003-11-06 Kaneka Corporation Method and apparatus for automatically soldering a lead wire to a solar battery
US6362964B1 (en) * 1999-11-17 2002-03-26 International Rectifier Corp. Flexible power assembly
US6377219B2 (en) 2000-01-11 2002-04-23 Cool Options, Inc. Composite molded antenna assembly
US6680015B2 (en) * 2000-02-01 2004-01-20 Cool Options, Inc. Method of manufacturing a heat sink assembly with overmolded carbon matrix
US6650559B1 (en) * 2000-10-31 2003-11-18 Fuji Electric Co., Ltd. Power converting device
US6680212B2 (en) * 2000-12-22 2004-01-20 Lucent Technologies Inc Method of testing and constructing monolithic multi-chip modules
TW584950B (en) 2001-12-31 2004-04-21 Megic Corp Chip packaging structure and process thereof
TW544882B (en) 2001-12-31 2003-08-01 Megic Corp Chip package structure and process thereof
TW517361B (en) 2001-12-31 2003-01-11 Megic Corp Chip package structure and its manufacture process
TW503496B (en) 2001-12-31 2002-09-21 Megic Corp Chip packaging structure and manufacturing process of the same
US6673698B1 (en) 2002-01-19 2004-01-06 Megic Corporation Thin film semiconductor package utilizing a glass substrate with composite polymer/metal interconnect layers
US6677669B2 (en) * 2002-01-18 2004-01-13 International Rectifier Corporation Semiconductor package including two semiconductor die disposed within a common clip
JP2004205262A (ja) * 2002-12-24 2004-07-22 Sony Corp ノイズ測定装置及びノイズ測定用ケーブル
KR100699823B1 (ko) * 2003-08-05 2007-03-27 삼성전자주식회사 저가형 플랙서블 필름 패키지 모듈 및 그 제조방법
US7095615B2 (en) * 2003-11-13 2006-08-22 Honeywell International, Inc. Environmentally tuned circuit card assembly and method for manufacturing the same
WO2005078796A1 (ja) 2004-02-13 2005-08-25 Murata Manufacturing Co., Ltd. 電子部品及びその製造方法
KR100716826B1 (ko) * 2005-05-10 2007-05-09 삼성전기주식회사 전자부품이 내장된 기판의 제조방법
DE102005032489B3 (de) * 2005-07-04 2006-11-16 Schweizer Electronic Ag Leiterplatten-Mehrschichtaufbau mit integriertem elektrischem Bauteil und Herstellungsverfahren
US7990727B1 (en) * 2006-04-03 2011-08-02 Aprolase Development Co., Llc Ball grid array stack
JP4842167B2 (ja) * 2007-02-07 2011-12-21 新光電気工業株式会社 多層配線基板の製造方法
JP2010176909A (ja) * 2009-01-27 2010-08-12 Panasonic Electric Works Co Ltd 放電灯点灯装置及び照明器具
JP2011023463A (ja) * 2009-07-14 2011-02-03 Denso Corp 半導体モジュール
DE102011105346A1 (de) * 2011-06-21 2012-12-27 Schweizer Electronic Ag Elektronische Baugruppe und Verfahren zu deren Herstellung
KR101330770B1 (ko) * 2011-11-16 2013-11-18 엘지이노텍 주식회사 백라이트 유닛용 절곡 인쇄회로기판
US8680663B2 (en) * 2012-01-03 2014-03-25 Taiwan Semiconductor Manufacturing Company, Ltd. Methods and apparatus for package on package devices with reduced strain
US9888568B2 (en) * 2012-02-08 2018-02-06 Crane Electronics, Inc. Multilayer electronics assembly and method for embedding electrical circuit components within a three dimensional module
CN103036221B (zh) * 2012-12-04 2015-07-08 华为技术有限公司 母线电容模块及功率单元
AT515069B1 (de) * 2013-11-07 2019-10-15 At & S Austria Tech & Systemtechnik Ag Leiterplattenstruktur
JP5954675B2 (ja) * 2014-09-26 2016-07-20 パナソニックＩｐマネジメント株式会社 両面金属張積層板の製造方法、プリント配線板の製造方法、多層積層板の製造方法、及び多層プリント配線板の製造方法
EP3258752A4 (en) * 2015-02-13 2018-10-17 Pi-Crystal Incorporation Method for forming laminated circuit board, and laminated circuit board formed using same
JP6477567B2 (ja) * 2016-03-30 2019-03-06 株式会社オートネットワーク技術研究所 回路構成体
US10787303B2 (en) 2016-05-29 2020-09-29 Cellulose Material Solutions, LLC Packaging insulation products and methods of making and using same
US11078007B2 (en) 2016-06-27 2021-08-03 Cellulose Material Solutions, LLC Thermoplastic packaging insulation products and methods of making and using same
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US10645808B2 (en) * 2018-02-22 2020-05-05 Apple Inc. Devices with radio-frequency printed circuits
US10455707B1 (en) 2018-08-10 2019-10-22 Apple Inc. Connection pad for embedded components in PCB packaging
CN109121285B (zh) * 2018-09-29 2020-05-26 维沃移动通信有限公司 一种电路板结构及电子设备
CN109348616B (zh) * 2018-11-28 2024-09-03 宁波舜宇光电信息有限公司 一种具有热传导结构的线路板及其制作方法
CN109688696A (zh) * 2019-01-04 2019-04-26 维沃移动通信有限公司 电路板装置、电路板装置的制作工艺及电子设备
KR102359904B1 (ko) 2019-09-16 2022-02-08 삼성전자주식회사 반도체 패키지
CN115917732A (zh) * 2020-08-12 2023-04-04 株式会社村田制作所 高频模块以及通信装置
US20230005822A1 (en) * 2021-07-01 2023-01-05 Hamilton Sundstrand Corporation Polyimide bonded bus bar for power device
EP4283662B1 (en) * 2022-05-23 2025-03-26 Hitachi Energy Ltd Method of attaching a terminal to a metal substrate structure for a semiconductor power module
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CN1176571A (zh) 1998-03-18
JP3198796B2 (ja) 2001-08-13
TW241438B (cg-RX-API-DMAC7.html) 1995-02-21
US5770300A (en) 1998-06-23
KR950002544A (ko) 1995-01-04

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