KR890006132A - 땜납구의 정렬방법 및 장치 - Google Patents

땜납구의 정렬방법 및 장치 Download PDF

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KR890006132A
KR890006132A KR1019880009243A KR880009243A KR890006132A KR 890006132 A KR890006132 A KR 890006132A KR 1019880009243 A KR1019880009243 A KR 1019880009243A KR 880009243 A KR880009243 A KR 880009243A KR 890006132 A KR890006132 A KR 890006132A
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solder
hole
plate
alignment
alignment plate
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KR910004514B1 (ko
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히데유끼 후까사와
마모루 고바야시
마시히로 와나미
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미다 가쓰시게
가부시끼가이샤 히다찌세이사꾸쇼
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/11001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
    • H01L2224/11003—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for holding or transferring the bump preform
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/11334—Manufacturing methods by local deposition of the material of the bump connector in solid form using preformed bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/742—Apparatus for manufacturing bump connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0257—Brushing, e.g. cleaning the conductive pattern by brushing or wiping
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    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H—ELECTRICITY
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S269/00—Work holders
    • Y10S269/903—Work holder for electrical circuit assemblages or wiring systems

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  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)

Abstract

내용 없음

Description

땜납구의 정렬방법 및 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1 도와 제 2 도는 본 발명의 일 구현예를 설명하기 위해 사용된 개략 단면도.
제 1 도는 공기흡입에 의해 정렬된 땜납구를 보여주는 단면도.
제 2 도는 여분의 구 제거작업을 보여주는 단면도.
* 도면의 주요부분에 대한 부호의 설명
1 : 정렬판 2 : 하부판
3 : 상부판 4, 5 : 관통공
6 : 정렬관고정블럭 7 : 개구부
8 : 공기홉입노즐 9 : 땜납납구
10 : 브러쉬 11 : 회로기판

Claims (13)

  1. 땜납구의 정렬방법에 있어서, 이 방법은 : 정렬 형성된 관통공을 가지는 정렬판 위에 땜납구를 공급하고 ; 그리고 상기 정렬판의 바닥으로부터 땜납구를 상기 관통공에로 적합 및 유입하여, 땜납구를 정렬하기 위해 공기를 흡입하는 ; 단계로 구성되어 있는 땜납구 정렬방법.
  2. 제 1 항에 있어서, 상기 정렬판은 유리로 구성되어 있는 땜납구 정렬방법.
  3. 제 1 항에 있어서, 상기 정렬판은 감광성 유리로 구성되어 있는 땜납구 정렬방법.
  4. 제 1 항에 있어서, 상기 정렬판은 세라믹으로 구성되어 있는 땜납구 정렬방법.
  5. 제 1 항에 있어서, 이 방법은 : 상기 정렬판은 상부판과 하부판을 구성하는 2개의 판과, 정렬위치에 대응하는 상기 하부판의 위치에서 열려져 정렬되어지는 땜납구의 외경보다 작은 지름을 가지는 관통공, 상기하부판에서 열린 상기 관통공에 대응하여 상기 상부판의 위치에서 열려지는 땜남구의 외경보다 약간 커다란 지름을 가지는 관통공으로 구성되고 ; 상기 정렬판은 정렬판고정블럭에 고정되어 있고, 상기 정렬판고정블럭은 공기흡입노즐에 연결되어 있고 ; 그리고 상기 방법은 : 상기 정렬판 위에 땜납구를 공급하고 ; 상기 흡입노즐의 사용에 위하여 공기를 흡입하고 ; 땜납구의 외경보다 약간 커다란 지름을 가지는 관통공으로 상기 정렬판 위에 존재하는 땜납구를 유입하여 적합하고 ; 그리고 땜납구를 정렬하기 위한 땜납구의 외경보다 작은 지름을 가지는 관통공에로 땜납구를 위치하고 유입하는 : 단계로 구성된 땜납구 정렬방법.
  6. 땜납구의 정렬장치에 있어서, 이 장치는 : 공급되어지는 땜납구를 정렬하는 관통공을 정렬 형성하는 정렬판 ; 상기 정렬판을 고정하는 정렬판고정블럭 ; 상기 정렬고정블럭에 연결되는 공기흡입노즐 ; 을 포함하는 땜납구 정렬장치.
  7. 제 6 항에 있어서, 상기 정렬판은 상하부판을 포함하는 2개의 판으로 구성되고 ; 하부판에는, 정렬되어 지는 땜납구의 외경보다 작은 지름을 가지는 관통공은 정렬위치에 대응하는 상기 하부판의 위치에서 열려져 있고 ; 상부판에서, 상기 관통공에 대응해서 땜납구의 외경보다 약간 큰 지름을 가지는 관통공의 상기 하부판에 열린 상기 관통공에 대응하는 상기 상부판의 위치에서 열려있는 ; 땜납구 정렬장치.
  8. 제 6 항에 있어서, 상기 정렬판은 유리로 구성되어 있는 땜납구 정렬장치.
  9. 제 6 항에 있어서, 상기 정렬판이 감광성 유리로 구성되어 있는 땜납구 정렬장치.
  10. 제 6 항에 있어서, 상기 정렬판이 세라믹으로 구성되어 있는 땜납구 정렬장치.
  11. 제 7 항에 있어서, 정렬판을 구성하는 하부판 및 상부관을 포함하는 2개의 판이 유리로 구성되어 있는 땜납구 정렬장치.
  12. 제 7 항에 있어서, 정렬판을 구성하는 하부판 및 상부판을 포함하는 2개의 판이 감광성 유리로 구성되어 있는 땜납구 정렬장치.
  13. 제 7 항에 있어서, 정렬판을 구성하는 하부판 및 상부판을 포함하는 3개의 판이 세라믹으로 구성되어 있는 땜납구 정렬장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019880009243A 1987-09-14 1988-07-22 땜납구의 정렬방법 및 장치 KR910004514B1 (ko)

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JP87-230406 1987-09-14
JP62230406A JPH0795554B2 (ja) 1987-09-14 1987-09-14 はんだ球整列装置
JP62-230406 1987-09-14

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KR890006132A true KR890006132A (ko) 1989-05-18
KR910004514B1 KR910004514B1 (ko) 1991-07-05

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US (1) US4871110A (ko)
EP (1) EP0307591B1 (ko)
JP (1) JPH0795554B2 (ko)
KR (1) KR910004514B1 (ko)
DE (1) DE3888607T2 (ko)

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EP0307591A2 (en) 1989-03-22
EP0307591B1 (en) 1994-03-23
DE3888607D1 (de) 1994-04-28
EP0307591A3 (en) 1990-10-03
US4871110A (en) 1989-10-03
JPS6473625A (en) 1989-03-17
JPH0795554B2 (ja) 1995-10-11
DE3888607T2 (de) 1994-06-30
KR910004514B1 (ko) 1991-07-05

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