DE3909669C2 - - Google Patents
Info
- Publication number
- DE3909669C2 DE3909669C2 DE19893909669 DE3909669A DE3909669C2 DE 3909669 C2 DE3909669 C2 DE 3909669C2 DE 19893909669 DE19893909669 DE 19893909669 DE 3909669 A DE3909669 A DE 3909669A DE 3909669 C2 DE3909669 C2 DE 3909669C2
- Authority
- DE
- Germany
- Prior art keywords
- wafer
- station
- dev
- idx
- carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000576 coating method Methods 0.000 claims description 29
- 239000011248 coating agent Substances 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 23
- 230000008569 process Effects 0.000 claims description 21
- 238000012545 processing Methods 0.000 claims description 17
- 230000007246 mechanism Effects 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 7
- 235000012431 wafers Nutrition 0.000 description 98
- 238000011161 development Methods 0.000 description 15
- 230000018109 developmental process Effects 0.000 description 15
- 238000004140 cleaning Methods 0.000 description 9
- 238000010276 construction Methods 0.000 description 9
- 239000013256 coordination polymer Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 230000003749 cleanliness Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 239000008186 active pharmaceutical agent Substances 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 239000007888 film coating Substances 0.000 description 2
- 238000009501 film coating Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- LYKJEJVAXSGWAJ-UHFFFAOYSA-N compactone Natural products CC1(C)CCCC2(C)C1CC(=O)C3(O)CC(C)(CCC23)C=C LYKJEJVAXSGWAJ-UHFFFAOYSA-N 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6820288A JP2559617B2 (ja) | 1988-03-24 | 1988-03-24 | 基板処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE3909669A1 DE3909669A1 (de) | 1989-10-05 |
| DE3909669C2 true DE3909669C2 (enrdf_load_stackoverflow) | 1992-06-04 |
Family
ID=13366973
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19893909669 Granted DE3909669A1 (de) | 1988-03-24 | 1989-03-23 | Vorrichtung zur bearbeitung von werkstuecken |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2559617B2 (enrdf_load_stackoverflow) |
| DE (1) | DE3909669A1 (enrdf_load_stackoverflow) |
| GB (1) | GB2217107B (enrdf_load_stackoverflow) |
Families Citing this family (61)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2652894B2 (ja) * | 1989-11-22 | 1997-09-10 | キヤノン株式会社 | ウエハ搬送装置 |
| GB9006471D0 (en) * | 1990-03-22 | 1990-05-23 | Surface Tech Sys Ltd | Loading mechanisms |
| DE4024973C2 (de) * | 1990-08-07 | 1994-11-03 | Ibm | Anordnung zum Lagern, Transportieren und Einschleusen von Substraten |
| JP2697364B2 (ja) * | 1991-04-30 | 1998-01-14 | 株式会社村田製作所 | 熱処理システム |
| KR940003241B1 (ko) * | 1991-05-23 | 1994-04-16 | 금성일렉트론 주식회사 | To-220 반도체 제조기의 리드프레임 자동 공급장치 |
| DE4127341C2 (de) * | 1991-08-19 | 2000-03-09 | Leybold Ag | Vorrichtung zum selbsttätigen Gießen, Beschichten, Lackieren, Prüfen und Sortieren von Werkstücken |
| KR950001245Y1 (ko) * | 1991-09-13 | 1995-02-24 | 금성일렉트론 주식회사 | 핸들러의 디바이스 자동 송출장치 |
| DE4139549A1 (de) * | 1991-11-30 | 1993-06-03 | Leybold Ag | Vorrichtung fuer den transport von substraten |
| JPH0722490A (ja) * | 1993-06-30 | 1995-01-24 | Mitsubishi Electric Corp | ロット自動編成装置及び方法 |
| JP3069945B2 (ja) * | 1995-07-28 | 2000-07-24 | 東京エレクトロン株式会社 | 処理装置 |
| KR970023964A (ko) * | 1995-10-13 | 1997-05-30 | 김광호 | 반도체 제조용 스톡커의 트랜스퍼 이송장치 |
| US5734629A (en) * | 1995-12-28 | 1998-03-31 | Rimage Corporation | CD transporter |
| TW317644B (enrdf_load_stackoverflow) * | 1996-01-26 | 1997-10-11 | Tokyo Electron Co Ltd | |
| JP3218425B2 (ja) * | 1996-03-25 | 2001-10-15 | 東京エレクトロン株式会社 | 処理方法及び処理装置 |
| TW333658B (en) * | 1996-05-30 | 1998-06-11 | Tokyo Electron Co Ltd | The substrate processing method and substrate processing system |
| US6062798A (en) * | 1996-06-13 | 2000-05-16 | Brooks Automation, Inc. | Multi-level substrate processing apparatus |
| US6091498A (en) * | 1996-07-15 | 2000-07-18 | Semitool, Inc. | Semiconductor processing apparatus having lift and tilt mechanism |
| US6672820B1 (en) | 1996-07-15 | 2004-01-06 | Semitool, Inc. | Semiconductor processing apparatus having linear conveyer system |
| US6203582B1 (en) * | 1996-07-15 | 2001-03-20 | Semitool, Inc. | Modular semiconductor workpiece processing tool |
| US6645355B2 (en) | 1996-07-15 | 2003-11-11 | Semitool, Inc. | Semiconductor processing apparatus having lift and tilt mechanism |
| JP3779393B2 (ja) * | 1996-09-06 | 2006-05-24 | 東京エレクトロン株式会社 | 処理システム |
| TW353777B (en) * | 1996-11-08 | 1999-03-01 | Tokyo Electron Ltd | Treatment device |
| US6099643A (en) * | 1996-12-26 | 2000-08-08 | Dainippon Screen Mfg. Co., Ltd. | Apparatus for processing a substrate providing an efficient arrangement and atmospheric isolation of chemical treatment section |
| EP0918324B1 (en) * | 1997-11-21 | 2001-11-07 | TAPEMATIC S.p.A. | A machine for processing optical discs and method of transporting optical discs being processed thereby |
| DE19910478C2 (de) | 1998-03-12 | 2002-02-28 | Tokyo Electron Ltd | Substrattransportverfahren und Substratbearbeitungssystem |
| DE19964235B4 (de) * | 1998-03-12 | 2006-08-24 | Tokyo Electron Ltd. | Substrattransportvorrichtung |
| US6565729B2 (en) | 1998-03-20 | 2003-05-20 | Semitool, Inc. | Method for electrochemically depositing metal on a semiconductor workpiece |
| US6497801B1 (en) | 1998-07-10 | 2002-12-24 | Semitool Inc | Electroplating apparatus with segmented anode array |
| US6244931B1 (en) * | 1999-04-02 | 2001-06-12 | Applied Materials, Inc. | Buffer station on CMP system |
| US7585398B2 (en) | 1999-04-13 | 2009-09-08 | Semitool, Inc. | Chambers, systems, and methods for electrochemically processing microfeature workpieces |
| US7160421B2 (en) | 1999-04-13 | 2007-01-09 | Semitool, Inc. | Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| US7189318B2 (en) | 1999-04-13 | 2007-03-13 | Semitool, Inc. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| US6916412B2 (en) | 1999-04-13 | 2005-07-12 | Semitool, Inc. | Adaptable electrochemical processing chamber |
| JP4219562B2 (ja) | 1999-04-13 | 2009-02-04 | セミトゥール・インコーポレイテッド | ワークピースを電気化学的に処理するためのシステム |
| US7264698B2 (en) | 1999-04-13 | 2007-09-04 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
| US7020537B2 (en) | 1999-04-13 | 2006-03-28 | Semitool, Inc. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| US7438788B2 (en) | 1999-04-13 | 2008-10-21 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
| US7351314B2 (en) | 2003-12-05 | 2008-04-01 | Semitool, Inc. | Chambers, systems, and methods for electrochemically processing microfeature workpieces |
| US7351315B2 (en) | 2003-12-05 | 2008-04-01 | Semitool, Inc. | Chambers, systems, and methods for electrochemically processing microfeature workpieces |
| US6401324B1 (en) * | 2000-08-07 | 2002-06-11 | Toshiharu Tom Miyano | Machine tool assembly and method of performing machining operations using the machine tool assembly |
| JP3616748B2 (ja) * | 2000-11-07 | 2005-02-02 | 東京エレクトロン株式会社 | 現像処理方法，現像処理装置及び処理装置 |
| JP4180787B2 (ja) | 2000-12-27 | 2008-11-12 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
| EP1481114A4 (en) | 2001-08-31 | 2005-06-22 | Semitool Inc | DEVICE AND METHOD FOR ELECTROCHEMICAL PROCESSING OF MICROELECTRONIC WORKPIECES |
| DE10227213B4 (de) * | 2002-06-18 | 2004-07-22 | Asys Automatic Systems Gmbh & Co. Kg | Umsetzvorrichtung für Mikrosysteme |
| US7114903B2 (en) | 2002-07-16 | 2006-10-03 | Semitool, Inc. | Apparatuses and method for transferring and/or pre-processing microelectronic workpieces |
| US7077585B2 (en) | 2002-07-22 | 2006-07-18 | Yoshitake Ito | Developing method and apparatus for performing development processing properly and a solution processing method enabling enhanced uniformity in the processing |
| JP4414921B2 (ja) | 2005-03-23 | 2010-02-17 | 東京エレクトロン株式会社 | 塗布、現像装置及び塗布、現像方法 |
| DE102005039453B4 (de) * | 2005-08-18 | 2007-06-28 | Asys Automatic Systems Gmbh & Co. Kg | Bearbeitungsanlage modularen Aufbaus für flächige Substrate |
| JP4519037B2 (ja) * | 2005-08-31 | 2010-08-04 | 東京エレクトロン株式会社 | 加熱装置及び塗布、現像装置 |
| JP5006122B2 (ja) | 2007-06-29 | 2012-08-22 | 株式会社Ｓｏｋｕｄｏ | 基板処理装置 |
| JP4505005B2 (ja) * | 2007-09-28 | 2010-07-14 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| JP4505006B2 (ja) * | 2007-09-28 | 2010-07-14 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| JP4499147B2 (ja) * | 2007-11-21 | 2010-07-07 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| JP5128918B2 (ja) | 2007-11-30 | 2013-01-23 | 株式会社Ｓｏｋｕｄｏ | 基板処理装置 |
| JP5179170B2 (ja) | 2007-12-28 | 2013-04-10 | 株式会社Ｓｏｋｕｄｏ | 基板処理装置 |
| US8757026B2 (en) | 2008-04-15 | 2014-06-24 | Dynamic Micro Systems, Semiconductor Equipment Gmbh | Clean transfer robot |
| JP4887329B2 (ja) * | 2008-05-19 | 2012-02-29 | 東京エレクトロン株式会社 | 基板処理システム |
| JP5608148B2 (ja) * | 2011-11-25 | 2014-10-15 | 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ | 基板処理装置 |
| KR20190090064A (ko) * | 2011-12-22 | 2019-07-31 | 카티바, 인크. | 가스 엔클로저 시스템 |
| JP6058999B2 (ja) | 2012-12-11 | 2017-01-11 | 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ | 基板処理装置および基板処理方法 |
| US9245783B2 (en) | 2013-05-24 | 2016-01-26 | Novellus Systems, Inc. | Vacuum robot with linear translation carriage |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE375601C (de) * | 1923-05-15 | Claudius Dornier Dipl Ing | Flugboot mit Zugschraube | |
| JPS5619635A (en) * | 1979-07-27 | 1981-02-24 | Hitachi Ltd | Manufacturing apparatus |
| US4454003A (en) * | 1983-01-06 | 1984-06-12 | Systems Engineering & Manufacturing Corp. | Printed circuit board component conveyor apparatus and process |
| JPS6041045U (ja) * | 1983-08-26 | 1985-03-23 | 東京エレクトロン株式会社 | 半導体ウエハプロ−バ |
| JPS60162341A (ja) * | 1984-02-02 | 1985-08-24 | Fuji Photo Film Co Ltd | 電話番号用バ−コ−ド表示装置 |
| DE3681799D1 (de) * | 1985-01-22 | 1991-11-14 | Applied Materials Inc | Halbleiter-bearbeitungseinrichtung. |
| EP0244951B1 (en) * | 1986-04-04 | 1994-02-02 | Materials Research Corporation | Method and apparatus for handling and processing wafer like materials |
| CA1300357C (en) * | 1986-04-04 | 1992-05-12 | Materials Research Corporation | Method and apparatus for handling and processing wafer-like materials |
| US4806057A (en) * | 1986-04-22 | 1989-02-21 | Motion Manufacturing, Inc. | Automatic wafer loading method and apparatus |
| JPH0734426B2 (ja) * | 1986-06-25 | 1995-04-12 | 日本電気株式会社 | レジスト材の塗布現像装置 |
| JPH0230194B2 (ja) * | 1986-07-04 | 1990-07-04 | Kyanon Kk | Handotaiseizosochi |
| GB2194500B (en) * | 1986-07-04 | 1991-01-23 | Canon Kk | A wafer handling apparatus |
| FR2620049B2 (fr) * | 1986-11-28 | 1989-11-24 | Commissariat Energie Atomique | Procede de traitement, stockage et/ou transfert d'un objet dans une atmosphere de haute proprete, et conteneur pour la mise en oeuvre de ce procede |
| EP0322205A3 (en) * | 1987-12-23 | 1990-09-12 | Texas Instruments Incorporated | Automated photolithographic work cell |
-
1988
- 1988-03-24 JP JP6820288A patent/JP2559617B2/ja not_active Expired - Lifetime
-
1989
- 1989-03-23 GB GB8906751A patent/GB2217107B/en not_active Expired - Lifetime
- 1989-03-23 DE DE19893909669 patent/DE3909669A1/de active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| GB2217107A (en) | 1989-10-18 |
| JP2559617B2 (ja) | 1996-12-04 |
| DE3909669A1 (de) | 1989-10-05 |
| GB8906751D0 (en) | 1989-05-10 |
| JPH01241840A (ja) | 1989-09-26 |
| GB2217107B (en) | 1992-09-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OP8 | Request for examination as to paragraph 44 patent law | ||
| 8128 | New person/name/address of the agent |
Representative=s name: TIEDTKE, H., DIPL.-ING. BUEHLING, G., DIPL.-CHEM. |
|
| D2 | Grant after examination | ||
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |