DE3888607D1 - Verfahren und Vorrichtung um Lötkugeln auszurichten. - Google Patents
Verfahren und Vorrichtung um Lötkugeln auszurichten.Info
- Publication number
- DE3888607D1 DE3888607D1 DE88112127T DE3888607T DE3888607D1 DE 3888607 D1 DE3888607 D1 DE 3888607D1 DE 88112127 T DE88112127 T DE 88112127T DE 3888607 T DE3888607 T DE 3888607T DE 3888607 D1 DE3888607 D1 DE 3888607D1
- Authority
- DE
- Germany
- Prior art keywords
- solder balls
- aligning solder
- aligning
- balls
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910000679 solder Inorganic materials 0.000 title 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/11001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
- H01L2224/11003—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for holding or transferring the bump preform
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
- H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
- H01L2224/11334—Manufacturing methods by local deposition of the material of the bump connector in solid form using preformed bumps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/742—Apparatus for manufacturing bump connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0257—Brushing, e.g. cleaning the conductive pattern by brushing or wiping
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/041—Solder preforms in the shape of solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/082—Suction, e.g. for holding solder balls or components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S269/00—Work holders
- Y10S269/903—Work holder for electrical circuit assemblages or wiring systems
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62230406A JPH0795554B2 (ja) | 1987-09-14 | 1987-09-14 | はんだ球整列装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3888607D1 true DE3888607D1 (de) | 1994-04-28 |
DE3888607T2 DE3888607T2 (de) | 1994-06-30 |
Family
ID=16907384
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3888607T Expired - Fee Related DE3888607T2 (de) | 1987-09-14 | 1988-07-27 | Verfahren und Vorrichtung um Lötkugeln auszurichten. |
Country Status (5)
Country | Link |
---|---|
US (1) | US4871110A (de) |
EP (1) | EP0307591B1 (de) |
JP (1) | JPH0795554B2 (de) |
KR (1) | KR910004514B1 (de) |
DE (1) | DE3888607T2 (de) |
Families Citing this family (102)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR940004246B1 (ko) * | 1989-09-11 | 1994-05-19 | 신닛뽕 세이데쓰 가부시끼가이샤 | Tab 테이프와 반도체칩을 접속하는 방법 및 그것에 사용하는 범프시이트와 범프 부착 tab 테이프 |
JP2629435B2 (ja) * | 1990-10-17 | 1997-07-09 | 日本電気株式会社 | アレイ状光素子用サブ基板の作製方法 |
US5145104A (en) * | 1991-03-21 | 1992-09-08 | International Business Machines Corporation | Substrate soldering in a reducing atmosphere |
US5118027A (en) * | 1991-04-24 | 1992-06-02 | International Business Machines Corporation | Method of aligning and mounting solder balls to a substrate |
US5219117A (en) * | 1991-11-01 | 1993-06-15 | Motorola, Inc. | Method of transferring solder balls onto a semiconductor device |
US5205896A (en) * | 1992-02-03 | 1993-04-27 | Hughes Aircraft Company | Component and solder preform placement device and method of placement |
GB2269335A (en) * | 1992-08-04 | 1994-02-09 | Ibm | Solder particle deposition |
US5788143A (en) * | 1992-04-08 | 1998-08-04 | International Business Machines Corporation | Solder particle deposition |
US5284287A (en) * | 1992-08-31 | 1994-02-08 | Motorola, Inc. | Method for attaching conductive balls to a substrate |
JPH07122594A (ja) * | 1993-10-28 | 1995-05-12 | Hitachi Ltd | 導電性バンプの形成方法 |
JP3290788B2 (ja) * | 1993-12-14 | 2002-06-10 | 富士通株式会社 | プリント基板の半田膜形成装置 |
US5431332A (en) * | 1994-02-07 | 1995-07-11 | Motorola, Inc. | Method and apparatus for solder sphere placement using an air knife |
US5454159A (en) * | 1994-02-18 | 1995-10-03 | Unisys Corporation | Method of manufacturing I/O terminals on I/O pads |
US5657528A (en) * | 1994-08-25 | 1997-08-19 | Matsushita Electric Industrial Co., Ltd. | Method of transferring conductive balls |
US5551216A (en) * | 1994-09-14 | 1996-09-03 | Vanguard Automation, Inc. | Method and apparatus for filling a ball grid array |
JP3271461B2 (ja) * | 1995-02-07 | 2002-04-02 | 松下電器産業株式会社 | 半田ボールの搭載装置および搭載方法 |
US5620129A (en) * | 1995-02-17 | 1997-04-15 | Rogren; Philip E. | Device and method for forming and attaching an array of conductive balls |
US6939173B1 (en) | 1995-06-12 | 2005-09-06 | Fci Americas Technology, Inc. | Low cross talk and impedance controlled electrical connector with solder masses |
TW267265B (en) * | 1995-06-12 | 1996-01-01 | Connector Systems Tech Nv | Low cross talk and impedance controlled electrical connector |
JP3158966B2 (ja) * | 1995-06-19 | 2001-04-23 | 松下電器産業株式会社 | バンプ付電子部品の製造装置および製造方法 |
US5685477A (en) * | 1995-06-28 | 1997-11-11 | Intel Corporation | Method for attaching and handling conductive spheres to a substrate |
US5899376A (en) * | 1995-07-11 | 1999-05-04 | Nippon Steel Corporation | Transfer of flux onto electrodes and production of bumps on electrodes |
JP3120714B2 (ja) * | 1995-10-31 | 2000-12-25 | 松下電器産業株式会社 | 導電性ボールの搭載装置 |
US5687901A (en) * | 1995-11-14 | 1997-11-18 | Nippon Steel Corporation | Process and apparatus for forming ball bumps |
US6099935A (en) * | 1995-12-15 | 2000-08-08 | International Business Machines Corporation | Apparatus for providing solder interconnections to semiconductor and electronic packaging devices |
US5782399A (en) * | 1995-12-22 | 1998-07-21 | Tti Testron, Inc. | Method and apparatus for attaching spherical and/or non-spherical contacts to a substrate |
US5816482A (en) * | 1996-04-26 | 1998-10-06 | The Whitaker Corporation | Method and apparatus for attaching balls to a substrate |
US6093035A (en) * | 1996-06-28 | 2000-07-25 | Berg Technology, Inc. | Contact for use in an electrical connector |
US6024584A (en) * | 1996-10-10 | 2000-02-15 | Berg Technology, Inc. | High density connector |
US5762258A (en) * | 1996-07-23 | 1998-06-09 | International Business Machines Corporation | Method of making an electronic package having spacer elements |
US6063701A (en) * | 1996-09-14 | 2000-05-16 | Ricoh Company, Ltd. | Conductive particle transferring method |
SG71046A1 (en) | 1996-10-10 | 2000-03-21 | Connector Systems Tech Nv | High density connector and method of manufacture |
US6042389A (en) * | 1996-10-10 | 2000-03-28 | Berg Technology, Inc. | Low profile connector |
US6241535B1 (en) | 1996-10-10 | 2001-06-05 | Berg Technology, Inc. | Low profile connector |
US6139336A (en) | 1996-11-14 | 2000-10-31 | Berg Technology, Inc. | High density connector having a ball type of contact surface |
KR19980069992A (ko) * | 1997-01-20 | 1998-10-26 | 사와무라시코우 | 광 반도체 장치와 지지기판의 복합 유니트 및 광 반도체 장치를지지기판 상에 실장하기 위한 방법 |
US5839191A (en) * | 1997-01-24 | 1998-11-24 | Unisys Corporation | Vibrating template method of placing solder balls on the I/O pads of an integrated circuit package |
US6230963B1 (en) * | 1997-01-28 | 2001-05-15 | Eric L. Hertz | Method and apparatus using colored foils for placing conductive preforms |
US6412685B2 (en) | 1997-01-28 | 2002-07-02 | Galahad, Co. | Method and apparatus for release and optional inspection for conductive preforms placement apparatus |
US6202918B1 (en) * | 1997-01-28 | 2001-03-20 | Eric Hertz | Method and apparatus for placing conductive preforms |
US6571007B1 (en) * | 1997-01-30 | 2003-05-27 | Nippon Steel Corporation | Ball-arranging substrate for forming bump, ball-arranging head, ball-arranging device, and ball-arranging method |
US6641030B1 (en) | 1997-02-06 | 2003-11-04 | Speedline Technologies, Inc. | Method and apparatus for placing solder balls on a substrate |
US6056190A (en) * | 1997-02-06 | 2000-05-02 | Speedline Technologies, Inc. | Solder ball placement apparatus |
US5921458A (en) * | 1997-06-25 | 1999-07-13 | Fan; Kuang-Shu | Integrated circuit solder ball implant machine |
US6126063A (en) * | 1997-08-14 | 2000-10-03 | Lsi Logic Corporation | Integrated circuit packaging apparatus and method |
DE19838532B4 (de) * | 1997-08-28 | 2005-09-22 | Pac Tech - Packaging Technologies Gmbh | Verfahren und Vorrichtung zum Plazieren und Umschmelzen von Lotmaterialformstücken |
FR2768262B1 (fr) * | 1997-09-05 | 2000-07-13 | Matra Marconi Space France | Boitier a microcircuit integre et procede de montage de microcircuit integre |
US6107181A (en) | 1997-09-08 | 2000-08-22 | Fujitsu Limited | Method of forming bumps and template used for forming bumps |
IT1296027B1 (it) * | 1997-09-10 | 1999-06-04 | Sgs Thomson Microelectronics | Sistema di disposizione di uno schieramento ordinato di sfere di lega eutectica di saldatura su una scheda-supporto di un circuito |
US6320158B1 (en) | 1998-01-29 | 2001-11-20 | Fujitsu Limited | Method and apparatus of fabricating perforated plate |
US6143374A (en) * | 1998-02-04 | 2000-11-07 | E. I. Du Pont De Nemours And Company | Method for precise placement of an array of single particles on a surface |
US6237219B1 (en) * | 1998-03-05 | 2001-05-29 | Matsushita Electric Industrial Co., Ltd. | Method of mounting conductive ball |
SG74729A1 (en) * | 1998-05-29 | 2000-08-22 | Hitachi Ltd | Method of forming bumps |
US6869008B2 (en) | 1998-05-29 | 2005-03-22 | Hitachi, Ltd. | Method of forming bumps |
US6402014B1 (en) | 1998-05-29 | 2002-06-11 | Hitachi, Ltd. | Method of forming bumps |
WO2000011921A1 (de) * | 1998-08-25 | 2000-03-02 | Pac Tech - Packaging Technologies Gmbh | Verfahren und vorrichtung zum plazieren und umschmelzen von lotmaterialformstücken |
US6100175A (en) * | 1998-08-28 | 2000-08-08 | Micron Technology, Inc. | Method and apparatus for aligning and attaching balls to a substrate |
US7003874B1 (en) * | 1998-09-03 | 2006-02-28 | Micron Technology, Inc. | Methods of bonding solder balls to bond pads on a substrate |
US6595408B1 (en) * | 1998-10-07 | 2003-07-22 | Micron Technology, Inc. | Method of attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux prior to placement |
US6268275B1 (en) | 1998-10-08 | 2001-07-31 | Micron Technology, Inc. | Method of locating conductive spheres utilizing screen and hopper of solder balls |
US6325272B1 (en) | 1998-10-09 | 2001-12-04 | Robotic Vision Systems, Inc. | Apparatus and method for filling a ball grid array |
JP3503523B2 (ja) * | 1999-04-09 | 2004-03-08 | 千住金属工業株式会社 | はんだボールおよびはんだボールの被覆方法 |
US6227437B1 (en) | 1999-08-24 | 2001-05-08 | Kulicke & Soffa Industries Inc. | Solder ball delivery and reflow apparatus and method of using the same |
US6386433B1 (en) | 1999-08-24 | 2002-05-14 | Kulicke & Soffa Investments, Inc. | Solder ball delivery and reflow apparatus and method |
JP3552610B2 (ja) * | 1999-10-22 | 2004-08-11 | 松下電器産業株式会社 | 導電性ボールの移載装置および移載方法並びに導電性ボールの供給装置および供給方法 |
US6484927B1 (en) * | 1999-11-05 | 2002-11-26 | Delaware Capital Formation Corporation | Method and apparatus for balling and assembling ball grid array and chip scale array packages |
JP4347487B2 (ja) * | 2000-01-25 | 2009-10-21 | ジャパン・イー・エム株式会社 | 微小球体整列方法およびその装置 |
SG97164A1 (en) | 2000-09-21 | 2003-07-18 | Micron Technology Inc | Individual selective rework of defective bga solder balls |
JP4130526B2 (ja) * | 2000-11-10 | 2008-08-06 | 株式会社日立製作所 | バンプ形成方法およびその装置 |
US7285486B2 (en) * | 2001-01-12 | 2007-10-23 | Nippon Steel Materials Co., Ltd. | Ball transferring method and apparatus |
DE10133791B4 (de) * | 2001-07-16 | 2007-04-19 | Infineon Technologies Ag | Verfahren zur Herstellung eines elektronischen Bauteils |
JP4607390B2 (ja) * | 2001-08-28 | 2011-01-05 | 九州日立マクセル株式会社 | 半田ボール吸着用マスクおよびその製造方法 |
US20040140591A1 (en) * | 2003-01-17 | 2004-07-22 | Zaher Faraj | Heat applied melted-on faceted beads |
US7537461B2 (en) * | 2003-07-16 | 2009-05-26 | Gryphics, Inc. | Fine pitch electrical interconnect assembly |
WO2005011060A2 (en) * | 2003-07-16 | 2005-02-03 | Gryphics, Inc. | Electrical interconnect assembly with interlocking contact system |
US7297003B2 (en) * | 2003-07-16 | 2007-11-20 | Gryphics, Inc. | Fine pitch electrical interconnect assembly |
US7078821B2 (en) * | 2003-08-27 | 2006-07-18 | Texas Instruments Incorporated | Ball film for integrated circuit fabrication and testing |
JP4212992B2 (ja) * | 2003-09-03 | 2009-01-21 | Tdk株式会社 | 半田ボールの供給方法および供給装置 |
FR2860177B1 (fr) * | 2003-09-26 | 2007-03-02 | Novatec | Procede et dispositif de prehension de billes a partir d'un conditionnement en vrac |
JP2005328017A (ja) * | 2004-04-16 | 2005-11-24 | Hitachi Metals Ltd | 導電性粒子の配列装置 |
DE102004051983B3 (de) * | 2004-10-25 | 2006-04-27 | Pac Tech - Packaging Technologies Gmbh | Verfahren und Vorrichtung zum Transfer einer Lotdepotanordnung |
JP4956609B2 (ja) | 2006-03-20 | 2012-06-20 | グリフィクス インコーポレーティッド | ファインピッチ電気接続アセンブリのための複合端子 |
DE102007004253A1 (de) * | 2007-01-23 | 2008-07-31 | Suss Microtec Test Systems Gmbh | Verfahren und Vorrichtung zur Korrektur fehlerhafter Solder-Bump-Arrays |
US20080308612A1 (en) * | 2007-06-15 | 2008-12-18 | Best Inc. | Manual method for reballing using a solder preform |
WO2009144846A1 (ja) * | 2008-05-30 | 2009-12-03 | イビデン株式会社 | 半田ボール搭載方法 |
DE102009013826A1 (de) | 2009-03-18 | 2011-03-10 | Michalk, Manfred, Dr. | Schaltungsanordnung, Verfahren zum elektrischen und/oder mechanischen Verbinden und Vorrichtung zum Aufbringen von Verbindungselementen |
US8366485B2 (en) | 2009-03-19 | 2013-02-05 | Fci Americas Technology Llc | Electrical connector having ribbed ground plate |
US8813350B2 (en) | 2011-06-03 | 2014-08-26 | Seagate Technology Llc | Solder ball pattern forming |
EP2624034A1 (de) | 2012-01-31 | 2013-08-07 | Fci | Abbaubare optische Kupplungsvorrichtung |
US8944831B2 (en) | 2012-04-13 | 2015-02-03 | Fci Americas Technology Llc | Electrical connector having ribbed ground plate with engagement members |
USD727852S1 (en) | 2012-04-13 | 2015-04-28 | Fci Americas Technology Llc | Ground shield for a right angle electrical connector |
USD727268S1 (en) | 2012-04-13 | 2015-04-21 | Fci Americas Technology Llc | Vertical electrical connector |
US9257778B2 (en) | 2012-04-13 | 2016-02-09 | Fci Americas Technology | High speed electrical connector |
USD718253S1 (en) | 2012-04-13 | 2014-11-25 | Fci Americas Technology Llc | Electrical cable connector |
US9543703B2 (en) | 2012-07-11 | 2017-01-10 | Fci Americas Technology Llc | Electrical connector with reduced stack height |
USD751507S1 (en) | 2012-07-11 | 2016-03-15 | Fci Americas Technology Llc | Electrical connector |
USD745852S1 (en) | 2013-01-25 | 2015-12-22 | Fci Americas Technology Llc | Electrical connector |
USD720698S1 (en) | 2013-03-15 | 2015-01-06 | Fci Americas Technology Llc | Electrical cable connector |
US8955735B2 (en) * | 2013-05-17 | 2015-02-17 | Zen Voce Corporation | Method for enhancing the yield rate of ball implanting of a substrate of an integrated circuit |
US9120170B2 (en) * | 2013-11-01 | 2015-09-01 | Zen Voce Corporation | Apparatus and method for placing and mounting solder balls on an integrated circuit substrate |
KR20150097841A (ko) * | 2014-02-17 | 2015-08-27 | 삼성전자주식회사 | 솔더 볼 부착 장치 및 플럭스 도팅 장치 |
US11247285B1 (en) * | 2020-04-03 | 2022-02-15 | Seagate Technology Llc | Fluidization of agglomerated solder microspheres |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3320658A (en) * | 1964-06-26 | 1967-05-23 | Ibm | Method of making electrical connectors and connections |
US3355078A (en) * | 1964-11-23 | 1967-11-28 | Bunker Ramo | Apparatus for assembling electrical components |
JPS5263672A (en) * | 1975-11-20 | 1977-05-26 | Matsushita Electric Ind Co Ltd | Production of semiconductor device |
JPS52115176A (en) * | 1976-03-24 | 1977-09-27 | Hitachi Ltd | Ball soldering method |
US4209893A (en) * | 1978-10-24 | 1980-07-01 | The Bendix Corporation | Solder pack and method of manufacture thereof |
JPS5586679A (en) * | 1978-12-25 | 1980-06-30 | Nippon Arumitsuto Kk | Method and apparatus for continuous soldering |
JPS5824037B2 (ja) * | 1980-05-26 | 1983-05-18 | 富士通株式会社 | 導体ボ−ル配列方法 |
JPS5715437A (en) * | 1980-07-02 | 1982-01-26 | Hitachi Ltd | Positioning mechanism and pellet feeder with positioning mechanism |
EP0082902B1 (de) * | 1981-12-29 | 1985-11-27 | International Business Machines Corporation | Verfahren zum Anlöten von Stiften an Lötaugen von auf einem keramischen Substrat ausgebildeten Leitern |
JPS6072663A (ja) * | 1983-09-28 | 1985-04-24 | Fujitsu Ltd | 低融点金属球接続方法 |
JPS61242759A (ja) * | 1985-04-19 | 1986-10-29 | Hitachi Ltd | 成形はんだ塔載装置 |
-
1987
- 1987-09-14 JP JP62230406A patent/JPH0795554B2/ja not_active Expired - Lifetime
-
1988
- 1988-07-22 KR KR1019880009243A patent/KR910004514B1/ko not_active IP Right Cessation
- 1988-07-26 US US07/224,355 patent/US4871110A/en not_active Expired - Lifetime
- 1988-07-27 DE DE3888607T patent/DE3888607T2/de not_active Expired - Fee Related
- 1988-07-27 EP EP88112127A patent/EP0307591B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0307591A3 (en) | 1990-10-03 |
EP0307591A2 (de) | 1989-03-22 |
US4871110A (en) | 1989-10-03 |
JPH0795554B2 (ja) | 1995-10-11 |
DE3888607T2 (de) | 1994-06-30 |
KR910004514B1 (ko) | 1991-07-05 |
KR890006132A (ko) | 1989-05-18 |
JPS6473625A (en) | 1989-03-17 |
EP0307591B1 (de) | 1994-03-23 |
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